DE602006002864D1 - Verfahren zum Polieren von Werkstücken - Google Patents

Verfahren zum Polieren von Werkstücken

Info

Publication number
DE602006002864D1
DE602006002864D1 DE602006002864T DE602006002864T DE602006002864D1 DE 602006002864 D1 DE602006002864 D1 DE 602006002864D1 DE 602006002864 T DE602006002864 T DE 602006002864T DE 602006002864 T DE602006002864 T DE 602006002864T DE 602006002864 D1 DE602006002864 D1 DE 602006002864D1
Authority
DE
Germany
Prior art keywords
polishing workpieces
workpieces
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006002864T
Other languages
English (en)
Inventor
Norihiko Moriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of DE602006002864D1 publication Critical patent/DE602006002864D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE602006002864T 2005-12-06 2006-12-06 Verfahren zum Polieren von Werkstücken Active DE602006002864D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005351510A JP2007152499A (ja) 2005-12-06 2005-12-06 ワーク研磨方法

Publications (1)

Publication Number Publication Date
DE602006002864D1 true DE602006002864D1 (de) 2008-11-06

Family

ID=37831705

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006002864T Active DE602006002864D1 (de) 2005-12-06 2006-12-06 Verfahren zum Polieren von Werkstücken

Country Status (4)

Country Link
US (1) US8025554B2 (de)
EP (1) EP1795302B1 (de)
JP (1) JP2007152499A (de)
DE (1) DE602006002864D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5222854B2 (ja) * 2007-11-09 2013-06-26 株式会社島精機製作所 裁断機
DE102009052070A1 (de) * 2009-11-05 2011-05-12 Peter Wolters Gmbh Vorrichtung und Verfahren zur Doppelseitenbearbeitung flacher Werkstücke
TWI465317B (zh) * 2012-06-25 2014-12-21 Sumco Corp 工作件的硏磨方法及工作件的硏磨裝置
JP6491024B2 (ja) * 2015-04-20 2019-03-27 不二越機械工業株式会社 両面研磨装置および研磨方法
JP7004026B2 (ja) * 2020-06-12 2022-01-21 株式会社Sumco ワークの両面研磨方法、ワークの製造方法、及びワークの両面研磨装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774348A (en) * 1971-04-30 1973-11-27 Litton Industries Inc Horizontal double disc grinder with anti-vacuum control
US3813828A (en) * 1973-01-05 1974-06-04 Westinghouse Electric Corp Method for controlling finished thickness of planetary-lapped parts
JPS5440391A (en) * 1977-09-06 1979-03-29 Mo Buisushiee Tekhn Uchiritsus Method of lapping group of work pieces and planetary lapping machine
JPS624323A (ja) * 1985-07-01 1987-01-10 Furukawa Electric Co Ltd:The 半導体ウエハの片面鏡面研磨方法
JPH05123962A (ja) * 1991-10-18 1993-05-21 Mitsubishi Materials Corp ラツピング方法
JP3285663B2 (ja) * 1993-05-11 2002-05-27 ファナック株式会社 工具破損検出装置
JP2708022B2 (ja) * 1995-08-21 1998-02-04 日本電気株式会社 研磨装置
EP1704962B1 (de) * 1996-05-30 2008-10-08 Ebara Corporation Poliervorrichtung mit Verriegelungsfunktion
JPH10214808A (ja) * 1997-01-31 1998-08-11 Hitachi Chem Co Ltd 半導体基板の研磨方法
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JPH11207610A (ja) * 1998-01-26 1999-08-03 Speedfam Co Ltd 研磨量制御システム及びその方法
JP2000141208A (ja) * 1998-11-13 2000-05-23 Memc Kk ウェーハの研磨方法
JP3485067B2 (ja) * 2000-05-22 2004-01-13 株式会社村田製作所 ラッピング加工方法およびラッピング装置
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
JP2004283929A (ja) * 2003-03-20 2004-10-14 Shin Etsu Handotai Co Ltd ウエーハ保持用キャリア並びにそれを用いた両面研磨装置及びウエーハの両面研磨方法

Also Published As

Publication number Publication date
EP1795302A1 (de) 2007-06-13
US20070128985A1 (en) 2007-06-07
JP2007152499A (ja) 2007-06-21
US8025554B2 (en) 2011-09-27
EP1795302B1 (de) 2008-09-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition