DE60227022D1 - Verfahren zur Herstellung einer Elektrode für Siliziumkarbidhalbleiter - Google Patents

Verfahren zur Herstellung einer Elektrode für Siliziumkarbidhalbleiter

Info

Publication number
DE60227022D1
DE60227022D1 DE60227022T DE60227022T DE60227022D1 DE 60227022 D1 DE60227022 D1 DE 60227022D1 DE 60227022 T DE60227022 T DE 60227022T DE 60227022 T DE60227022 T DE 60227022T DE 60227022 D1 DE60227022 D1 DE 60227022D1
Authority
DE
Germany
Prior art keywords
electrode
producing
silicon carbide
carbide semiconductors
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60227022T
Other languages
English (en)
Inventor
Kenshiro Nakashima
Nagoya Okuyama
Hitoshi Yokoi
Takafumi Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Application granted granted Critical
Publication of DE60227022D1 publication Critical patent/DE60227022D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/048—Making electrodes
    • H01L21/0485—Ohmic electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608—Silicon carbide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
DE60227022T 2001-03-27 2002-03-26 Verfahren zur Herstellung einer Elektrode für Siliziumkarbidhalbleiter Expired - Lifetime DE60227022D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001090042A JP4545975B2 (ja) 2001-03-27 2001-03-27 炭化珪素半導体用電極の製造方法、及び炭化珪素半導体用電極を備える炭化珪素半導体素子の製造方法

Publications (1)

Publication Number Publication Date
DE60227022D1 true DE60227022D1 (de) 2008-07-24

Family

ID=18944880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60227022T Expired - Lifetime DE60227022D1 (de) 2001-03-27 2002-03-26 Verfahren zur Herstellung einer Elektrode für Siliziumkarbidhalbleiter

Country Status (4)

Country Link
US (2) US20020145145A1 (de)
EP (1) EP1246252B1 (de)
JP (1) JP4545975B2 (de)
DE (1) DE60227022D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282478A (ja) * 2002-01-17 2003-10-03 Sony Corp 合金化方法及び配線形成方法、表示素子の形成方法、画像表示装置の製造方法
US20050104072A1 (en) * 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
US7951632B1 (en) * 2005-01-26 2011-05-31 University Of Central Florida Optical device and method of making
US7554055B2 (en) * 2005-05-03 2009-06-30 Hitachi Global Storage Technologies Netherlands B.V. Method for making ohmic contact to silicon structures with low thermal loads
DE102006050360B4 (de) * 2006-10-25 2014-05-15 Infineon Technologies Austria Ag Verfahren zum Erzeugen eines elektrischen Kontakts auf SiC
US9209281B2 (en) 2007-04-23 2015-12-08 Infineon Technologies Ag Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching
US7851352B2 (en) * 2007-05-11 2010-12-14 Semiconductor Energy Laboratory Co., Ltd Manufacturing method of semiconductor device and electronic device
JP5282382B2 (ja) * 2007-08-17 2013-09-04 富士電機株式会社 炭化珪素半導体装置、その製造方法および炭化珪素デバイス
JP2009272530A (ja) * 2008-05-09 2009-11-19 Sharp Corp 半導体装置とその製造方法
CN102171557B (zh) * 2008-09-19 2016-10-19 安晟信医疗科技控股公司 具有增强的电化学活性的电化学装置及其制造方法
US20110124146A1 (en) * 2009-05-29 2011-05-26 Pitera Arthur J Methods of forming high-efficiency multi-junction solar cell structures
JP5439215B2 (ja) 2010-02-10 2014-03-12 株式会社東芝 半導体装置および半導体装置の製造方法
JP5724887B2 (ja) * 2012-01-16 2015-05-27 トヨタ自動車株式会社 半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5243204A (en) * 1990-05-18 1993-09-07 Sharp Kabushiki Kaisha Silicon carbide light emitting diode and a method for the same
JP2901788B2 (ja) * 1991-07-19 1999-06-07 ローム株式会社 炭化珪素半導体装置
US5313078A (en) * 1991-12-04 1994-05-17 Sharp Kabushiki Kaisha Multi-layer silicon carbide light emitting diode having a PN junction
JPH07254701A (ja) * 1994-03-15 1995-10-03 Nec Corp 半導体装置及びその製造方法
US5474619A (en) * 1994-05-04 1995-12-12 The United States Of America As Represented By The Secretary Of Commerce Thin film high temperature silicide thermocouples
US5442200A (en) * 1994-06-03 1995-08-15 Advanced Technology Materials, Inc. Low resistance, stable ohmic contacts to silcon carbide, and method of making the same
JP3315541B2 (ja) 1994-11-04 2002-08-19 新日本無線株式会社 ＳｉＣへの電極の形成方法
SE504916C2 (sv) * 1995-01-18 1997-05-26 Ericsson Telefon Ab L M Förfarande för att åstadkomma en ohmsk kontakt jämte halvledarkomponent försedd med dylik ohmsk kontakt
JP3361061B2 (ja) * 1998-09-17 2003-01-07 株式会社東芝 半導体装置
JP3953696B2 (ja) * 1999-12-24 2007-08-08 新日本無線株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
US20020145145A1 (en) 2002-10-10
JP4545975B2 (ja) 2010-09-15
EP1246252A3 (de) 2007-01-03
EP1246252B1 (de) 2008-06-11
JP2002289555A (ja) 2002-10-04
EP1246252A2 (de) 2002-10-02
US20040099866A1 (en) 2004-05-27
US6770508B2 (en) 2004-08-03

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: KLUNKER, SCHMITT-NILSON, HIRSCH, 80797 MUENCHEN

8364 No opposition during term of opposition