DE60316122D1 - Mikroelektromechanisches Bauteil und Herstellungsverfahren für ein mikroelektromechanisches Bauteil - Google Patents

Mikroelektromechanisches Bauteil und Herstellungsverfahren für ein mikroelektromechanisches Bauteil

Info

Publication number
DE60316122D1
DE60316122D1 DE60316122T DE60316122T DE60316122D1 DE 60316122 D1 DE60316122 D1 DE 60316122D1 DE 60316122 T DE60316122 T DE 60316122T DE 60316122 T DE60316122 T DE 60316122T DE 60316122 D1 DE60316122 D1 DE 60316122D1
Authority
DE
Germany
Prior art keywords
microelectromechanical component
manufacturing
microelectromechanical
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60316122T
Other languages
English (en)
Other versions
DE60316122T2 (de
Inventor
Eric L Nikkel
Mickey Szepesi
Sadiq Bengali
Michael G Monroe
Stephen J Potochnik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of DE60316122D1 publication Critical patent/DE60316122D1/de
Application granted granted Critical
Publication of DE60316122T2 publication Critical patent/DE60316122T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
    • B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
    • B81C1/00801—Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0181—See-saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0714—Forming the micromechanical structure with a CMOS process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0757—Topology for facilitating the monolithic integration
    • B81C2203/0771—Stacking the electronic processing unit and the micromechanical structure
DE60316122T 2003-06-03 2003-12-18 Mikroelektromechanisches Bauteil und Herstellungsverfahren für ein mikroelektromechanisches Bauteil Expired - Lifetime DE60316122T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US454423 2003-06-03
US10/454,423 US6917459B2 (en) 2003-06-03 2003-06-03 MEMS device and method of forming MEMS device

Publications (2)

Publication Number Publication Date
DE60316122D1 true DE60316122D1 (de) 2007-10-18
DE60316122T2 DE60316122T2 (de) 2008-05-29

Family

ID=33159550

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60316122T Expired - Lifetime DE60316122T2 (de) 2003-06-03 2003-12-18 Mikroelektromechanisches Bauteil und Herstellungsverfahren für ein mikroelektromechanisches Bauteil

Country Status (8)

Country Link
US (1) US6917459B2 (de)
EP (1) EP1484281B1 (de)
JP (1) JP3980571B2 (de)
KR (1) KR101043460B1 (de)
CN (1) CN1572719B (de)
DE (1) DE60316122T2 (de)
SG (1) SG115612A1 (de)
TW (1) TWI225845B (de)

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Also Published As

Publication number Publication date
US6917459B2 (en) 2005-07-12
TWI225845B (en) 2005-01-01
KR20040104408A (ko) 2004-12-10
JP2004358654A (ja) 2004-12-24
US20040245588A1 (en) 2004-12-09
TW200427621A (en) 2004-12-16
EP1484281A1 (de) 2004-12-08
DE60316122T2 (de) 2008-05-29
KR101043460B1 (ko) 2011-06-23
CN1572719A (zh) 2005-02-02
JP3980571B2 (ja) 2007-09-26
CN1572719B (zh) 2010-09-29
SG115612A1 (en) 2005-10-28
EP1484281B1 (de) 2007-09-05

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Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., , TW