ATA3482002A - Verfahren zum nassbehandeln von scheibenförmigen gegenständen - Google Patents

Verfahren zum nassbehandeln von scheibenförmigen gegenständen

Info

Publication number
ATA3482002A
ATA3482002A AT0034802A AT3482002A ATA3482002A AT A3482002 A ATA3482002 A AT A3482002A AT 0034802 A AT0034802 A AT 0034802A AT 3482002 A AT3482002 A AT 3482002A AT A3482002 A ATA3482002 A AT A3482002A
Authority
AT
Austria
Prior art keywords
shaped objects
treating disc
wet treating
wet
disc
Prior art date
Application number
AT0034802A
Other languages
English (en)
Other versions
AT411335B (de
Inventor
Harry Dipl Ing Fh Sax
Original Assignee
Sez Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sez Ag filed Critical Sez Ag
Priority to AT0034802A priority Critical patent/AT411335B/de
Priority to TW092102882A priority patent/TW587292B/zh
Priority to AU2003205771A priority patent/AU2003205771A1/en
Priority to PCT/EP2003/001568 priority patent/WO2003075324A1/en
Priority to CNB038051613A priority patent/CN100347810C/zh
Priority to JP2003573683A priority patent/JP4537714B2/ja
Priority to DE60336713T priority patent/DE60336713D1/de
Priority to US10/506,473 priority patent/US7279116B2/en
Priority to AT03702646T priority patent/ATE505811T1/de
Priority to EP03702646A priority patent/EP1483778B1/de
Priority to KR1020047013228A priority patent/KR100675266B1/ko
Publication of ATA3482002A publication Critical patent/ATA3482002A/de
Application granted granted Critical
Publication of AT411335B publication Critical patent/AT411335B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
AT0034802A 2002-03-06 2002-03-06 Verfahren zum nassbehandeln von scheibenförmigen gegenständen AT411335B (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
AT0034802A AT411335B (de) 2002-03-06 2002-03-06 Verfahren zum nassbehandeln von scheibenförmigen gegenständen
TW092102882A TW587292B (en) 2002-03-06 2003-02-12 Method for wet treatment of disc shaped articles
PCT/EP2003/001568 WO2003075324A1 (en) 2002-03-06 2003-02-17 A method for the wet treatment of disk-like objects
CNB038051613A CN100347810C (zh) 2002-03-06 2003-02-17 盘状物体的湿处理方法
AU2003205771A AU2003205771A1 (en) 2002-03-06 2003-02-17 A method for the wet treatment of disk-like objects
JP2003573683A JP4537714B2 (ja) 2002-03-06 2003-02-17 デイスク状対象物を湿式処置する方法
DE60336713T DE60336713D1 (de) 2002-03-06 2003-02-17 Verfahren zur nassbehandlung von scheibenförmigen gegenständen
US10/506,473 US7279116B2 (en) 2002-03-06 2003-02-17 Method for the wet treatment of disk-like objects
AT03702646T ATE505811T1 (de) 2002-03-06 2003-02-17 Verfahren zur nassbehandlung von scheibenförmigen gegenständen
EP03702646A EP1483778B1 (de) 2002-03-06 2003-02-17 Verfahren zur nassbehandlung von scheibenförmigen gegenständen
KR1020047013228A KR100675266B1 (ko) 2002-03-06 2003-02-17 디스크형 물체의 습식 처리방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0034802A AT411335B (de) 2002-03-06 2002-03-06 Verfahren zum nassbehandeln von scheibenförmigen gegenständen

Publications (2)

Publication Number Publication Date
ATA3482002A true ATA3482002A (de) 2003-05-15
AT411335B AT411335B (de) 2003-12-29

Family

ID=3672349

Family Applications (2)

Application Number Title Priority Date Filing Date
AT0034802A AT411335B (de) 2002-03-06 2002-03-06 Verfahren zum nassbehandeln von scheibenförmigen gegenständen
AT03702646T ATE505811T1 (de) 2002-03-06 2003-02-17 Verfahren zur nassbehandlung von scheibenförmigen gegenständen

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT03702646T ATE505811T1 (de) 2002-03-06 2003-02-17 Verfahren zur nassbehandlung von scheibenförmigen gegenständen

Country Status (10)

Country Link
US (1) US7279116B2 (de)
EP (1) EP1483778B1 (de)
JP (1) JP4537714B2 (de)
KR (1) KR100675266B1 (de)
CN (1) CN100347810C (de)
AT (2) AT411335B (de)
AU (1) AU2003205771A1 (de)
DE (1) DE60336713D1 (de)
TW (1) TW587292B (de)
WO (1) WO2003075324A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE417356T1 (de) * 2000-10-31 2008-12-15 Sez Ag Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
US7070661B2 (en) * 2003-08-22 2006-07-04 Axcelis Technologies, Inc. Uniform gas cushion wafer support
DE20318462U1 (de) * 2003-11-26 2004-03-11 Infineon Technologies Ag Anordnung elektronischer Halbleiterbauelemente auf einem Trägersystem zur Behandlung der Halbleiterbauelemente mit einem flüssigen Medium
US20070110895A1 (en) * 2005-03-08 2007-05-17 Jason Rye Single side workpiece processing
US8082932B2 (en) * 2004-03-12 2011-12-27 Applied Materials, Inc. Single side workpiece processing
US7938942B2 (en) * 2004-03-12 2011-05-10 Applied Materials, Inc. Single side workpiece processing
US8104488B2 (en) * 2006-02-22 2012-01-31 Applied Materials, Inc. Single side workpiece processing
JP4641964B2 (ja) * 2006-03-30 2011-03-02 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5478604B2 (ja) * 2008-03-31 2014-04-23 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド シリコンウェハの端部をエッチングするための方法
EP2359390A1 (de) * 2008-11-19 2011-08-24 MEMC Electronic Materials, Inc. Verfahren und system zum entfernen des rands eines halbleiterwafers
JP5513432B2 (ja) * 2011-03-31 2014-06-04 大日本スクリーン製造株式会社 基板周縁処理装置及び基板周縁処理方法
JP5341939B2 (ja) * 2011-03-31 2013-11-13 大日本スクリーン製造株式会社 基板周縁処理装置および基板周縁処理方法
JP6303255B2 (ja) * 2011-12-02 2018-04-04 株式会社リコー 面発光レーザ素子及び原子発振器
US8853054B2 (en) 2012-03-06 2014-10-07 Sunedison Semiconductor Limited Method of manufacturing silicon-on-insulator wafers
EP3078462A1 (de) * 2013-12-03 2016-10-12 Harmotec Co., Ltd. Haltevorrichtung, haltesystem, steuerungsverfahren und fördervorrichtung
US20160300748A1 (en) * 2013-12-03 2016-10-13 Harmotec Co., Ltd. Conveyance equipment
US10501839B2 (en) 2018-04-11 2019-12-10 General Electric Company Methods of removing a ceramic coating from a substrate
US11661646B2 (en) 2021-04-21 2023-05-30 General Electric Comapny Dual phase magnetic material component and method of its formation
US11926880B2 (en) 2021-04-21 2024-03-12 General Electric Company Fabrication method for a component having magnetic and non-magnetic dual phases

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
AT407312B (de) * 1996-11-20 2001-02-26 Sez Semiconduct Equip Zubehoer Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate
ATE211855T1 (de) * 1999-04-28 2002-01-15 Sez Semiconduct Equip Zubehoer Vorrichtung und verfahren zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
ATE417356T1 (de) 2000-10-31 2008-12-15 Sez Ag Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen

Also Published As

Publication number Publication date
TW587292B (en) 2004-05-11
JP4537714B2 (ja) 2010-09-08
CN100347810C (zh) 2007-11-07
AU2003205771A1 (en) 2003-09-16
EP1483778A1 (de) 2004-12-08
WO2003075324A1 (en) 2003-09-12
TW200304181A (en) 2003-09-16
EP1483778B1 (de) 2011-04-13
JP2005519466A (ja) 2005-06-30
KR100675266B1 (ko) 2007-01-29
CN1639842A (zh) 2005-07-13
US7279116B2 (en) 2007-10-09
AT411335B (de) 2003-12-29
US20050150867A1 (en) 2005-07-14
DE60336713D1 (de) 2011-05-26
KR20040086442A (ko) 2004-10-08
ATE505811T1 (de) 2011-04-15

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Legal Events

Date Code Title Description
EFA Change in the company name
MM01 Lapse because of not paying annual fees

Effective date: 20140515