DE602007002653D1 - Prozessflüssigkeitsversorgungssystem, Prozessflüssigkeitsversorgungsverfahren und Speichermedium - Google Patents

Prozessflüssigkeitsversorgungssystem, Prozessflüssigkeitsversorgungsverfahren und Speichermedium

Info

Publication number
DE602007002653D1
DE602007002653D1 DE200760002653 DE602007002653T DE602007002653D1 DE 602007002653 D1 DE602007002653 D1 DE 602007002653D1 DE 200760002653 DE200760002653 DE 200760002653 DE 602007002653 T DE602007002653 T DE 602007002653T DE 602007002653 D1 DE602007002653 D1 DE 602007002653D1
Authority
DE
Germany
Prior art keywords
fluid supply
process fluid
storage medium
supply system
supply method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200760002653
Other languages
English (en)
Inventor
Keisuke Sasaki
Kazuyoshi Eshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE602007002653D1 publication Critical patent/DE602007002653D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
    • Y10T137/0352—Controlled by pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/2931—Diverse fluid containing pressure systems
    • Y10T137/3115—Gas pressure storage over or displacement of liquid
    • Y10T137/3127—With gas maintenance or application
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7287—Liquid level responsive or maintaining systems
    • Y10T137/7303—Control of both inflow and outflow of tank

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
DE200760002653 2006-03-22 2007-03-19 Prozessflüssigkeitsversorgungssystem, Prozessflüssigkeitsversorgungsverfahren und Speichermedium Active DE602007002653D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006078010A JP4700536B2 (ja) 2006-03-22 2006-03-22 液処理装置並びに液処理装置の処理液供給方法及び処理液供給プログラム。

Publications (1)

Publication Number Publication Date
DE602007002653D1 true DE602007002653D1 (de) 2009-11-19

Family

ID=38036373

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200760002653 Active DE602007002653D1 (de) 2006-03-22 2007-03-19 Prozessflüssigkeitsversorgungssystem, Prozessflüssigkeitsversorgungsverfahren und Speichermedium

Country Status (6)

Country Link
US (1) US8408234B2 (de)
EP (1) EP1837894B1 (de)
JP (1) JP4700536B2 (de)
KR (1) KR101046424B1 (de)
DE (1) DE602007002653D1 (de)
TW (1) TWI420582B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY183847A (en) * 2008-06-25 2021-03-17 Basf Se Method for safely preventing backflowing in the conveying of a fluid
JP5341427B2 (ja) * 2008-08-20 2013-11-13 東京エレクトロン株式会社 基板処理装置、基板処理方法、基板処理プログラム、及び基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
KR101269214B1 (ko) * 2008-08-25 2013-05-28 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법, 프로그램 및 기억 매체
JP2010050393A (ja) * 2008-08-25 2010-03-04 Tokyo Electron Ltd 基板処理装置、基板処理方法、プログラムおよび記憶媒体
CN103197694B (zh) 2013-02-25 2016-05-25 京东方科技集团股份有限公司 流体自动定量供给的控制方法及系统
JP6118689B2 (ja) * 2013-09-13 2017-04-19 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6290762B2 (ja) * 2013-10-30 2018-03-07 東京エレクトロン株式会社 流量調整機構、希釈薬液供給機構、液処理装置及びその運用方法
KR101548866B1 (ko) * 2014-05-14 2015-09-01 한국수력원자력 주식회사 원자로 냉각재 펌프의 피동형 질소주입장치
JP6319117B2 (ja) * 2015-01-26 2018-05-09 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
JP7189013B2 (ja) * 2018-12-28 2022-12-13 東京エレクトロン株式会社 基板処理装置および基板処理装置の運転方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7961391A (en) 1990-05-15 1991-12-10 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particle volatilization
US5148945B1 (en) * 1990-09-17 1996-07-02 Applied Chemical Solutions Apparatus and method for the transfer and delivery of high purity chemicals
US5417346A (en) * 1990-09-17 1995-05-23 Applied Chemical Solutions Process and apparatus for electronic control of the transfer and delivery of high purity chemicals
JP3453034B2 (ja) 1996-11-22 2003-10-06 大日本スクリーン製造株式会社 基板処理装置
JP3445456B2 (ja) * 1996-11-22 2003-09-08 大日本スクリーン製造株式会社 基板処理装置
JPH10303172A (ja) * 1997-04-24 1998-11-13 Kaijo Corp 基板の洗浄乾燥方法
JPH10303164A (ja) * 1997-04-30 1998-11-13 Dainippon Screen Mfg Co Ltd 基板処理装置
TW421818B (en) * 1997-07-04 2001-02-11 Tokyo Electron Ltd Process solution supplying apparatus
JP3561836B2 (ja) * 1999-12-03 2004-09-02 東京エレクトロン株式会社 液処理装置及び液処理方法
JP2002273314A (ja) * 2001-03-19 2002-09-24 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
KR101046424B1 (ko) 2011-07-05
TW200807530A (en) 2008-02-01
TWI420582B (zh) 2013-12-21
US20070221271A1 (en) 2007-09-27
JP4700536B2 (ja) 2011-06-15
KR20070095771A (ko) 2007-10-01
JP2007258289A (ja) 2007-10-04
US8408234B2 (en) 2013-04-02
EP1837894B1 (de) 2009-10-07
EP1837894A1 (de) 2007-09-26

Similar Documents

Publication Publication Date Title
DE602007002653D1 (de) Prozessflüssigkeitsversorgungssystem, Prozessflüssigkeitsversorgungsverfahren und Speichermedium
DE602006011510D1 (de) Prozesssystem und Prozessflüssigkeitszufuhrverfahren
TWI368132B (en) Power supply method, storage medium and system
EP2175390A4 (de) Molekülsimulationsverfahren, molekülsimulationseinrichtung, molekülsimulationsprogramm und das programm aufzeichnendes aufzeichnungsmedium
DE602006019049D1 (de) Speichersystem und Datenwiederherstellungsverfahren dafür
BRPI0822314A2 (pt) Método, sistema, e, meio de armazenagem legível por computador
EP2294511A4 (de) Informationsverarbeitungsvorrichtung, verfahren zu ihrer steuerung und speichermedium
DE602006002241D1 (de) Speichersystem und Steuerungsverfahren dafür
EP2179348A4 (de) Verfahren und systeme zum durchführen von mediensuchen, medienerzeugung und zur sicheren verteilung von medien
NO20052273L (no) Fremgangsmate og system for kontroll av fluidstromning
BRPI0814085A2 (pt) Sistema, e, método
EP2085799A4 (de) Identifikationsmedium, identifikationsverfahren und identifikationseinrichtung
BRPI0815101A2 (pt) Método, e, sistema
HK1132048A1 (en) Identification medium, identification method, and identification device
GB201104020D0 (en) Managed pressure and/or temperature drilling system and method
BRPI0811722A2 (pt) Método, e sistema
BRPI0818423A2 (pt) Sistema, método, e, mídia legível por computador
BRPI0922309A2 (pt) método, meio legível por computador, e, aparelho.
BRPI0810963A2 (pt) sistema, e, método
BR112012001212A2 (pt) aparelho, metodo e meio de armazenamento
TWI367525B (en) Substrate treatment apparatus, substrate treatment method, and storage medium
BRPI0821050A2 (pt) Método, e, sistema
BRPI0820365A2 (pt) Método, sistema, e, mídia de armazenamento legível por computador.
GB2435475B (en) Selective culture medium
DE602006003853D1 (de) Speichersystem und Wiederherstellungsverfahren dafür

Legal Events

Date Code Title Description
8364 No opposition during term of opposition