DE69831075D1 - Herstellungsverfahren von integrierten Vorrichtungen, die Mikrostrukturen mit elektrischen schwebenden Zwischenverbindungen enthalten - Google Patents

Herstellungsverfahren von integrierten Vorrichtungen, die Mikrostrukturen mit elektrischen schwebenden Zwischenverbindungen enthalten

Info

Publication number
DE69831075D1
DE69831075D1 DE69831075T DE69831075T DE69831075D1 DE 69831075 D1 DE69831075 D1 DE 69831075D1 DE 69831075 T DE69831075 T DE 69831075T DE 69831075 T DE69831075 T DE 69831075T DE 69831075 D1 DE69831075 D1 DE 69831075D1
Authority
DE
Germany
Prior art keywords
manufacturing
devices containing
integrated devices
electrical floating
containing microstructures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69831075T
Other languages
English (en)
Inventor
Benedetto Vigna
Ubaldo Mastromatteo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE69831075D1 publication Critical patent/DE69831075D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4821—Bridge structure with air gap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5221—Crossover interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69831075T 1998-10-21 1998-10-21 Herstellungsverfahren von integrierten Vorrichtungen, die Mikrostrukturen mit elektrischen schwebenden Zwischenverbindungen enthalten Expired - Lifetime DE69831075D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP98830629A EP0996157B1 (de) 1998-10-21 1998-10-21 Herstellungsverfahren von integrierten Vorrichtungen, die Mikrostrukturen mit elektrischen schwebenden Zwischenverbindungen enthalten

Publications (1)

Publication Number Publication Date
DE69831075D1 true DE69831075D1 (de) 2005-09-08

Family

ID=8236843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69831075T Expired - Lifetime DE69831075D1 (de) 1998-10-21 1998-10-21 Herstellungsverfahren von integrierten Vorrichtungen, die Mikrostrukturen mit elektrischen schwebenden Zwischenverbindungen enthalten

Country Status (4)

Country Link
US (1) US6469330B1 (de)
EP (1) EP0996157B1 (de)
JP (1) JP4567126B2 (de)
DE (1) DE69831075D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809384B1 (en) * 2002-08-09 2004-10-26 Pts Corporation Method and apparatus for protecting wiring and integrated circuit device
US7002215B1 (en) * 2002-09-30 2006-02-21 Pts Corporation Floating entrance guard for preventing electrical short circuits
US7084762B2 (en) * 2003-01-10 2006-08-01 Stmicroelectronics, Inc. Electronic device including motion sensitive power switching integrated circuit and related methods
US6917459B2 (en) * 2003-06-03 2005-07-12 Hewlett-Packard Development Company, L.P. MEMS device and method of forming MEMS device
US6914709B2 (en) * 2003-10-02 2005-07-05 Hewlett-Packard Development Company, L.P. MEMS device and method of forming MEMS device
US6861277B1 (en) 2003-10-02 2005-03-01 Hewlett-Packard Development Company, L.P. Method of forming MEMS device
US6874363B1 (en) 2003-10-31 2005-04-05 Honeywell International, Inc. Trapped charge field bias vibrating beam accelerometer
EP1617178B1 (de) * 2004-07-12 2017-04-12 STMicroelectronics Srl Mikroelektromechanische Struktur mit elektrisch isolierten Gebieten und Verfahren zu ihrer Herstellung
US10273147B2 (en) 2013-07-08 2019-04-30 Motion Engine Inc. MEMS components and method of wafer-level manufacturing thereof
EP3019442A4 (de) 2013-07-08 2017-01-25 Motion Engine Inc. Mems-vorrichtung und verfahren zur herstellung
WO2015013827A1 (en) 2013-08-02 2015-02-05 Motion Engine Inc. Mems motion sensor for sub-resonance angular rate sensing
WO2015103688A1 (en) 2014-01-09 2015-07-16 Motion Engine Inc. Integrated mems system
US20170030788A1 (en) 2014-04-10 2017-02-02 Motion Engine Inc. Mems pressure sensor
US11674803B2 (en) 2014-06-02 2023-06-13 Motion Engine, Inc. Multi-mass MEMS motion sensor
WO2016090467A1 (en) 2014-12-09 2016-06-16 Motion Engine Inc. 3d mems magnetometer and associated methods
CA3004763A1 (en) 2015-01-15 2016-07-21 Motion Engine Inc. 3d mems device with hermetic cavity

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
GB1153052A (en) * 1965-06-30 1969-05-21 Texas Instr Inc 62 1153051 Manufacture of Semiconductor Devices
DE2001468A1 (de) * 1970-01-14 1971-07-22 Philips Nv Verfahren zur Herstellung von Halbleiterbauelementen
JPS63249354A (ja) * 1987-04-06 1988-10-17 Toshiba Corp 橋絡配線方法
JP2856778B2 (ja) * 1989-09-07 1999-02-10 株式会社東芝 半導体装置の配線構造
JP3367113B2 (ja) * 1992-04-27 2003-01-14 株式会社デンソー 加速度センサ
US5531018A (en) * 1993-12-20 1996-07-02 General Electric Company Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby
JPH07202220A (ja) * 1993-12-29 1995-08-04 Zexel Corp 半導体加速度センサ
FR2736205B1 (fr) * 1995-06-30 1997-09-19 Motorola Semiconducteurs Dispositif detecteur a semiconducteur et son procede de formation
US6492705B1 (en) * 1996-06-04 2002-12-10 Intersil Corporation Integrated circuit air bridge structures and methods of fabricating same
EP0822578B1 (de) * 1996-07-31 2003-10-08 STMicroelectronics S.r.l. Verfahren zur Herstellung von integrierten Halbleiteranordnungen mit chemoresistivem Gasmikrosensor
KR100210848B1 (ko) * 1996-08-26 1999-07-15 구본준 실리콘 미세 기계의 제조방법
EP0826967A1 (de) * 1996-09-02 1998-03-04 STMicroelectronics S.r.l. Halbleiter-Beschleunigungsmessaufnehmer
EP0895090B1 (de) * 1997-07-31 2003-12-10 STMicroelectronics S.r.l. Verfahren zum Herstellen hochempfindlicher integrierter Beschleunigungs- und Gyroskopsensoren und Sensoren, die derartig hergestellt werden

Also Published As

Publication number Publication date
EP0996157B1 (de) 2005-08-03
US6469330B1 (en) 2002-10-22
JP4567126B2 (ja) 2010-10-20
JP2000133616A (ja) 2000-05-12
EP0996157A1 (de) 2000-04-26

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