DE602006004677D1 - Verfahren zum Polieren eines Werkstücks unter Verwendung von elektrolytisch reduziertes Wasser - Google Patents

Verfahren zum Polieren eines Werkstücks unter Verwendung von elektrolytisch reduziertes Wasser

Info

Publication number
DE602006004677D1
DE602006004677D1 DE602006004677T DE602006004677T DE602006004677D1 DE 602006004677 D1 DE602006004677 D1 DE 602006004677D1 DE 602006004677 T DE602006004677 T DE 602006004677T DE 602006004677 T DE602006004677 T DE 602006004677T DE 602006004677 D1 DE602006004677 D1 DE 602006004677D1
Authority
DE
Germany
Prior art keywords
polishing
workpiece
reduced water
electrolytically reduced
electrolytically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006004677T
Other languages
English (en)
Inventor
Unkai Sato
Koichiro Ichikawa
Yoshinobu Nishimoto
Yoshio Nakamura
Tsuyoshi Hasegawa
Masumi Iihama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of DE602006004677D1 publication Critical patent/DE602006004677D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE602006004677T 2005-11-15 2006-11-10 Verfahren zum Polieren eines Werkstücks unter Verwendung von elektrolytisch reduziertes Wasser Active DE602006004677D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005330362 2005-11-15
JP2006280840A JP2007160496A (ja) 2005-11-15 2006-10-16 ワーク研磨装置およびワーク研磨方法

Publications (1)

Publication Number Publication Date
DE602006004677D1 true DE602006004677D1 (de) 2009-02-26

Family

ID=37770932

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006004677T Active DE602006004677D1 (de) 2005-11-15 2006-11-10 Verfahren zum Polieren eines Werkstücks unter Verwendung von elektrolytisch reduziertes Wasser

Country Status (8)

Country Link
US (1) US8333882B2 (de)
EP (1) EP1785228B1 (de)
JP (1) JP2007160496A (de)
KR (1) KR20070051685A (de)
CN (1) CN1966210B (de)
DE (1) DE602006004677D1 (de)
MY (1) MY146979A (de)
TW (1) TW200746280A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6240943B2 (ja) * 2015-11-19 2017-12-06 株式会社岡本工作機械製作所 研磨装置およびそれを用いたＧａＮ基板の研磨加工方法
CN110977622B (zh) * 2019-12-13 2021-04-02 大连理工大学 一种抛光液多点可变位自动滴液的控制方法
CN112975592B (zh) * 2021-03-29 2022-02-15 中国电子科技集团公司第十三研究所 一种磷化铟衬底的抛光工艺

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0822503B2 (ja) 1990-03-30 1996-03-06 新日本製鐵株式会社 化学作用を利用したポリシング法
JP3458341B2 (ja) * 1993-07-12 2003-10-20 有限会社コヒーレントテクノロジー 対イオンよりも水素イオン又は水酸イオンを過剰に含む洗浄水の製造方法及び得られた洗浄水
JP3098661B2 (ja) * 1993-07-28 2000-10-16 キヤノン株式会社 研磨剤組成物及びそれを用いる研磨方法
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
JPH08126873A (ja) * 1994-10-28 1996-05-21 Nec Corp 電子部品等の洗浄方法及び装置
JP3437716B2 (ja) * 1995-06-09 2003-08-18 株式会社東芝 半導体基板の洗浄方法及びこれに用いられる洗浄装置
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
JP3514908B2 (ja) * 1995-11-13 2004-04-05 株式会社東芝 研磨剤
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
JPH10324865A (ja) * 1997-05-23 1998-12-08 Yamaha Corp 研磨剤生成方法及び研磨方法
JP3586364B2 (ja) * 1997-09-01 2004-11-10 日本カーリット株式会社 電解イオン水生成装置、電解イオン水生成方法及び洗浄方法
JP3145347B2 (ja) * 1997-10-22 2001-03-12 株式会社ケミコート 電解イオン水の製造方法および生成水
JPH11245161A (ja) * 1998-02-27 1999-09-14 Kinseki Ltd 研磨材水溶液
JP2000049125A (ja) * 1998-07-29 2000-02-18 Shin Etsu Handotai Co Ltd 半導体シリコン単結晶ウェーハの研磨方法
JP2000049126A (ja) * 1998-07-29 2000-02-18 Shin Etsu Handotai Co Ltd 半導体シリコン単結晶ウェーハの研磨方法
JP4127926B2 (ja) * 1999-04-08 2008-07-30 株式会社荏原製作所 ポリッシング方法
EP1243311A1 (de) * 1999-11-17 2002-09-25 ASAHI MEDICAL Co., Ltd. Membran zur behandlung von blut, behälter zur behandlung von blut und verfahren zur herstellung desselben
JP3914964B2 (ja) * 2000-09-21 2007-05-16 高橋金属株式会社 電解イオン水を混合した水溶性クーラント液及び製造装置
JP2002252189A (ja) * 2001-02-26 2002-09-06 Mitsubishi Materials Silicon Corp 半導体ウェーハ用研磨液
US7429209B2 (en) * 2002-12-26 2008-09-30 Hoya Corporation Method of polishing a glass substrate for use as an information recording medium
JP4560278B2 (ja) * 2003-05-09 2010-10-13 Ｊｓｒ株式会社 非化学機械研磨用水溶液、研磨剤セット及び半導体装置を製造する製造方法
JP2004358618A (ja) * 2003-06-05 2004-12-24 Olympus Corp 光学素子の研磨方法
JP2006167440A (ja) * 2004-11-16 2006-06-29 Yuuho Ikeuchi パチンコ玉研磨装置

Also Published As

Publication number Publication date
EP1785228B1 (de) 2009-01-07
US20070108067A1 (en) 2007-05-17
US8333882B2 (en) 2012-12-18
TW200746280A (en) 2007-12-16
JP2007160496A (ja) 2007-06-28
CN1966210A (zh) 2007-05-23
MY146979A (en) 2012-10-15
EP1785228A1 (de) 2007-05-16
KR20070051685A (ko) 2007-05-18
CN1966210B (zh) 2011-09-14

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