DE60313715D1 - Herstellungsverfahren für flexible MEMS-Wandler - Google Patents

Herstellungsverfahren für flexible MEMS-Wandler

Info

Publication number
DE60313715D1
DE60313715D1 DE60313715T DE60313715T DE60313715D1 DE 60313715 D1 DE60313715 D1 DE 60313715D1 DE 60313715 T DE60313715 T DE 60313715T DE 60313715 T DE60313715 T DE 60313715T DE 60313715 D1 DE60313715 D1 DE 60313715D1
Authority
DE
Germany
Prior art keywords
manufacturing
flexible mems
mems converters
converters
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60313715T
Other languages
English (en)
Other versions
DE60313715T2 (de
Inventor
Yun-Woo Nam
Suk-Han Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE60313715D1 publication Critical patent/DE60313715D1/de
Publication of DE60313715T2 publication Critical patent/DE60313715T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00142—Bridges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/081—Shaping or machining of piezoelectric or electrostrictive bodies by coating or depositing using masks, e.g. lift-off
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/304—Beam type
    • H10N30/306—Cantilevers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/308—Membrane type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)
DE60313715T 2002-09-26 2003-09-23 Herstellungsverfahren für flexible MEMS-Wandler Expired - Lifetime DE60313715T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2002-0058316A KR100512988B1 (ko) 2002-09-26 2002-09-26 플렉서블 ｍｅｍｓ 트랜스듀서 제조방법
KR2002058316 2002-09-26

Publications (2)

Publication Number Publication Date
DE60313715D1 true DE60313715D1 (de) 2007-06-21
DE60313715T2 DE60313715T2 (de) 2008-01-24

Family

ID=31973684

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60313715T Expired - Lifetime DE60313715T2 (de) 2002-09-26 2003-09-23 Herstellungsverfahren für flexible MEMS-Wandler

Country Status (6)

Country Link
US (1) US7151057B2 (de)
EP (1) EP1403214B1 (de)
JP (1) JP4126004B2 (de)
KR (1) KR100512988B1 (de)
CN (1) CN1262470C (de)
DE (1) DE60313715T2 (de)

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US7434476B2 (en) * 2003-05-07 2008-10-14 Califronia Institute Of Technology Metallic thin film piezoresistive transduction in micromechanical and nanomechanical devices and its application in self-sensing SPM probes
US20050263903A1 (en) * 2003-08-30 2005-12-01 Visible Tech-Knowledgy, Inc. Method for pattern metalization of substrates
WO2005022966A2 (en) * 2003-08-30 2005-03-10 Visible Tech-Knowledgy, Inc. A method for pattern metalization of substrates
US7585424B2 (en) * 2005-01-18 2009-09-08 Hewlett-Packard Development Company, L.P. Pattern reversal process for self aligned imprint lithography and device
WO2006098876A2 (en) 2005-03-11 2006-09-21 The Trustees Of Boston College Microstructures, microdevices and related methods
KR100634488B1 (ko) * 2005-08-24 2006-10-16 드림 소닉 테크놀러지 리미티드 필름스피커의 접점구조
US7838321B2 (en) * 2005-12-20 2010-11-23 Xerox Corporation Multiple stage MEMS release for isolation of similar materials
KR100737732B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
KR100836193B1 (ko) * 2006-07-20 2008-06-09 주식회사 엠에스솔루션 압전형 마이크로폰
JP4271253B2 (ja) * 2006-10-11 2009-06-03 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡
JP4328981B2 (ja) * 2007-01-25 2009-09-09 セイコーエプソン株式会社 圧電振動子の製造方法
WO2009017718A2 (en) * 2007-07-27 2009-02-05 Kenneth Wargon Flexible sheet audio-video device
KR100963296B1 (ko) * 2008-07-11 2010-06-11 주식회사 비에스이 가변 지향성 마이크로폰 조립체 및 그 제조방법
US20100065930A1 (en) * 2008-09-18 2010-03-18 Rohm Co., Ltd. Method of etching sacrificial layer, method of manufacturing MEMS device, MEMS device and MEMS sensor
KR101561663B1 (ko) 2009-08-31 2015-10-21 삼성전자주식회사 피스톤 다이어프램을 가진 압전형 마이크로 스피커 및 그 제조 방법
KR101322687B1 (ko) * 2009-11-05 2013-10-30 한양대학교 에리카산학협력단 전도성 폴리머 패터닝 방법
US9297068B2 (en) * 2012-03-07 2016-03-29 The Boeing Company Wear parts having coating run-out and methods of producing same
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
KR101395264B1 (ko) * 2012-10-31 2014-05-15 울산대학교 산학협력단 완화형 강유전 고분자를 이용한 초음파 변환기
CN103618044B (zh) * 2013-11-29 2018-12-18 上海集成电路研发中心有限公司 压电悬臂梁传感器结构制造方法
CN106536403B8 (zh) 2014-05-28 2019-08-20 3M创新有限公司 柔性基底上的微机电系统装置
KR101714713B1 (ko) * 2015-09-23 2017-03-09 숭실대학교산학협력단 센서 결합형 액추에이터 햅틱 소자와 그 제작방법
US10770646B2 (en) * 2016-03-01 2020-09-08 Qualcomm Incorporated Manufacturing method for flexible PMUT array
CN108122790B (zh) 2016-11-29 2020-12-18 中芯国际集成电路制造(上海)有限公司 半导体装置及其制造方法
CN109474254B (zh) 2018-10-31 2020-12-08 武汉衍熙微器件有限公司 一种声波器件及其制作方法
EP3651479B1 (de) 2018-11-08 2022-06-01 Usound GmbH Herstellungsverfahren für zumindest eine membraneinheit eines mems-wandlers
DE102019116080A1 (de) 2019-06-13 2020-12-17 USound GmbH MEMS-Schallwandler mit einer aus Polymer ausgebildeten Membran
DE102019124595A1 (de) 2019-09-12 2021-03-18 USound GmbH Verfahren zum Herstellen einer Wandlereinheit

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JPS61239678A (ja) * 1985-04-16 1986-10-24 Mitsubishi Electric Corp 光電変換装置
JPH0563171A (ja) * 1991-08-30 1993-03-12 Kyocera Corp 光電変換素子の製造方法
JPH07254568A (ja) * 1994-01-28 1995-10-03 Toray Ind Inc アモルファスシリコン−ゲルマニウム膜およびその製造方法
US5914507A (en) * 1994-05-11 1999-06-22 Regents Of The University Of Minnesota PZT microdevice
JPH08205273A (ja) 1995-01-24 1996-08-09 Mitsubishi Electric Corp 骨伝導音声振動検出素子および骨伝導音声振動検出装置
US5789264A (en) * 1996-03-27 1998-08-04 Daewoo Electronics Co., Ltd. Method for manufacturing a thin film actuated mirror having a flat light reflecting surface
US6071819A (en) 1997-01-24 2000-06-06 California Institute Of Technology Flexible skin incorporating mems technology
US5834975A (en) * 1997-03-12 1998-11-10 Rockwell Science Center, Llc Integrated variable gain power amplifier and method
US6362542B1 (en) * 1997-08-15 2002-03-26 Seagate Technology Llc Piezoelectric microactuator for precise head positioning
US6245444B1 (en) * 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
GB9819821D0 (en) * 1998-09-12 1998-11-04 Secr Defence Improvements relating to micro-machining
JP2001085075A (ja) * 1999-09-10 2001-03-30 Hitachi Maxell Ltd 光電変換素子及びその製造方法
US6359374B1 (en) * 1999-11-23 2002-03-19 Mcnc Miniature electrical relays using a piezoelectric thin film as an actuating element
JP2001250963A (ja) * 2000-03-03 2001-09-14 Tdk Corp 太陽電池
US6677709B1 (en) * 2000-07-18 2004-01-13 General Electric Company Micro electromechanical system controlled organic led and pixel arrays and method of using and of manufacturing same
KR20020016117A (ko) * 2000-08-24 2002-03-04 신현준 Ｍｅｍｓ 공정을 이용한 마이크로폰 제작방법
US6515402B2 (en) * 2001-01-24 2003-02-04 Koninklijke Philips Electronics N.V. Array of ultrasound transducers
KR100512960B1 (ko) 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 ｍｅｍｓ 무선 마이크로폰

Also Published As

Publication number Publication date
US7151057B2 (en) 2006-12-19
EP1403214B1 (de) 2007-05-09
EP1403214A2 (de) 2004-03-31
JP4126004B2 (ja) 2008-07-30
KR20040026758A (ko) 2004-04-01
CN1517295A (zh) 2004-08-04
DE60313715T2 (de) 2008-01-24
JP2004120764A (ja) 2004-04-15
EP1403214A3 (de) 2005-09-14
KR100512988B1 (ko) 2005-09-07
US20040147132A1 (en) 2004-07-29
CN1262470C (zh) 2006-07-05

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