DE60213710D1 - Vorrichtung zur Planarisierung von Wafern - Google Patents

Vorrichtung zur Planarisierung von Wafern

Info

Publication number
DE60213710D1
DE60213710D1 DE60213710T DE60213710T DE60213710D1 DE 60213710 D1 DE60213710 D1 DE 60213710D1 DE 60213710 T DE60213710 T DE 60213710T DE 60213710 T DE60213710 T DE 60213710T DE 60213710 D1 DE60213710 D1 DE 60213710D1
Authority
DE
Germany
Prior art keywords
planarizing wafers
planarizing
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60213710T
Other languages
English (en)
Other versions
DE60213710T2 (de
Inventor
Kazuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE60213710D1 publication Critical patent/DE60213710D1/de
Application granted granted Critical
Publication of DE60213710T2 publication Critical patent/DE60213710T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE60213710T 2001-05-21 2002-05-21 Waferplanarisierungsvorrichtung Expired - Fee Related DE60213710T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001150637A JP2002343756A (ja) 2001-05-21 2001-05-21 ウェーハ平面加工装置
JP2001150637 2001-05-21

Publications (2)

Publication Number Publication Date
DE60213710D1 true DE60213710D1 (de) 2006-09-21
DE60213710T2 DE60213710T2 (de) 2006-12-14

Family

ID=18995623

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60213710T Expired - Fee Related DE60213710T2 (de) 2001-05-21 2002-05-21 Waferplanarisierungsvorrichtung

Country Status (8)

Country Link
US (1) US6863590B2 (de)
EP (1) EP1263026B1 (de)
JP (1) JP2002343756A (de)
KR (1) KR20020089180A (de)
DE (1) DE60213710T2 (de)
MY (1) MY131229A (de)
SG (1) SG95694A1 (de)
TW (1) TWI253969B (de)

Families Citing this family (38)

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Publication number Priority date Publication date Assignee Title
JP2003209080A (ja) * 2002-01-11 2003-07-25 Disco Abrasive Syst Ltd 半導体ウェーハ保護部材及び半導体ウェーハの研削方法
US6944517B2 (en) * 2003-07-03 2005-09-13 Brooks Automation, Inc. Substrate apparatus calibration and synchronization procedure
CN1299336C (zh) * 2003-07-29 2007-02-07 南茂科技股份有限公司 晶圆背面研磨工艺
CN100440444C (zh) * 2004-07-22 2008-12-03 株式会社瑞萨科技 半导体器件的制造方法
JP4795743B2 (ja) * 2005-05-19 2011-10-19 リンテック株式会社 貼付装置
WO2007018041A1 (ja) * 2005-08-11 2007-02-15 Lintec Corporation シート貼付装置及び貼付方法
JP4836557B2 (ja) 2005-11-25 2011-12-14 株式会社東京精密 ダイシングテープ貼付装置およびダイシングテープ貼付方法
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4668052B2 (ja) * 2005-12-06 2011-04-13 東京応化工業株式会社 剥離装置
JP4841262B2 (ja) * 2006-02-13 2011-12-21 株式会社東京精密 ウェーハ処理装置
JP4693696B2 (ja) * 2006-06-05 2011-06-01 株式会社東京精密 ワーク処理装置
JP4698519B2 (ja) * 2006-07-31 2011-06-08 日東電工株式会社 半導体ウエハマウント装置
JP5008999B2 (ja) * 2007-02-06 2012-08-22 リンテック株式会社 ダイシングテープおよび半導体装置の製造方法
JP4746002B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
JP4964070B2 (ja) * 2007-09-10 2012-06-27 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP4851414B2 (ja) * 2007-10-04 2012-01-11 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP5165450B2 (ja) * 2008-04-22 2013-03-21 株式会社ディスコ 研削装置及び板状物の厚み算出方法
JP2010005717A (ja) * 2008-06-25 2010-01-14 Disco Abrasive Syst Ltd 加工装置
JP2010050265A (ja) * 2008-08-21 2010-03-04 Tokyo Seimitsu Co Ltd ウェーハの搬送用パッド
JP2010247311A (ja) * 2009-04-20 2010-11-04 Disco Abrasive Syst Ltd 被加工物の研削方法
JP5654782B2 (ja) * 2010-06-22 2015-01-14 株式会社ディスコ 研削加工装置
JP5773660B2 (ja) * 2011-01-19 2015-09-02 株式会社ディスコ 樹脂剥がし装置および研削加工装置
JP5639958B2 (ja) * 2011-05-27 2014-12-10 日東電工株式会社 半導体ウエハマウント方法および半導体ウエハマウント装置
KR101838109B1 (ko) * 2011-12-06 2018-03-14 삼성전자주식회사 컨택터 및 이를 포함하는 반도체 테스트 장치
JP5957220B2 (ja) * 2011-12-20 2016-07-27 株式会社ディスコ 板状ワークの割れ判断方法
US8834662B2 (en) * 2012-03-22 2014-09-16 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method of separating wafer from carrier
US9355882B2 (en) * 2013-12-04 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer module for bowed wafers
KR102559647B1 (ko) * 2016-08-12 2023-07-25 삼성디스플레이 주식회사 기판 연마 시스템 및 기판 연마 방법
JP6754272B2 (ja) * 2016-10-24 2020-09-09 株式会社ディスコ 研削装置
CN111052341A (zh) 2017-08-28 2020-04-21 东京毅力科创株式会社 基板处理系统和基板处理方法
JP7071818B2 (ja) * 2017-11-22 2022-05-19 東京エレクトロン株式会社 基板処理システム
KR102604525B1 (ko) * 2017-12-22 2023-11-22 도쿄엘렉트론가부시키가이샤 기판 처리 시스템, 기판 처리 방법 및 컴퓨터 기억 매체
WO2019138881A1 (ja) 2018-01-09 2019-07-18 東京エレクトロン株式会社 洗浄装置、洗浄方法及びコンピュータ記憶媒体
CN112334763A (zh) * 2018-06-29 2021-02-05 株式会社高迎科技 对象物检查装置及利用其的对象物检查方法
KR102204769B1 (ko) * 2019-11-02 2021-01-19 주식회사 윈텍오토메이션 초경인서트 제품 연삭을 위한 핸들러 장치
CN112008595A (zh) * 2020-09-02 2020-12-01 珠海市中芯集成电路有限公司 一种晶圆研磨装置及研磨方法
JP2023023594A (ja) 2021-08-05 2023-02-16 株式会社ディスコ 基板処理装置

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Publication number Priority date Publication date Assignee Title
US5336319A (en) * 1992-05-26 1994-08-09 Xerox Corporation Apparatus for applying an adhesive layer to a substrate surface
JP3058093B2 (ja) * 1996-08-29 2000-07-04 松下電器産業株式会社 電界効果トランジスタの製造方法
JPH1092657A (ja) * 1996-09-09 1998-04-10 Kenwood Corp 薄膜チップ部品及びその製造方法
US5830565A (en) 1996-11-08 1998-11-03 W. L. Gore & Associates, Inc. High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening
EP0848417B1 (de) 1996-12-13 2004-09-08 International Business Machines Corporation Verbesserungen im chemisch-mechanischen Polieren von Halbleiterscheiben
US6075375A (en) 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
KR100253085B1 (ko) * 1997-07-10 2000-04-15 윤종용 측정장치를구비한웨이퍼폴리싱장치및폴리싱방법
JPH11111671A (ja) * 1997-09-30 1999-04-23 Hitachi Ltd 半導体処理装置および半導体装置の製造方法
JPH11161916A (ja) * 1997-11-28 1999-06-18 Fuji Elelctrochem Co Ltd 磁気ヘッド製造方法
US5974903A (en) 1998-01-08 1999-11-02 Intel Corporation Method and apparatus for in situ visual inspection of die products in tape and reel shipping medium
US6413149B1 (en) * 1998-04-28 2002-07-02 Ebara Corporation Abrading plate and polishing method using the same
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
JP3410371B2 (ja) * 1998-08-18 2003-05-26 リンテック株式会社 ウエハ裏面研削時の表面保護シートおよびその利用方法
JP2000254857A (ja) * 1999-01-06 2000-09-19 Tokyo Seimitsu Co Ltd 平面加工装置及び平面加工方法
JP2000331963A (ja) 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハフレームへのウェーハ取付方法と装置及びそれを組込んだ平面加工装置
JP3675237B2 (ja) * 1999-07-09 2005-07-27 株式会社東京精密 平面加工装置
JP3348700B2 (ja) * 1999-08-19 2002-11-20 株式会社東京精密 エッチング装置
JP3368876B2 (ja) * 1999-11-05 2003-01-20 株式会社東京精密 半導体チップ製造方法
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
JP3916375B2 (ja) * 2000-06-02 2007-05-16 株式会社荏原製作所 ポリッシング方法および装置
US6626736B2 (en) * 2000-06-30 2003-09-30 Ebara Corporation Polishing apparatus

Also Published As

Publication number Publication date
KR20020089180A (ko) 2002-11-29
EP1263026A3 (de) 2004-02-18
SG95694A1 (en) 2003-04-23
EP1263026A2 (de) 2002-12-04
JP2002343756A (ja) 2002-11-29
TWI253969B (en) 2006-05-01
MY131229A (en) 2007-07-31
US6863590B2 (en) 2005-03-08
DE60213710T2 (de) 2006-12-14
US20020173229A1 (en) 2002-11-21
EP1263026B1 (de) 2006-08-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee