DE60336713D1 - Verfahren zur nassbehandlung von scheibenförmigen gegenständen - Google Patents
Verfahren zur nassbehandlung von scheibenförmigen gegenständenInfo
- Publication number
- DE60336713D1 DE60336713D1 DE60336713T DE60336713T DE60336713D1 DE 60336713 D1 DE60336713 D1 DE 60336713D1 DE 60336713 T DE60336713 T DE 60336713T DE 60336713 T DE60336713 T DE 60336713T DE 60336713 D1 DE60336713 D1 DE 60336713D1
- Authority
- DE
- Germany
- Prior art keywords
- wet treatment
- disk objects
- disk
- objects
- wet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0034802A AT411335B (de) | 2002-03-06 | 2002-03-06 | Verfahren zum nassbehandeln von scheibenförmigen gegenständen |
| PCT/EP2003/001568 WO2003075324A1 (en) | 2002-03-06 | 2003-02-17 | A method for the wet treatment of disk-like objects |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE60336713D1 true DE60336713D1 (de) | 2011-05-26 |
Family
ID=3672349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60336713T Expired - Lifetime DE60336713D1 (de) | 2002-03-06 | 2003-02-17 | Verfahren zur nassbehandlung von scheibenförmigen gegenständen |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7279116B2 (de) |
| EP (1) | EP1483778B1 (de) |
| JP (1) | JP4537714B2 (de) |
| KR (1) | KR100675266B1 (de) |
| CN (1) | CN100347810C (de) |
| AT (2) | AT411335B (de) |
| AU (1) | AU2003205771A1 (de) |
| DE (1) | DE60336713D1 (de) |
| TW (1) | TW587292B (de) |
| WO (1) | WO2003075324A1 (de) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE50015481D1 (de) * | 2000-10-31 | 2009-01-22 | Sez Ag | Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
| US7070661B2 (en) * | 2003-08-22 | 2006-07-04 | Axcelis Technologies, Inc. | Uniform gas cushion wafer support |
| DE20318462U1 (de) * | 2003-11-26 | 2004-03-11 | Infineon Technologies Ag | Anordnung elektronischer Halbleiterbauelemente auf einem Trägersystem zur Behandlung der Halbleiterbauelemente mit einem flüssigen Medium |
| US8082932B2 (en) * | 2004-03-12 | 2011-12-27 | Applied Materials, Inc. | Single side workpiece processing |
| US20070110895A1 (en) * | 2005-03-08 | 2007-05-17 | Jason Rye | Single side workpiece processing |
| US7938942B2 (en) * | 2004-03-12 | 2011-05-10 | Applied Materials, Inc. | Single side workpiece processing |
| US8104488B2 (en) * | 2006-02-22 | 2012-01-31 | Applied Materials, Inc. | Single side workpiece processing |
| JP4641964B2 (ja) * | 2006-03-30 | 2011-03-02 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| EP2260507B1 (de) * | 2008-03-31 | 2012-09-26 | MEMC Electronic Materials, Inc. | Verfahren zum ätzen der kante eines silicium-wafers, silicium-wafer, ätzvorrichtung |
| EP2359390A1 (de) * | 2008-11-19 | 2011-08-24 | MEMC Electronic Materials, Inc. | Verfahren und system zum entfernen des rands eines halbleiterwafers |
| JP5513432B2 (ja) * | 2011-03-31 | 2014-06-04 | 大日本スクリーン製造株式会社 | 基板周縁処理装置及び基板周縁処理方法 |
| JP5341939B2 (ja) * | 2011-03-31 | 2013-11-13 | 大日本スクリーン製造株式会社 | 基板周縁処理装置および基板周縁処理方法 |
| JP6303255B2 (ja) * | 2011-12-02 | 2018-04-04 | 株式会社リコー | 面発光レーザ素子及び原子発振器 |
| US8853054B2 (en) | 2012-03-06 | 2014-10-07 | Sunedison Semiconductor Limited | Method of manufacturing silicon-on-insulator wafers |
| KR20160093674A (ko) * | 2013-12-03 | 2016-08-08 | 가부시키가이샤 하모테크 | 유지 장치, 유지 시스템, 제어 방법 및 반송 장치 |
| KR20160093050A (ko) * | 2013-12-03 | 2016-08-05 | 가부시키가이샤 하모테크 | 반송 장치 |
| US10501839B2 (en) * | 2018-04-11 | 2019-12-10 | General Electric Company | Methods of removing a ceramic coating from a substrate |
| US11926880B2 (en) | 2021-04-21 | 2024-03-12 | General Electric Company | Fabrication method for a component having magnetic and non-magnetic dual phases |
| US11661646B2 (en) | 2021-04-21 | 2023-05-30 | General Electric Comapny | Dual phase magnetic material component and method of its formation |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
| AT407312B (de) * | 1996-11-20 | 2001-02-26 | Sez Semiconduct Equip Zubehoer | Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate |
| DE59900743D1 (de) * | 1999-04-28 | 2002-02-28 | Sez Semiconduct Equip Zubehoer | Vorrichtung und Verfahren zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
| DE50015481D1 (de) * | 2000-10-31 | 2009-01-22 | Sez Ag | Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
-
2002
- 2002-03-06 AT AT0034802A patent/AT411335B/de not_active IP Right Cessation
-
2003
- 2003-02-12 TW TW092102882A patent/TW587292B/zh not_active IP Right Cessation
- 2003-02-17 WO PCT/EP2003/001568 patent/WO2003075324A1/en active Application Filing
- 2003-02-17 CN CNB038051613A patent/CN100347810C/zh not_active Expired - Fee Related
- 2003-02-17 EP EP03702646A patent/EP1483778B1/de not_active Expired - Lifetime
- 2003-02-17 US US10/506,473 patent/US7279116B2/en not_active Expired - Fee Related
- 2003-02-17 JP JP2003573683A patent/JP4537714B2/ja not_active Expired - Fee Related
- 2003-02-17 KR KR1020047013228A patent/KR100675266B1/ko not_active IP Right Cessation
- 2003-02-17 AU AU2003205771A patent/AU2003205771A1/en not_active Abandoned
- 2003-02-17 AT AT03702646T patent/ATE505811T1/de not_active IP Right Cessation
- 2003-02-17 DE DE60336713T patent/DE60336713D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW200304181A (en) | 2003-09-16 |
| CN1639842A (zh) | 2005-07-13 |
| AU2003205771A1 (en) | 2003-09-16 |
| US7279116B2 (en) | 2007-10-09 |
| CN100347810C (zh) | 2007-11-07 |
| EP1483778A1 (de) | 2004-12-08 |
| EP1483778B1 (de) | 2011-04-13 |
| AT411335B (de) | 2003-12-29 |
| US20050150867A1 (en) | 2005-07-14 |
| WO2003075324A1 (en) | 2003-09-12 |
| KR100675266B1 (ko) | 2007-01-29 |
| ATE505811T1 (de) | 2011-04-15 |
| TW587292B (en) | 2004-05-11 |
| JP2005519466A (ja) | 2005-06-30 |
| ATA3482002A (de) | 2003-05-15 |
| JP4537714B2 (ja) | 2010-09-08 |
| KR20040086442A (ko) | 2004-10-08 |
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