HK1055530A1 - An improved method to embed thick film components - Google Patents

An improved method to embed thick film components

Info

Publication number
HK1055530A1
HK1055530A1 HK03107789.7A HK03107789A HK1055530A1 HK 1055530 A1 HK1055530 A1 HK 1055530A1 HK 03107789 A HK03107789 A HK 03107789A HK 1055530 A1 HK1055530 A1 HK 1055530A1
Authority
HK
Hong Kong
Prior art keywords
thick film
improved method
film components
embed
embed thick
Prior art date
Application number
HK03107789.7A
Other languages
English (en)
Inventor
John James Felten
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK1055530A1 publication Critical patent/HK1055530A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK03107789.7A 2002-02-15 2003-10-29 An improved method to embed thick film components HK1055530A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35718302P 2002-02-15 2002-02-15

Publications (1)

Publication Number Publication Date
HK1055530A1 true HK1055530A1 (en) 2004-01-09

Family

ID=27734732

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03107789.7A HK1055530A1 (en) 2002-02-15 2003-10-29 An improved method to embed thick film components

Country Status (8)

Country Link
US (1) US6860000B2 (de)
EP (1) EP1355519B1 (de)
JP (1) JP2003249735A (de)
KR (1) KR100511042B1 (de)
CN (1) CN100420356C (de)
DE (1) DE60312422T2 (de)
HK (1) HK1055530A1 (de)
TW (1) TWI284013B (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW518616B (en) * 2001-06-01 2003-01-21 Phoenix Prec Technology Corp Method of manufacturing multi-layer circuit board with embedded passive device
EP2315510A3 (de) * 2001-06-05 2012-05-02 Dai Nippon Printing Co., Ltd. Leiterplatte mit passiven Elementen
US20050063135A1 (en) * 2003-09-18 2005-03-24 Borland William J. High tolerance embedded capacitors
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US20040108134A1 (en) * 2002-10-11 2004-06-10 Borland William J. Printed wiring boards having low inductance embedded capacitors and methods of making same
US6897761B2 (en) * 2002-12-04 2005-05-24 Cts Corporation Ball grid array resistor network
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US7178229B2 (en) * 2003-11-20 2007-02-20 E. I. Du Pont De Nemours And Company Method of making interlayer panels
US20070019789A1 (en) * 2004-03-29 2007-01-25 Jmar Research, Inc. Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays
US7100277B2 (en) * 2004-07-01 2006-09-05 E. I. Du Pont De Nemours And Company Methods of forming printed circuit boards having embedded thick film capacitors
US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network
KR100598275B1 (ko) * 2004-09-15 2006-07-10 삼성전기주식회사 수동소자 내장형 인쇄회로기판 및 그 제조 방법
US20060120015A1 (en) * 2004-12-02 2006-06-08 Borland William J Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
US20060141225A1 (en) * 2004-12-28 2006-06-29 Borland William J Oxygen doped firing of barium titanate on copper foil
US7025607B1 (en) * 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7892633B2 (en) * 2005-08-17 2011-02-22 Innegrity, Llc Low dielectric composite materials including high modulus polyolefin fibers
US7648607B2 (en) * 2005-08-17 2010-01-19 Innegrity, Llc Methods of forming composite materials including high modulus polyolefin fibers
US8057887B2 (en) * 2005-08-17 2011-11-15 Rampart Fibers, LLC Composite materials including high modulus polyolefin fibers
CN101304813B (zh) * 2005-11-11 2011-08-17 日立化成研究中心公司 通过采用微滴图案形成的微构造提高弹性体材料生物相容性的方法
US8076570B2 (en) 2006-03-20 2011-12-13 Ferro Corporation Aluminum-boron solar cell contacts
US20070236859A1 (en) * 2006-04-10 2007-10-11 Borland William J Organic encapsulant compositions for protection of electronic components
US20070244267A1 (en) * 2006-04-10 2007-10-18 Dueber Thomas E Hydrophobic crosslinkable compositions for electronic applications
US20070290379A1 (en) 2006-06-15 2007-12-20 Dueber Thomas E Hydrophobic compositions for electronic applications
KR101321198B1 (ko) * 2006-12-12 2013-10-23 씨디에이 프로세싱 리미티드 라이어빌리티 컴퍼니 복합 유기 봉지재
WO2008073410A2 (en) * 2006-12-12 2008-06-19 E. I. Du Pont De Nemours And Company Crystalline encapsulants
US8357753B2 (en) 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
US20090223700A1 (en) * 2008-03-05 2009-09-10 Honeywell International Inc. Thin flexible circuits
JP5571466B2 (ja) * 2010-06-10 2014-08-13 イビデン株式会社 プリント配線板、電子デバイス、及びプリント配線板の製造方法
US20140021400A1 (en) * 2010-12-15 2014-01-23 Sun Chemical Corporation Printable etchant compositions for etching silver nanoware-based transparent, conductive film
US8687369B2 (en) 2012-02-20 2014-04-01 Apple Inc. Apparatus for creating resistive pathways
RU2516549C2 (ru) * 2012-08-20 2014-05-20 Открытое акционерное общество "Научно-производственное объединение"ЭРКОН"(ОАО "НПО"ЭРКОН") Способ получения покрытий электрорадиоизделий
JP6151724B2 (ja) * 2013-01-30 2017-06-21 京セラ株式会社 実装構造体の製造方法
US9681559B2 (en) * 2013-12-19 2017-06-13 GM Global Technology Operations LLC Thick film circuits with conductive components formed using different conductive elements and related methods
US20150197645A1 (en) * 2014-01-16 2015-07-16 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode
TWI600354B (zh) * 2014-09-03 2017-09-21 光頡科技股份有限公司 具高彎折力之微電阻結構及其製造方法
CN106297949B (zh) * 2015-05-27 2018-05-11 苏州市贝特利高分子材料股份有限公司 高电导率低温银浆
RU2681521C2 (ru) * 2017-07-14 2019-03-07 Акционерное общество "Омский научно-исследовательский институт приборостроения" (АО "ОНИИП") Способ получения заданной конфигурации пленочных резисторов на основе тантала и его соединений
CN110634637B (zh) * 2017-10-23 2021-06-22 潮州三环（集团）股份有限公司 一种阻值范围为1mω/□～10mω/□的厚膜电阻浆料及其制备方法
US11901096B2 (en) * 2018-06-06 2024-02-13 Dexerials Corporation Method for manufacturing connection body and method for connecting component
CN109105962B (zh) * 2018-10-13 2020-08-28 娄底市安地亚斯电子陶瓷有限公司 电阻材料、发热片及发热片制备方法
TWI713424B (zh) * 2018-10-15 2020-12-11 鼎展電子股份有限公司 銅箔電阻與具有該銅箔電阻的電路板結構
US10653013B1 (en) * 2019-09-03 2020-05-12 The Boeing Company Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance
KR102231104B1 (ko) * 2019-12-27 2021-03-23 삼성전기주식회사 저항 부품
CN116793210B (zh) * 2023-08-04 2024-03-29 松诺盟科技有限公司 一种纳米复合薄膜、应变传感器及其应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808576A (en) 1971-01-15 1974-04-30 Mica Corp Circuit board with resistance layer
JPS59138304A (ja) 1983-01-27 1984-08-08 三洋電機株式会社 カ−ボンレジン印刷抵抗ペ−スト
JPH02153589A (ja) 1988-12-05 1990-06-13 Ibiden Co Ltd 厚膜素子付プリント配線板
JP2707903B2 (ja) * 1992-01-28 1998-02-04 日本電気株式会社 多層プリント配線板の製造方法
US5652055A (en) * 1994-07-20 1997-07-29 W. L. Gore & Associates, Inc. Matched low dielectric constant, dimensionally stable adhesive sheet
DE19609382A1 (de) 1996-03-04 1997-09-11 Biotronik Mess & Therapieg Aktivitätsgesteuerter Herzschrittmacher
KR100516043B1 (ko) 1997-03-06 2005-09-26 라미나 세라믹스, 인크. 수동 소자들이 내재된 세라믹 다층 인쇄 회로 기판
JP3324437B2 (ja) 1997-04-04 2002-09-17 松下電器産業株式会社 多層プリント配線板の製造方法
US6329899B1 (en) * 1998-04-29 2001-12-11 Microcoating Technologies, Inc. Formation of thin film resistors
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components

Also Published As

Publication number Publication date
KR100511042B1 (ko) 2005-08-30
CN100420356C (zh) 2008-09-17
EP1355519A2 (de) 2003-10-22
CN1438834A (zh) 2003-08-27
EP1355519B1 (de) 2007-03-14
DE60312422D1 (de) 2007-04-26
TWI284013B (en) 2007-07-11
EP1355519A3 (de) 2003-11-05
TW200303160A (en) 2003-08-16
DE60312422T2 (de) 2007-12-06
KR20030069086A (ko) 2003-08-25
US20030154592A1 (en) 2003-08-21
JP2003249735A (ja) 2003-09-05
US6860000B2 (en) 2005-03-01

Similar Documents

Publication Publication Date Title
HK1055530A1 (en) An improved method to embed thick film components
EP1614768A4 (de) Filmbildungsverfahren
GB0226725D0 (en) method
AU2003219359A1 (en) Imaging method
GB0208104D0 (en) Method
GB0211975D0 (en) Method
GB0228289D0 (en) Method
GB0405880D0 (en) Method for coated composite film
EP1625829A4 (de) Verfahren zur erzeugung eines ultrasonogramms
AU2003258070A8 (en) Electrodionization method
GB0215034D0 (en) Architecture generation method
PL375184A1 (en) Method of enhancing multimedia
AU2003246110A8 (en) Sealing method
GB0229898D0 (en) Information augmentation method
EP1482540A4 (de) Verfahren zur bildung eines dünnfilms
AU2003253813A8 (en) Method for colpoplasty
GB0401955D0 (en) Method for forming film
GB2384640B (en) Image processing method
AU2003293771A1 (en) Creating effects for images
GB0221752D0 (en) Connection method
GB0200865D0 (en) Method
GB0208383D0 (en) Method
GB0207266D0 (en) Method
AU2003219178A8 (en) Hydrodynamic power-generating method
ZA200304792B (en) Quotation method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130214