DE602006016409D1 - Polierkopf für einen halbleiterwafer, poliervorrichtung und polierverfahren - Google Patents

Polierkopf für einen halbleiterwafer, poliervorrichtung und polierverfahren

Info

Publication number
DE602006016409D1
DE602006016409D1 DE602006016409T DE602006016409T DE602006016409D1 DE 602006016409 D1 DE602006016409 D1 DE 602006016409D1 DE 602006016409 T DE602006016409 T DE 602006016409T DE 602006016409 T DE602006016409 T DE 602006016409T DE 602006016409 D1 DE602006016409 D1 DE 602006016409D1
Authority
DE
Germany
Prior art keywords
polishing
semiconductor wafer
head
polishing device
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006016409T
Other languages
English (en)
Inventor
Hiromasa Hashimoto
Yasuharu Ariga
Hisashi Masumura
Kouzi Kitagawa
Toshimasa Kubota
Takahiro Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE602006016409D1 publication Critical patent/DE602006016409D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE602006016409T 2005-03-14 2006-03-01 Polierkopf für einen halbleiterwafer, poliervorrichtung und polierverfahren Active DE602006016409D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005070826A JP4756884B2 (ja) 2005-03-14 2005-03-14 半導体ウエーハ用の研磨ヘッド及び研磨装置並びに研磨方法
PCT/JP2006/303835 WO2006098150A1 (ja) 2005-03-14 2006-03-01 半導体ウエーハ用の研磨ヘッド及び研磨装置並びに研磨方法

Publications (1)

Publication Number Publication Date
DE602006016409D1 true DE602006016409D1 (de) 2010-10-07

Family

ID=36991502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006016409T Active DE602006016409D1 (de) 2005-03-14 2006-03-01 Polierkopf für einen halbleiterwafer, poliervorrichtung und polierverfahren

Country Status (6)

Country Link
US (1) US7740521B2 (de)
EP (1) EP1860689B1 (de)
JP (1) JP4756884B2 (de)
KR (1) KR101199888B1 (de)
DE (1) DE602006016409D1 (de)
WO (1) WO2006098150A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5009101B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 基板研磨装置
ES2349495T3 (es) * 2007-05-03 2011-01-04 OERLIKON TEXTILE GMBH & CO. KG Bomba en engranjes.
TWI367524B (en) * 2007-08-01 2012-07-01 Univ Nat Taiwan Science Tech Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof
KR100914604B1 (ko) * 2007-11-28 2009-08-31 주식회사 실트론 연마장치의 웨이퍼 압착 기기
JP5274993B2 (ja) 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
JP5238293B2 (ja) * 2008-02-29 2013-07-17 信越半導体株式会社 研磨ヘッド及び研磨装置並びに研磨方法
JP2009248282A (ja) * 2008-04-10 2009-10-29 Showa Denko Kk 研磨装置及び研磨補助装置、ならびに、研磨方法
KR101057228B1 (ko) * 2008-10-21 2011-08-16 주식회사 엘지실트론 경면연마장치의 가압헤드
US20100112905A1 (en) * 2008-10-30 2010-05-06 Leonard Borucki Wafer head template for chemical mechanical polishing and a method for its use
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
JP5663295B2 (ja) * 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
WO2016093504A1 (ko) * 2014-12-08 2016-06-16 유현정 화학연마장치용 캐리어 헤드의 리테이너링 및 이를 포함하는 캐리어 헤드
JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP6043848B1 (ja) * 2015-08-26 2016-12-14 株式会社フジクラ 研磨装置および研磨方法
US10265829B2 (en) * 2015-10-30 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing system
JP6568491B2 (ja) * 2016-03-02 2019-08-28 信越化学工業株式会社 Ｓｏｉ複合基板の製造方法、及び該方法に用いる研磨装置
US10464185B2 (en) * 2016-03-15 2019-11-05 Ebara Corporation Substrate polishing method, top ring, and substrate polishing apparatus
US10315286B2 (en) 2016-06-14 2019-06-11 Axus Technologi, Llc Chemical mechanical planarization carrier system
TWI584408B (zh) * 2016-09-06 2017-05-21 Long turn nozzle device
CN106670970B (zh) * 2016-12-23 2019-01-01 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种用于cmp设备的抛光垫活化器施压机构及其运行方法
CN110315420A (zh) * 2019-07-11 2019-10-11 王丽娜 一种机械抛光用稳定性好的夹持装置
CN110666675A (zh) * 2019-08-22 2020-01-10 中南钻石有限公司 一种金刚石复合片表面金属皮去除装置及工艺
US11440159B2 (en) * 2020-09-28 2022-09-13 Applied Materials, Inc. Edge load ring

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
JP3045966B2 (ja) 1996-02-16 2000-05-29 株式会社荏原製作所 ポリッシング装置および方法
TW431942B (en) * 1997-04-04 2001-05-01 Tokyo Seimitsu Co Ltd Polishing device
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
DE69813374T2 (de) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co Ltd Halbleiterscheibe Poliervorrichtung mit Halterring
JPH11333711A (ja) * 1998-05-21 1999-12-07 Nikon Corp 研磨ヘッド及びそれを用いた研磨装置
JP3628193B2 (ja) * 1998-12-22 2005-03-09 東芝セラミックス株式会社 研磨装置
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
JP2001079757A (ja) * 1999-09-13 2001-03-27 Toshiba Ceramics Co Ltd 研磨装置
JP2002264005A (ja) * 2001-03-09 2002-09-18 Toshiba Ceramics Co Ltd 半導体ウェーハの研磨方法及びその研磨装置
US6758939B2 (en) * 2001-08-31 2004-07-06 Speedfam-Ipec Corporation Laminated wear ring
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
JP4423656B2 (ja) * 2002-01-25 2010-03-03 Ｔｄｋ株式会社 磁気ヘッドの製造装置及び製造方法
US6796887B2 (en) * 2002-11-13 2004-09-28 Speedfam-Ipec Corporation Wear ring assembly
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置

Also Published As

Publication number Publication date
WO2006098150A1 (ja) 2006-09-21
EP1860689A4 (de) 2009-04-29
US7740521B2 (en) 2010-06-22
KR20070110867A (ko) 2007-11-20
EP1860689A1 (de) 2007-11-28
KR101199888B1 (ko) 2012-11-09
JP2006253560A (ja) 2006-09-21
US20080254720A1 (en) 2008-10-16
JP4756884B2 (ja) 2011-08-24
EP1860689B1 (de) 2010-08-25

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