DE60307304T2 - Fluorfreie metallkomplexe zum chemische gasphasenabscheidung - Google Patents

Fluorfreie metallkomplexe zum chemische gasphasenabscheidung Download PDF

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Publication number
DE60307304T2
DE60307304T2 DE60307304T DE60307304T DE60307304T2 DE 60307304 T2 DE60307304 T2 DE 60307304T2 DE 60307304 T DE60307304 T DE 60307304T DE 60307304 T DE60307304 T DE 60307304T DE 60307304 T2 DE60307304 T2 DE 60307304T2
Authority
DE
Germany
Prior art keywords
group
copper
alkyl
silver
different
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60307304T
Other languages
German (de)
English (en)
Other versions
DE60307304D1 (de
Inventor
Pascal Doppelt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique
Original Assignee
Centre National de la Recherche Scientifique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National de la Recherche Scientifique filed Critical Centre National de la Recherche Scientifique
Application granted granted Critical
Publication of DE60307304D1 publication Critical patent/DE60307304D1/de
Publication of DE60307304T2 publication Critical patent/DE60307304T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic Table without C-Metal linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/08—Copper compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Vapour Deposition (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
DE60307304T 2002-09-30 2003-09-25 Fluorfreie metallkomplexe zum chemische gasphasenabscheidung Expired - Lifetime DE60307304T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0212059 2002-09-30
FR0212059A FR2845088B1 (fr) 2002-09-30 2002-09-30 Nouveaux complexes metalliques exempts de fluor pour le depot chimique de metaux en phase gazeuse
PCT/FR2003/002820 WO2004029061A1 (fr) 2002-09-30 2003-09-25 Complexes metalliques exempts de fluor pour le depot chimique de metaux en phase gazeuse

Publications (2)

Publication Number Publication Date
DE60307304D1 DE60307304D1 (de) 2006-09-14
DE60307304T2 true DE60307304T2 (de) 2007-10-11

Family

ID=31985326

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60307304T Expired - Lifetime DE60307304T2 (de) 2002-09-30 2003-09-25 Fluorfreie metallkomplexe zum chemische gasphasenabscheidung

Country Status (9)

Country Link
US (1) US7238820B2 (enExample)
EP (1) EP1551851B1 (enExample)
JP (1) JP4634800B2 (enExample)
AT (1) ATE334990T1 (enExample)
AU (1) AU2003276374A1 (enExample)
CA (1) CA2500386C (enExample)
DE (1) DE60307304T2 (enExample)
FR (1) FR2845088B1 (enExample)
WO (1) WO2004029061A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009039216A1 (en) * 2007-09-17 2009-03-26 L'air Liquide - Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Neutral ligand containing precursors and methods for deposition of a metal containing film
CN103839604A (zh) * 2014-02-26 2014-06-04 京东方科技集团股份有限公司 导电膜及其制备方法、阵列基板
JP7497022B2 (ja) * 2020-06-24 2024-06-10 国立研究開発法人産業技術総合研究所 アルキニルシランの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085731A (en) * 1991-02-04 1992-02-04 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
FR2760743B1 (fr) * 1997-03-13 1999-07-23 Centre Nat Rech Scient Nouveaux precurseurs de cuivre(i) pour depot chimique en phase gazeuse de cuivre metallique
US6838573B1 (en) * 2004-01-30 2005-01-04 Air Products And Chemicals, Inc. Copper CVD precursors with enhanced adhesion properties

Also Published As

Publication number Publication date
CA2500386C (fr) 2012-03-13
EP1551851A1 (fr) 2005-07-13
CA2500386A1 (fr) 2004-04-08
DE60307304D1 (de) 2006-09-14
FR2845088A1 (fr) 2004-04-02
US7238820B2 (en) 2007-07-03
US20060121709A1 (en) 2006-06-08
JP4634800B2 (ja) 2011-02-16
FR2845088B1 (fr) 2004-12-03
WO2004029061A1 (fr) 2004-04-08
JP2006501280A (ja) 2006-01-12
AU2003276374A1 (en) 2004-04-19
EP1551851B1 (fr) 2006-08-02
ATE334990T1 (de) 2006-08-15

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