DE60312422D1 - Verbessertes Verfahren zum Einbetten von Dickschichtkomponenten - Google Patents

Verbessertes Verfahren zum Einbetten von Dickschichtkomponenten

Info

Publication number
DE60312422D1
DE60312422D1 DE60312422T DE60312422T DE60312422D1 DE 60312422 D1 DE60312422 D1 DE 60312422D1 DE 60312422 T DE60312422 T DE 60312422T DE 60312422 T DE60312422 T DE 60312422T DE 60312422 D1 DE60312422 D1 DE 60312422D1
Authority
DE
Germany
Prior art keywords
thick film
improved process
film components
embedding
embedding thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60312422T
Other languages
English (en)
Other versions
DE60312422T2 (de
Inventor
John James Felten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE60312422D1 publication Critical patent/DE60312422D1/de
Application granted granted Critical
Publication of DE60312422T2 publication Critical patent/DE60312422T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE60312422T 2002-02-15 2003-01-17 Verbessertes Verfahren zum Einbetten von Dickschichtkomponenten Expired - Lifetime DE60312422T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35718302P 2002-02-15 2002-02-15
US357183P 2002-02-15

Publications (2)

Publication Number Publication Date
DE60312422D1 true DE60312422D1 (de) 2007-04-26
DE60312422T2 DE60312422T2 (de) 2007-12-06

Family

ID=27734732

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60312422T Expired - Lifetime DE60312422T2 (de) 2002-02-15 2003-01-17 Verbessertes Verfahren zum Einbetten von Dickschichtkomponenten

Country Status (8)

Country Link
US (1) US6860000B2 (de)
EP (1) EP1355519B1 (de)
JP (1) JP2003249735A (de)
KR (1) KR100511042B1 (de)
CN (1) CN100420356C (de)
DE (1) DE60312422T2 (de)
HK (1) HK1055530A1 (de)
TW (1) TWI284013B (de)

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EP2315510A3 (de) * 2001-06-05 2012-05-02 Dai Nippon Printing Co., Ltd. Leiterplatte mit passiven Elementen
US20050063135A1 (en) * 2003-09-18 2005-03-24 Borland William J. High tolerance embedded capacitors
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US20040108134A1 (en) * 2002-10-11 2004-06-10 Borland William J. Printed wiring boards having low inductance embedded capacitors and methods of making same
US6897761B2 (en) * 2002-12-04 2005-05-24 Cts Corporation Ball grid array resistor network
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US7178229B2 (en) * 2003-11-20 2007-02-20 E. I. Du Pont De Nemours And Company Method of making interlayer panels
US20070019789A1 (en) * 2004-03-29 2007-01-25 Jmar Research, Inc. Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays
US7100277B2 (en) * 2004-07-01 2006-09-05 E. I. Du Pont De Nemours And Company Methods of forming printed circuit boards having embedded thick film capacitors
US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network
KR100598275B1 (ko) * 2004-09-15 2006-07-10 삼성전기주식회사 수동소자 내장형 인쇄회로기판 및 그 제조 방법
US20060120015A1 (en) * 2004-12-02 2006-06-08 Borland William J Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
US20060141225A1 (en) * 2004-12-28 2006-06-29 Borland William J Oxygen doped firing of barium titanate on copper foil
US7025607B1 (en) * 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7892633B2 (en) * 2005-08-17 2011-02-22 Innegrity, Llc Low dielectric composite materials including high modulus polyolefin fibers
US7648607B2 (en) * 2005-08-17 2010-01-19 Innegrity, Llc Methods of forming composite materials including high modulus polyolefin fibers
US8057887B2 (en) * 2005-08-17 2011-11-15 Rampart Fibers, LLC Composite materials including high modulus polyolefin fibers
CN101304813B (zh) * 2005-11-11 2011-08-17 日立化成研究中心公司 通过采用微滴图案形成的微构造提高弹性体材料生物相容性的方法
US8076570B2 (en) 2006-03-20 2011-12-13 Ferro Corporation Aluminum-boron solar cell contacts
US20070236859A1 (en) * 2006-04-10 2007-10-11 Borland William J Organic encapsulant compositions for protection of electronic components
US20070244267A1 (en) * 2006-04-10 2007-10-18 Dueber Thomas E Hydrophobic crosslinkable compositions for electronic applications
US20070290379A1 (en) 2006-06-15 2007-12-20 Dueber Thomas E Hydrophobic compositions for electronic applications
KR101321198B1 (ko) * 2006-12-12 2013-10-23 씨디에이 프로세싱 리미티드 라이어빌리티 컴퍼니 복합 유기 봉지재
WO2008073410A2 (en) * 2006-12-12 2008-06-19 E. I. Du Pont De Nemours And Company Crystalline encapsulants
US8357753B2 (en) 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
US20090223700A1 (en) * 2008-03-05 2009-09-10 Honeywell International Inc. Thin flexible circuits
JP5571466B2 (ja) * 2010-06-10 2014-08-13 イビデン株式会社 プリント配線板、電子デバイス、及びプリント配線板の製造方法
US20140021400A1 (en) * 2010-12-15 2014-01-23 Sun Chemical Corporation Printable etchant compositions for etching silver nanoware-based transparent, conductive film
US8687369B2 (en) 2012-02-20 2014-04-01 Apple Inc. Apparatus for creating resistive pathways
RU2516549C2 (ru) * 2012-08-20 2014-05-20 Открытое акционерное общество "Научно-производственное объединение"ЭРКОН"(ОАО "НПО"ЭРКОН") Способ получения покрытий электрорадиоизделий
JP6151724B2 (ja) * 2013-01-30 2017-06-21 京セラ株式会社 実装構造体の製造方法
US9681559B2 (en) * 2013-12-19 2017-06-13 GM Global Technology Operations LLC Thick film circuits with conductive components formed using different conductive elements and related methods
US20150197645A1 (en) * 2014-01-16 2015-07-16 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode
TWI600354B (zh) * 2014-09-03 2017-09-21 光頡科技股份有限公司 具高彎折力之微電阻結構及其製造方法
CN106297949B (zh) * 2015-05-27 2018-05-11 苏州市贝特利高分子材料股份有限公司 高电导率低温银浆
RU2681521C2 (ru) * 2017-07-14 2019-03-07 Акционерное общество "Омский научно-исследовательский институт приборостроения" (АО "ОНИИП") Способ получения заданной конфигурации пленочных резисторов на основе тантала и его соединений
CN110634637B (zh) * 2017-10-23 2021-06-22 潮州三环（集团）股份有限公司 一种阻值范围为1mω/□～10mω/□的厚膜电阻浆料及其制备方法
US11901096B2 (en) * 2018-06-06 2024-02-13 Dexerials Corporation Method for manufacturing connection body and method for connecting component
CN109105962B (zh) * 2018-10-13 2020-08-28 娄底市安地亚斯电子陶瓷有限公司 电阻材料、发热片及发热片制备方法
TWI713424B (zh) * 2018-10-15 2020-12-11 鼎展電子股份有限公司 銅箔電阻與具有該銅箔電阻的電路板結構
US10653013B1 (en) * 2019-09-03 2020-05-12 The Boeing Company Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance
KR102231104B1 (ko) * 2019-12-27 2021-03-23 삼성전기주식회사 저항 부품
CN116793210B (zh) * 2023-08-04 2024-03-29 松诺盟科技有限公司 一种纳米复合薄膜、应变传感器及其应用

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Also Published As

Publication number Publication date
KR100511042B1 (ko) 2005-08-30
CN100420356C (zh) 2008-09-17
EP1355519A2 (de) 2003-10-22
HK1055530A1 (en) 2004-01-09
CN1438834A (zh) 2003-08-27
EP1355519B1 (de) 2007-03-14
TWI284013B (en) 2007-07-11
EP1355519A3 (de) 2003-11-05
TW200303160A (en) 2003-08-16
DE60312422T2 (de) 2007-12-06
KR20030069086A (ko) 2003-08-25
US20030154592A1 (en) 2003-08-21
JP2003249735A (ja) 2003-09-05
US6860000B2 (en) 2005-03-01

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