DE602006011510D1 - Prozesssystem und Prozessflüssigkeitszufuhrverfahren - Google Patents

Prozesssystem und Prozessflüssigkeitszufuhrverfahren

Info

Publication number
DE602006011510D1
DE602006011510D1 DE602006011510T DE602006011510T DE602006011510D1 DE 602006011510 D1 DE602006011510 D1 DE 602006011510D1 DE 602006011510 T DE602006011510 T DE 602006011510T DE 602006011510 T DE602006011510 T DE 602006011510T DE 602006011510 D1 DE602006011510 D1 DE 602006011510D1
Authority
DE
Germany
Prior art keywords
fluid supply
supply method
process fluid
process system
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006011510T
Other languages
English (en)
Inventor
Shu Yamamoto
Yasuhiro Chouno
Yoshichika Tokuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE602006011510D1 publication Critical patent/DE602006011510D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20—Measuring; Control or regulation
    • B01F35/21—Measuring
    • B01F35/2132—Concentration, pH, pOH, p(ION) or oxygen-demand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/82—Forming a predetermined ratio of the substances to be mixed by adding a material to be mixed to a mixture in response to a detected feature, e.g. density, radioactivity, consumed power or colour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
    • B01F2101/58—Mixing semiconducting materials, e.g. during semiconductor or wafer manufacturing processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
DE602006011510T 2005-10-11 2006-10-10 Prozesssystem und Prozessflüssigkeitszufuhrverfahren Active DE602006011510D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005296953A JP4891589B2 (ja) 2005-10-11 2005-10-11 液処理装置及び処理液供給方法並びに処理液供給プログラム

Publications (1)

Publication Number Publication Date
DE602006011510D1 true DE602006011510D1 (de) 2010-02-11

Family

ID=37684924

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602006011510T Active DE602006011510D1 (de) 2005-10-11 2006-10-10 Prozesssystem und Prozessflüssigkeitszufuhrverfahren
DE602006005879T Active DE602006005879D1 (de) 2005-10-11 2006-10-10 Ein Flüssigkeitslieferungssystem und -verfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE602006005879T Active DE602006005879D1 (de) 2005-10-11 2006-10-10 Ein Flüssigkeitslieferungssystem und -verfahren

Country Status (6)

Country Link
US (1) US20070134822A1 (de)
EP (2) EP1775754B1 (de)
JP (1) JP4891589B2 (de)
KR (1) KR101019456B1 (de)
DE (2) DE602006011510D1 (de)
TW (1) TW200723381A (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4940123B2 (ja) 2007-12-21 2012-05-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5313647B2 (ja) 2008-03-25 2013-10-09 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
JP5466380B2 (ja) * 2008-07-17 2014-04-09 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
JP5355145B2 (ja) * 2009-02-26 2013-11-27 シスメックス株式会社 試薬調製装置、検体測定装置および試薬調製方法
JP5448521B2 (ja) * 2009-03-27 2014-03-19 大日本スクリーン製造株式会社 処理液供給装置および処理液供給方法
JP5645516B2 (ja) * 2009-09-11 2014-12-24 東京エレクトロン株式会社 基板液処理装置及び処理液生成方法並びに処理液生成プログラムを記録したコンピュータ読み取り可能な記録媒体
JP5323661B2 (ja) * 2009-12-07 2013-10-23 東京エレクトロン株式会社 枚葉式の基板液処理装置における循環ラインの液交換方法
JP5780810B2 (ja) * 2011-04-06 2015-09-16 オルガノ株式会社 液体管理システム
JP5791939B2 (ja) * 2011-04-06 2015-10-07 オルガノ株式会社 液体管理システム
CN103221153B (zh) * 2011-10-21 2014-12-24 Fujiks株式会社 清洗液供给装置
JP6074338B2 (ja) * 2013-08-27 2017-02-01 東京エレクトロン株式会社 液処理装置、濃度補正方法及び記憶媒体
JP6118739B2 (ja) * 2014-01-31 2017-04-19 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体
US9329071B2 (en) * 2014-04-21 2016-05-03 Asm Ip Holding B.V. Substrate processing apparatus
CN110828338B (zh) * 2019-09-30 2022-08-09 长江存储科技有限责任公司 浓度的调节方法及调节系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278847A (ja) * 1994-04-08 1995-10-24 Sony Corp 薬液濃度管理方法及び薬液濃度管理装置を備えた化学的処理装置
JP3442218B2 (ja) * 1996-03-18 2003-09-02 大日本スクリーン製造株式会社 基板洗浄装置
JP3625120B2 (ja) * 1997-03-19 2005-03-02 大日本スクリーン製造株式会社 基板処理装置
JP3529251B2 (ja) * 1997-10-13 2004-05-24 大日本スクリーン製造株式会社 基板処理装置
JP2000124185A (ja) * 1998-10-13 2000-04-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000218143A (ja) 1999-01-29 2000-08-08 Mitsubishi Kakoki Kaisha Ltd 薬液混合設備および供給量制御方法
US6616760B2 (en) * 1999-12-17 2003-09-09 Tokyo Electron Limited Film forming unit
US6572255B2 (en) * 2001-04-24 2003-06-03 Coulter International Corp. Apparatus for controllably mixing and delivering diluted solution
JP2003017460A (ja) * 2001-06-29 2003-01-17 Shibaura Mechatronics Corp 処理液の供給循環装置
US6878216B2 (en) * 2001-09-03 2005-04-12 Tokyo Electron Limited Substrate processing method and substrate processing system
US6849563B2 (en) * 2002-12-09 2005-02-01 International Business Machines Corporation Method and apparatus for controlling coating thickness
JP2005262031A (ja) * 2004-03-17 2005-09-29 Kurita Water Ind Ltd 循環式ガス溶解水供給装置及び該装置の運転方法

Also Published As

Publication number Publication date
US20070134822A1 (en) 2007-06-14
EP2001041A1 (de) 2008-12-10
EP1775754A1 (de) 2007-04-18
EP1775754B1 (de) 2009-03-25
JP2007109738A (ja) 2007-04-26
KR101019456B1 (ko) 2011-03-07
TWI314757B (de) 2009-09-11
TW200723381A (en) 2007-06-16
JP4891589B2 (ja) 2012-03-07
DE602006005879D1 (de) 2009-05-07
KR20070040296A (ko) 2007-04-16
EP2001041B1 (de) 2009-12-30

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Legal Events

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