DE602007000701D1 - Optimitierte Verdrahtung eines mit einer Laserdiode integrierten Modulators auf einer Montageplatte - Google Patents
Optimitierte Verdrahtung eines mit einer Laserdiode integrierten Modulators auf einer MontageplatteInfo
- Publication number
- DE602007000701D1 DE602007000701D1 DE602007000701T DE602007000701T DE602007000701D1 DE 602007000701 D1 DE602007000701 D1 DE 602007000701D1 DE 602007000701 T DE602007000701 T DE 602007000701T DE 602007000701 T DE602007000701 T DE 602007000701T DE 602007000701 D1 DE602007000701 D1 DE 602007000701D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting plate
- laser diode
- diode integrated
- integrated modulator
- optimized wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0208—Semi-insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
- H01S5/0422—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0427—Electrical excitation ; Circuits therefor for applying modulation to the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006115147A JP4856465B2 (ja) | 2006-04-19 | 2006-04-19 | 光半導体素子搭載基板、および光送信モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007000701D1 true DE602007000701D1 (de) | 2009-04-30 |
Family
ID=38198229
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007000701T Active DE602007000701D1 (de) | 2006-04-19 | 2007-01-09 | Optimitierte Verdrahtung eines mit einer Laserdiode integrierten Modulators auf einer Montageplatte |
DE602007010752T Active DE602007010752D1 (de) | 2006-04-19 | 2007-01-09 | Optimierte Verdrahtung einer Laserdiode und eines integrierten Modulators auf einem Träger |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007010752T Active DE602007010752D1 (de) | 2006-04-19 | 2007-01-09 | Optimierte Verdrahtung einer Laserdiode und eines integrierten Modulators auf einem Träger |
Country Status (5)
Country | Link |
---|---|
US (1) | US7400791B2 (de) |
EP (2) | EP1848075B1 (de) |
JP (1) | JP4856465B2 (de) |
CN (1) | CN100499115C (de) |
DE (2) | DE602007000701D1 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8447153B2 (en) * | 2006-04-27 | 2013-05-21 | Finisar Corporation | Low inductance optical transmitter submount assembly |
JP5003464B2 (ja) * | 2007-12-21 | 2012-08-15 | 三菱電機株式会社 | 光伝送モジュール |
JP5313730B2 (ja) * | 2009-03-16 | 2013-10-09 | 日本オクラロ株式会社 | 光送信機及び光送信モジュール |
JP5431799B2 (ja) * | 2009-06-10 | 2014-03-05 | 日本電信電話株式会社 | 半導体レーザ及び半導体光変調器差動型半導体装置 |
JP2010287669A (ja) * | 2009-06-10 | 2010-12-24 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザ差動型半導体装置 |
JP2010287668A (ja) * | 2009-06-10 | 2010-12-24 | Nippon Telegr & Teleph Corp <Ntt> | 半導体光変調器差動型半導体装置 |
JP2011003627A (ja) * | 2009-06-17 | 2011-01-06 | Nippon Telegr & Teleph Corp <Ntt> | 差動信号駆動用レーザアレイ |
JP5428978B2 (ja) * | 2010-03-19 | 2014-02-26 | 三菱電機株式会社 | 半導体光変調装置 |
JP2012108238A (ja) * | 2010-11-16 | 2012-06-07 | Mitsubishi Electric Corp | 光変調装置 |
JP2013066033A (ja) * | 2011-09-16 | 2013-04-11 | Mitsubishi Electric Corp | 光送信モジュール |
JP6136363B2 (ja) * | 2013-02-27 | 2017-05-31 | 住友電気工業株式会社 | 光変調モジュール |
US9625671B2 (en) | 2013-10-23 | 2017-04-18 | Lasermax, Inc. | Laser module and system |
US9859680B2 (en) | 2013-12-17 | 2018-01-02 | Lasermax, Inc. | Shock resistant laser module |
JP6299301B2 (ja) | 2014-03-14 | 2018-03-28 | 三菱電機株式会社 | 半導体光変調装置 |
JP6614811B2 (ja) * | 2015-05-29 | 2019-12-04 | 新光電気工業株式会社 | 半導体装置用ステム及び半導体装置 |
JP6502797B2 (ja) * | 2015-08-31 | 2019-04-17 | 日本オクラロ株式会社 | 光モジュール |
US10903619B2 (en) * | 2017-05-17 | 2021-01-26 | Mitsubishi Electric Corporation | Semiconductor package |
JP2019033116A (ja) * | 2017-08-04 | 2019-02-28 | 日本電信電話株式会社 | 半導体光集積素子 |
JP7078313B2 (ja) * | 2018-03-07 | 2022-05-31 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
JP7263697B2 (ja) * | 2018-04-13 | 2023-04-25 | 住友電気工業株式会社 | 受光装置 |
CN108649423B (zh) * | 2018-05-15 | 2022-03-22 | Oppo广东移动通信有限公司 | 激光投射模组、深度相机及电子装置 |
JPWO2020008594A1 (ja) * | 2018-07-05 | 2020-07-16 | 三菱電機株式会社 | 光送信モジュール |
JP7059865B2 (ja) * | 2018-08-10 | 2022-04-26 | 富士通株式会社 | 光送信器 |
WO2020043728A1 (en) * | 2018-08-30 | 2020-03-05 | Finisar Sweden Ab | Laser carrier-on-chip device |
CN112740051B (zh) * | 2018-09-20 | 2022-06-10 | 华为技术有限公司 | 一种光电子组件及其制造方法 |
WO2020092290A1 (en) | 2018-10-30 | 2020-05-07 | Exceutas Canada, Inc. | Low inductance laser driver packaging using lead-frame and thin dielectric layer mask pad definition |
US10547158B1 (en) * | 2018-10-31 | 2020-01-28 | Avago Technologies International Sales Pte. Limited | Optical communication device and system |
CN112956090A (zh) | 2018-11-01 | 2021-06-11 | 埃赛力达加拿大有限公司 | 用于侧面发射激光二极管的四方扁平无引线封装件 |
CN112997371B (zh) * | 2018-11-21 | 2024-05-03 | 三菱电机株式会社 | 光模块 |
JP7295634B2 (ja) * | 2018-12-17 | 2023-06-21 | 日本ルメンタム株式会社 | 光サブアッセンブリ及び光モジュール |
JP7124741B2 (ja) * | 2019-02-06 | 2022-08-24 | 日本電信電話株式会社 | 光送信器 |
CN110190504B (zh) * | 2019-05-24 | 2020-12-15 | 宁波东立创芯光电科技有限公司 | 半导体激光器阵列封装结构 |
WO2020246027A1 (ja) * | 2019-06-07 | 2020-12-10 | 三菱電機株式会社 | 光通信用デバイス及び送信モジュール |
US20220352690A1 (en) * | 2019-10-25 | 2022-11-03 | Mitsubishi Electric Corporation | Optical semiconductor device |
JP7350646B2 (ja) * | 2019-12-17 | 2023-09-26 | CIG Photonics Japan株式会社 | 光モジュール |
TWI784382B (zh) * | 2020-01-13 | 2022-11-21 | 日商新唐科技日本股份有限公司 | 半導體裝置 |
JP7369047B2 (ja) * | 2020-01-30 | 2023-10-25 | CIG Photonics Japan株式会社 | 光モジュール及び光伝送装置 |
JP7474112B2 (ja) | 2020-05-15 | 2024-04-24 | CIG Photonics Japan株式会社 | 光モジュール |
JP2021180296A (ja) * | 2020-05-15 | 2021-11-18 | 住友電気工業株式会社 | 光半導体装置、光送信モジュール及び光トランシーバ |
US11927839B2 (en) | 2020-09-14 | 2024-03-12 | Ii-Vi Delaware, Inc. | Broadband electro-absorption optical modulator using on-chip RF input signal termination |
JP7437278B2 (ja) | 2020-09-25 | 2024-02-22 | CIG Photonics Japan株式会社 | 光モジュール |
CN114792928A (zh) * | 2021-01-25 | 2022-07-26 | 华为技术有限公司 | 激光器载体及其制作方法 |
JP7226668B1 (ja) * | 2022-06-10 | 2023-02-21 | 三菱電機株式会社 | 半導体光集積素子 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1051069A (ja) * | 1996-07-29 | 1998-02-20 | Mitsubishi Electric Corp | 光半導体装置 |
JP4199901B2 (ja) | 2000-03-10 | 2008-12-24 | 日本オプネクスト株式会社 | 光送信モジュール |
JP3367606B2 (ja) | 2000-03-13 | 2003-01-14 | 尚志 鞍石 | カード使用者確認システムおよびカード読取装置 |
JP4290314B2 (ja) | 2000-04-26 | 2009-07-01 | Necエレクトロニクス株式会社 | 高周波回路及びそれを実装したモジュール、通信機 |
JP2005338678A (ja) * | 2004-05-31 | 2005-12-08 | Opnext Japan Inc | 光変調器モジュール |
JP4934271B2 (ja) | 2004-06-11 | 2012-05-16 | 日本オプネクスト株式会社 | 単一電源駆動光集積装置 |
JP4578164B2 (ja) * | 2004-07-12 | 2010-11-10 | 日本オプネクスト株式会社 | 光モジュール |
JP2007201213A (ja) * | 2006-01-27 | 2007-08-09 | Opnext Japan Inc | 光受信モジュール |
-
2006
- 2006-04-19 JP JP2006115147A patent/JP4856465B2/ja active Active
-
2007
- 2007-01-09 EP EP07000378A patent/EP1848075B1/de active Active
- 2007-01-09 DE DE602007000701T patent/DE602007000701D1/de active Active
- 2007-01-09 EP EP08004913A patent/EP2009751B1/de active Active
- 2007-01-09 DE DE602007010752T patent/DE602007010752D1/de active Active
- 2007-01-12 US US11/622,511 patent/US7400791B2/en active Active
- 2007-02-02 CN CNB2007100063265A patent/CN100499115C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
DE602007010752D1 (de) | 2011-01-05 |
EP1848075B1 (de) | 2009-03-18 |
EP2009751A2 (de) | 2008-12-31 |
JP2007286454A (ja) | 2007-11-01 |
EP2009751A3 (de) | 2009-05-06 |
US20070248363A1 (en) | 2007-10-25 |
CN100499115C (zh) | 2009-06-10 |
EP2009751B1 (de) | 2010-11-24 |
US7400791B2 (en) | 2008-07-15 |
CN101071808A (zh) | 2007-11-14 |
EP1848075A1 (de) | 2007-10-24 |
JP4856465B2 (ja) | 2012-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602007000701D1 (de) | Optimitierte Verdrahtung eines mit einer Laserdiode integrierten Modulators auf einer Montageplatte | |
DE602007004810D1 (de) | Befestigungsstrukturanordnung für eine lichtemittierende Diode | |
FR2931587B1 (fr) | Procede de realisation d'un dispositif optique a composants optoelectroniques integres | |
TW200741136A (en) | Light emitting apparatus | |
FR2937710B1 (fr) | Module a diodes electroluminescentes pour vehicule, support a diodes, fabrications | |
DE602005025972D1 (de) | Vorrichtung zur Versorgung einer mehrzweigigen Leuchtdiodenschaltung | |
BRPI0918282A2 (pt) | filme não líquido curável transferível sobre um substrato de liberação | |
DE502007000631D1 (de) | Leuchteinheit mit einer Leuchtdiode mit integriertem Lichtumlenkkörper | |
DE602006007535D1 (de) | Verwendung einer auf dem Schacht montierten Platte | |
FR2938349B1 (fr) | Dispositif optique a membrane deformable a actionnement perfectionne | |
TWI319629B (en) | Light emitting diode module | |
FR2919074B1 (fr) | Dispositif optique a membrane deformable par actionnement electrostatique | |
EP2220427A4 (de) | Leuchtdiodenanordnung für lichtverteilung | |
DE112005002919A5 (de) | Seitlich optisch gepumpter oberflächenemittierender Halbleiterlaser auf einer Wärmesenke | |
BRPI0812946A2 (pt) | Ativação a laser de laminados elásticos | |
FR2902200B1 (fr) | Pastille de modification d'une puissance d'un composant optique | |
DE602007004759D1 (de) | Temperatureinstellung der Wellenlänge einer Laserdiode mittels Heizen | |
DE602008003097D1 (de) | Mikromechanisches Bauteil mit Öffnung zur Befestigung auf einer Achse | |
FR2964796B1 (fr) | Dispositif optoelectronique a base de nanofils pour l'emission de lumiere | |
FR2924819B1 (fr) | Pastille courbe de modification d'une puissance d'un composant optique | |
DE602007000890D1 (de) | Lichtemissionsvorrichtung und Anzeigevorrichtung unter Verwendung der Lichtemissionsvorrichtung als Lichtquelle | |
DE602007003967D1 (de) | Vorrichtung zur verteilung einer fahrzeugantriebskraft | |
WO2009028440A1 (ja) | 表示装置、発光装置 | |
FR2903198B1 (fr) | Dispositif de generation d'une repartition angulaire homogene d'un rayonnement laser | |
FR2909160B1 (fr) | Spot a diode led. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |