DE60238271D1 - Optimierungsvorrichtung, anbringungsvorrichtung und system zum anbringen elektronischer teile - Google Patents

Optimierungsvorrichtung, anbringungsvorrichtung und system zum anbringen elektronischer teile

Info

Publication number
DE60238271D1
DE60238271D1 DE60238271T DE60238271T DE60238271D1 DE 60238271 D1 DE60238271 D1 DE 60238271D1 DE 60238271 T DE60238271 T DE 60238271T DE 60238271 T DE60238271 T DE 60238271T DE 60238271 D1 DE60238271 D1 DE 60238271D1
Authority
DE
Germany
Prior art keywords
electronic parts
attaching electronic
optimizing
mounting device
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238271T
Other languages
English (en)
Inventor
Yasuhiro Maenishi
Ikuo Yoshida
Satoshi Masuda
Akihito Yamasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60238271D1 publication Critical patent/DE60238271D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53022—Means to assemble or disassemble with means to test work or product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53026—Means to assemble or disassemble with randomly actuated stopping or disabling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53026—Means to assemble or disassemble with randomly actuated stopping or disabling means
    • Y10T29/5303—Responsive to condition of work or product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60238271T 2001-09-28 2002-09-24 Optimierungsvorrichtung, anbringungsvorrichtung und system zum anbringen elektronischer teile Expired - Lifetime DE60238271D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001303821 2001-09-28
JP2002200491A JP3589658B2 (ja) 2001-09-28 2002-07-09 最適化装置、装着装置及び電子部品装着システム
PCT/JP2002/009790 WO2003030611A1 (fr) 2001-09-28 2002-09-24 Dispositif d'optimisation, dispositif de montage et systeme de montage de pieces electroniques

Publications (1)

Publication Number Publication Date
DE60238271D1 true DE60238271D1 (de) 2010-12-23

Family

ID=26623443

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60238271T Expired - Lifetime DE60238271D1 (de) 2001-09-28 2002-09-24 Optimierungsvorrichtung, anbringungsvorrichtung und system zum anbringen elektronischer teile

Country Status (6)

Country Link
US (1) US7313859B2 (de)
EP (1) EP1448042B1 (de)
JP (1) JP3589658B2 (de)
CN (1) CN1294795C (de)
DE (1) DE60238271D1 (de)
WO (1) WO2003030611A1 (de)

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NL1029247C2 (nl) 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
US7584202B2 (en) * 2006-01-13 2009-09-01 Oracle International Corporation High performance in memory data cubes
JP4705868B2 (ja) * 2006-03-24 2011-06-22 株式会社日立ハイテクインスツルメンツ 部品装着設定システム、および部品装着装置設定方法
DE112007000508T5 (de) * 2006-03-28 2009-01-29 Matsushita Electric Industrial Co., Ltd., Kadoma-shi Verfahren zum Festlegen einer Montagebedingung
DE112007002591A5 (de) * 2006-12-12 2009-11-05 Siemens Electronics Assembly Systems Gmbh & Co. Kg Bestückautomat zur Bestückung von Substraten mit Bauelementen
JP4804402B2 (ja) * 2007-04-02 2011-11-02 パナソニック株式会社 部品実装順序決定方法
GB2452320B (en) 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
JP5113772B2 (ja) * 2008-02-21 2013-01-09 パナソニック株式会社 実装条件決定方法、実装条件決定装置、部品実装機、部品実装方法、およびプログラム
DE112009000375T5 (de) 2008-02-21 2011-05-19 Panasonic Corporation, Kadoma-shi Verfahren zum Bestimmen der Montagebedingungen
DE102008020167A1 (de) 2008-04-22 2009-07-16 Siemens Aktiengesellschaft Bestimmung einer Zuordnung von einem zu fertigenden Produkt zu einer Produktionslinie
KR20100052236A (ko) * 2008-11-10 2010-05-19 삼성전자주식회사 패키지 장치 및 방법
KR101192727B1 (ko) * 2010-01-29 2012-10-18 야마하하쓰도키 가부시키가이샤 부품 실장 시스템
JP5789468B2 (ja) * 2011-09-29 2015-10-07 ヤマハ発動機株式会社 基板生産ラインの管理方法
JP5863413B2 (ja) * 2011-11-24 2016-02-16 富士機械製造株式会社 部品装着ライン
JP5955971B2 (ja) * 2012-09-12 2016-07-20 富士機械製造株式会社 生産順序最適化方法および生産順序最適化システム
CN103345086A (zh) * 2013-07-19 2013-10-09 深圳市华星光电技术有限公司 用于向面板贴附覆晶膜的装置及其使用方法
EP3038442B1 (de) * 2013-08-22 2021-08-18 FUJI Corporation Produktionsoptimierungsvorrichtung einer komponentenmontagestrasse
EP3046403B1 (de) 2013-09-12 2019-07-10 FUJI Corporation Substratarbeitssystem, arbeitsverfahren und speiserübertragungsverfahren
CN105580506B (zh) * 2013-09-24 2018-12-21 株式会社富士 安装装置
US9814168B2 (en) * 2014-07-25 2017-11-07 Fuji Machine Mfg. Co., Ltd. Automatic feeder exchanging system
US11140801B2 (en) * 2014-11-11 2021-10-05 Fuji Corporation Data input and control devices of an electronic component mounting machine
DE102014225713A1 (de) * 2014-12-12 2016-06-16 Siemens Aktiengesellschaft Verfahren und System zur Bestückung von Leiterplatten sowie Computerprogrammprodukt zur Durchführung des Verfahrens
CN107211568B (zh) 2015-01-20 2019-08-02 株式会社富士 检查辅助装置及检查辅助方法
CN107432119B (zh) * 2015-03-26 2020-02-14 株式会社富士 元件安装线的最优化装置及元件安装线的最优化方法
DE102015122931A1 (de) * 2015-12-29 2017-06-29 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum Erstellen einer Produktionslinie sowie System zur Bestückung einer Platine mit Bauelementen
US10703083B2 (en) * 2017-01-13 2020-07-07 Autodesk, Inc. Multi-tool scheduling for cooperative manufacturing
DE102017205453B3 (de) * 2017-03-30 2018-07-12 Continental Automotive Gmbh Verfahren zum Bestücken einer Leiterplatte und Bestückungsvorrichtung
JP6908698B2 (ja) * 2017-05-23 2021-07-28 株式会社Ｆｕｊｉ 装着順序決定装置、装着順序検査装置、装着順序決定方法、および装着順序検査方法
KR102484355B1 (ko) * 2018-08-22 2023-01-04 한화정밀기계 부품 장착 순서 결정 장치
CN112346714A (zh) * 2020-11-09 2021-02-09 南京云通电子科技有限公司 一种软件开发系统优化的方法
CN116266129A (zh) * 2021-12-17 2023-06-20 戴尔产品有限公司 分布式计算系统中的多领导者选举

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Also Published As

Publication number Publication date
EP1448042A4 (de) 2008-01-23
CN1294795C (zh) 2007-01-10
JP2003174299A (ja) 2003-06-20
US20050065620A1 (en) 2005-03-24
JP3589658B2 (ja) 2004-11-17
US7313859B2 (en) 2008-01-01
EP1448042A1 (de) 2004-08-18
WO2003030611A1 (fr) 2003-04-10
EP1448042B1 (de) 2010-11-10
CN1596567A (zh) 2005-03-16

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