DE60308266D1 - Hocheffiziente resonante Leitung - Google Patents
Hocheffiziente resonante LeitungInfo
- Publication number
- DE60308266D1 DE60308266D1 DE60308266T DE60308266T DE60308266D1 DE 60308266 D1 DE60308266 D1 DE 60308266D1 DE 60308266 T DE60308266 T DE 60308266T DE 60308266 T DE60308266 T DE 60308266T DE 60308266 D1 DE60308266 D1 DE 60308266D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- region
- resonant line
- ground
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/2039—Galvanic coupling between Input/Output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US185266 | 2002-06-27 | ||
US10/185,266 US6963259B2 (en) | 2002-06-27 | 2002-06-27 | High efficiency resonant line |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60308266D1 true DE60308266D1 (de) | 2006-10-26 |
DE60308266T2 DE60308266T2 (de) | 2007-09-13 |
Family
ID=29717995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60308266T Expired - Lifetime DE60308266T2 (de) | 2002-06-27 | 2003-06-11 | Hocheffiziente resonante Leitung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6963259B2 (de) |
EP (1) | EP1376754B1 (de) |
JP (2) | JP2004032767A (de) |
AT (1) | ATE339781T1 (de) |
AU (1) | AU2003204648B2 (de) |
CA (1) | CA2432264C (de) |
DE (1) | DE60308266T2 (de) |
Families Citing this family (83)
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US8749054B2 (en) | 2010-06-24 | 2014-06-10 | L. Pierre de Rochemont | Semiconductor carrier with vertical power FET module |
US6943731B2 (en) * | 2003-03-31 | 2005-09-13 | Harris Corporation | Arangements of microstrip antennas having dielectric substrates including meta-materials |
US6791496B1 (en) * | 2003-03-31 | 2004-09-14 | Harris Corporation | High efficiency slot fed microstrip antenna having an improved stub |
US6995711B2 (en) * | 2003-03-31 | 2006-02-07 | Harris Corporation | High efficiency crossed slot microstrip antenna |
JP2006067251A (ja) * | 2004-08-26 | 2006-03-09 | Omron Corp | チップアンテナおよびその製造方法 |
WO2006039699A2 (en) * | 2004-10-01 | 2006-04-13 | De Rochemont L Pierre | Ceramic antenna module and methods of manufacture thereof |
ES2272144B1 (es) * | 2004-12-28 | 2008-03-01 | Universitat Autonoma De Barcelona | Filtros planares para microondas y ondas milimetricas con ancho de banda controlable basados en resonadores concentrados. |
JP3928055B2 (ja) * | 2005-03-02 | 2007-06-13 | 国立大学法人山口大学 | 負透磁率または負誘電率メタマテリアルおよび表面波導波路 |
CN102255143B (zh) | 2005-06-30 | 2014-08-20 | L.皮尔·德罗什蒙 | 电子元件及制造方法 |
US8350657B2 (en) * | 2005-06-30 | 2013-01-08 | Derochemont L Pierre | Power management module and method of manufacture |
US8354294B2 (en) | 2006-01-24 | 2013-01-15 | De Rochemont L Pierre | Liquid chemical deposition apparatus and process and products therefrom |
JP4628991B2 (ja) * | 2006-05-10 | 2011-02-09 | 富士通コンポーネント株式会社 | 分布定数型フィルタ装置 |
DE102006024097A1 (de) * | 2006-05-18 | 2007-11-22 | E.G.O. Elektro-Gerätebau GmbH | Verwendung von linkshändigen Metamaterialien als Anzeige, insbesondere an einem Kochfeld, und Anzeige sowie Anzeigeverfahren |
US7959598B2 (en) | 2008-08-20 | 2011-06-14 | Asante Solutions, Inc. | Infusion pump systems and methods |
US8922347B1 (en) | 2009-06-17 | 2014-12-30 | L. Pierre de Rochemont | R.F. energy collection circuit for wireless devices |
US8952858B2 (en) | 2009-06-17 | 2015-02-10 | L. Pierre de Rochemont | Frequency-selective dipole antennas |
JP2011103598A (ja) * | 2009-11-11 | 2011-05-26 | Panasonic Corp | 伝送線路および高周波デバイス |
JP2011103602A (ja) * | 2009-11-11 | 2011-05-26 | Panasonic Corp | 伝送線路、高周波デバイスおよび伝送線路の製造方法 |
US8552708B2 (en) | 2010-06-02 | 2013-10-08 | L. Pierre de Rochemont | Monolithic DC/DC power management module with surface FET |
US9023493B2 (en) | 2010-07-13 | 2015-05-05 | L. Pierre de Rochemont | Chemically complex ablative max-phase material and method of manufacture |
JP5976648B2 (ja) | 2010-08-23 | 2016-08-24 | デ,ロシェモント,エル.,ピエール | 共振トランジスタゲートを有するパワーfet |
WO2012061656A2 (en) | 2010-11-03 | 2012-05-10 | De Rochemont L Pierre | Semiconductor chip carriers with monolithically integrated quantum dot devices and method of manufacture thereof |
EP2717657A4 (de) * | 2011-06-03 | 2014-11-12 | Wacom | Cvd-vorrichtung und cvd-filmherstellungsverfahren |
DE102012204546A1 (de) | 2012-03-21 | 2013-09-26 | BSH Bosch und Siemens Hausgeräte GmbH | Verfahren zum Betreiben eines Induktionskochfelds und Induktionskochfeld |
JP5904638B2 (ja) * | 2012-04-11 | 2016-04-13 | 株式会社日本マイクロニクス | 多層配線基板とその製造方法 |
US9561324B2 (en) | 2013-07-19 | 2017-02-07 | Bigfoot Biomedical, Inc. | Infusion pump system and method |
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US10275573B2 (en) | 2016-01-13 | 2019-04-30 | Bigfoot Biomedical, Inc. | User interface for diabetes management system |
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2002
- 2002-06-27 US US10/185,266 patent/US6963259B2/en not_active Expired - Lifetime
-
2003
- 2003-06-11 AT AT03012279T patent/ATE339781T1/de not_active IP Right Cessation
- 2003-06-11 EP EP03012279A patent/EP1376754B1/de not_active Expired - Lifetime
- 2003-06-11 DE DE60308266T patent/DE60308266T2/de not_active Expired - Lifetime
- 2003-06-12 AU AU2003204648A patent/AU2003204648B2/en not_active Ceased
- 2003-06-12 CA CA002432264A patent/CA2432264C/en not_active Expired - Fee Related
- 2003-06-20 JP JP2003177083A patent/JP2004032767A/ja active Pending
-
2007
- 2007-08-31 JP JP2007226499A patent/JP2008029025A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ATE339781T1 (de) | 2006-10-15 |
CA2432264C (en) | 2008-10-07 |
EP1376754A1 (de) | 2004-01-02 |
US20040000976A1 (en) | 2004-01-01 |
AU2003204648A1 (en) | 2004-01-22 |
US6963259B2 (en) | 2005-11-08 |
DE60308266T2 (de) | 2007-09-13 |
AU2003204648B2 (en) | 2004-12-02 |
JP2008029025A (ja) | 2008-02-07 |
EP1376754B1 (de) | 2006-09-13 |
CA2432264A1 (en) | 2003-12-27 |
JP2004032767A (ja) | 2004-01-29 |
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