JP2004358654A - Mems素子およびmems素子を形成する方法 - Google Patents
Mems素子およびmems素子を形成する方法 Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
- B81C1/00801—Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0181—See-saws
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0714—Forming the micromechanical structure with a CMOS process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0757—Topology for facilitating the monolithic integration
- B81C2203/0771—Stacking the electronic processing unit and the micromechanical structure
Abstract
駆動回路を効率的に一体化させたMEMS素子と、その製造方法を提供すること。
【解決手段】
ベース材料(210)と該ベース材料の第1の表面に形成された少なくとも1つの導電層(220)とを含む下部構造(200)を設けるステップと、下部構造の少なくとも1つの導電層の上に誘電体層(250)を形成するステップと、誘電体層の上に保護層を形成するステップと、保護層の上にMEMS素子としての電気的コンタクトエリアを画定するステップと、電気的コンタクトエリア内に開口部(242)を保護層および誘電体層を通して下部構造の少なくとも1つの導電層まで形成するステップとを含む、MEMS素子の形成方法。
【選択図】 図1
Description
Claims (20)
- MEMS素子を形成する方法であって、
ベース材料(210)と、該ベース材料の第1の表面(212)に形成された少なくとも1つの導電層(220)とを含む下部構造(200)を設けることと、
前記下部構造の前記少なくとも1つの導電層の上に誘電体層(250)を形成することと、
前記誘電体層の上に保護層(252)を形成することと、
前記保護層の上にMEMS素子としての電気的コンタクトエリア(202)を画定することと、
前記電気的コンタクトエリア内に前記保護層および前記誘電体層を貫通して開口部(242)を前記下部構造の前記少なくとも1つの導電層まで形成することと
からなる方法。 - 前記下部構造が相補形金属酸化膜半導体構造を含む、請求項1の方法。
- 前記下部構造の前記ベース材料がシリコンを含み、前記下部構造の前記少なくとも1つの導電層がアルミニウムを含む、請求項1の方法。
- 前記電気的コンタクトエリアを画定することは、前記保護層の上にエッチングに耐え得る材料(254)を堆積させることと、前記エッチングに耐え得る材料で前記電気的コンタクトエリアの境界を画定することとを含み、
前記電気的コンタクトエリア内に前記開口部を形成することは、前記電気的コンタクトエリアの前記境界内を前記保護層および前記誘電体層を貫通して前記下部構造の前記少なくとも1つの導電層までエッチングすることを含む、請求項1の方法。 - 前記保護層の上に導電性材料(254)を堆積させることと、前記導電性材料を前記保護層および前記誘電体層を貫通して前記下部構造の前記少なくとも1つの導電層に結合させることとを含む、前記保護層の上に前記MEMS素子としての作動エリア(204)を画定することと
をさらに含む、請求項4の方法。 - 前記導電性材料および前記保護層の上に犠牲層(256)を形成することと、
前記犠牲層の上の前記作動エリア内に駆動要素(40)を形成することであって、前記駆動要素を前記犠牲層を貫通して前記作動エリアの前記導電性材料に結合することを含む、駆動要素を形成することと
をさらに含む、請求項5の方法。 - 前記作動エリア内において前記保護層の上に少なくとも1つの電極(60)を形成することをさらに含み、
前記駆動要素は、前記少なくとも1つの電極に対する電気信号の印加に応答して動くように構成される、請求項6の方法。 - 前記駆動要素および前記犠牲層上にマスク層(260)を形成することであって、前記電気的コンタクトエリア内において該マスク層にマスク開口部(262)を画定することを含む、マスク層を形成することをさらに含み、
前記電気的コンタクトエリア内に前記開口部を形成することは、前記開口部を前記マスク層の前記マスク開口部と前記犠牲層とを貫通して前記電気的コンタクトエリアの前記境界まで形成することを含む、請求項6の方法。 - 前記マスク層を除去することと、
前記電気的コンタクトエリア内の前記開口部を保護材料(264)で一時的に埋めることと、
前記駆動要素と前記保護層との間の前記犠牲層を実質的に除去することであって、前記犠牲層をエッチングすることを含む、犠牲層を実質的に除去することと
をさらに含む、請求項8の方法。 - ベース材料(210)と、該ベース材料の第1の表面(212)に形成された少なくとも1つの導電層(220)とを含む下部構造(200)と、
前記下部構造の前記少なくとも1つの導電層の上に形成された誘電体層(250)と、
該誘電体層の上に形成された保護層(252)と、
該保護層の上に延在する駆動要素(40)と、
前記保護層および前記誘電体層を貫通して前記下部構造の前記少なくとも1つの導電層まで形成された開口部(242)を含む電気的コンタクトエリア(202)と
からなるMEMS素子。 - 前記保護層の上に形成された導電性経路(255)をさらに含み、
該導電性経路が前記駆動要素に結合され、かつ前記保護層および前記誘電体層を貫通して前記下部構造の前記少なくとも1つの導電層に結合される、請求項10のMEMS素子。 - 前記保護層の上に形成された少なくとも1つの電極(60)をさらに含み、
前記駆動要素は、前記少なくとも1つの電極に対する電気信号の印加に応答して動くように構成される、請求項10のMEMS素子。 - 前記電気的コンタクトエリアにおいて前記保護層の上に設けられたエッチングに耐え得る材料(254)をさらに含み、該エッチングに耐え得る材料が、前記電気的コンタクトエリアの前記開口部の境界を画定するとともに、前記開口部を形成するときに前記保護層の一部をマスクするように構成される、請求項10のMEMS素子。
- 前記保護層の上に形成された犠牲層(256)をさらに含み、
前記駆動要素が前記犠牲層の上に形成され、前記犠牲層は前記駆動要素が形成された後除去されるように構成される、請求項13のMEMS素子。 - 前記駆動要素および前記犠牲層の上に形成されたマスク層(260)であって、前記犠牲層の一部を露出させるマスク開口部(262)を含むマスク層をさらに含み、
前記電気的コンタクトエリアの前記開口部は、前記マスク開口部および前記犠牲層を貫通して前記保護層の上に設けられた前記エッチングに耐え得る材料まで形成されるように構成され、
前記マスク層は、前記電気的コンタクトエリアの前記開口部が形成された後除去されるように構成される、請求項14のMEMS素子。 - 前記電気的コンタクトエリアの前記開口部は第1のエッチング処理で形成されるように構成され、前記犠牲層は第2のエッチング処理で除去されるように構成される、請求項15のMEMS素子。
- 前記第1のエッチング処理がドライエッチングであり、前記第2のエッチング処理がウエットエッチングである、請求項16のMEMS素子。
- 前記下部構造が相補形金属酸化膜半導体構造を含む、請求項10のMEMS素子。
- 前記下部構造の前記ベース材料がシリコンを含み、前記下部構造の前記少なくとも1つの導電層がアルミニウムを含む、請求項10のMEMS素子。
- 前記MEMS素子がマイクロミラー素子を含み、前記駆動要素が反射要素(42)を含む、請求項10のMEMS素子。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/454,423 US6917459B2 (en) | 2003-06-03 | 2003-06-03 | MEMS device and method of forming MEMS device |
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JP2004358654A true JP2004358654A (ja) | 2004-12-24 |
JP3980571B2 JP3980571B2 (ja) | 2007-09-26 |
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US (1) | US6917459B2 (ja) |
EP (1) | EP1484281B1 (ja) |
JP (1) | JP3980571B2 (ja) |
KR (1) | KR101043460B1 (ja) |
CN (1) | CN1572719B (ja) |
DE (1) | DE60316122T2 (ja) |
SG (1) | SG115612A1 (ja) |
TW (1) | TWI225845B (ja) |
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JP2010508167A (ja) * | 2006-10-31 | 2010-03-18 | アイメック | マイクロマシンデバイスの製造方法 |
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2003
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- 2004-03-03 CN CN2004100074020A patent/CN1572719B/zh not_active Expired - Lifetime
- 2004-05-24 JP JP2004153542A patent/JP3980571B2/ja active Active
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007513782A (ja) * | 2003-10-31 | 2007-05-31 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 電子デバイスの製造方法及び電子デバイス |
JP4744449B2 (ja) * | 2003-10-31 | 2011-08-10 | エプコス アーゲー | 電子デバイスの製造方法及び電子デバイス |
JP2010508167A (ja) * | 2006-10-31 | 2010-03-18 | アイメック | マイクロマシンデバイスの製造方法 |
CN102398886A (zh) * | 2010-09-15 | 2012-04-04 | 矽品精密工业股份有限公司 | 具微机电元件的封装结构及其制法 |
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US6917459B2 (en) | 2005-07-12 |
TWI225845B (en) | 2005-01-01 |
KR20040104408A (ko) | 2004-12-10 |
US20040245588A1 (en) | 2004-12-09 |
DE60316122D1 (de) | 2007-10-18 |
TW200427621A (en) | 2004-12-16 |
EP1484281A1 (en) | 2004-12-08 |
DE60316122T2 (de) | 2008-05-29 |
KR101043460B1 (ko) | 2011-06-23 |
CN1572719A (zh) | 2005-02-02 |
JP3980571B2 (ja) | 2007-09-26 |
CN1572719B (zh) | 2010-09-29 |
SG115612A1 (en) | 2005-10-28 |
EP1484281B1 (en) | 2007-09-05 |
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