DE602006003961D1 - Druckempfindliches Klebeblatt und Verfahren zum Bearbeiten von Gegenständen - Google Patents
Druckempfindliches Klebeblatt und Verfahren zum Bearbeiten von GegenständenInfo
- Publication number
- DE602006003961D1 DE602006003961D1 DE602006003961T DE602006003961T DE602006003961D1 DE 602006003961 D1 DE602006003961 D1 DE 602006003961D1 DE 602006003961 T DE602006003961 T DE 602006003961T DE 602006003961 T DE602006003961 T DE 602006003961T DE 602006003961 D1 DE602006003961 D1 DE 602006003961D1
- Authority
- DE
- Germany
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive sheet
- processing objects
- objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257674A JP2007070432A (ja) | 2005-09-06 | 2005-09-06 | 粘着シート及びこの粘着シートを用いた製品の加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006003961D1 true DE602006003961D1 (de) | 2009-01-15 |
Family
ID=37198994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006003961T Active DE602006003961D1 (de) | 2005-09-06 | 2006-09-04 | Druckempfindliches Klebeblatt und Verfahren zum Bearbeiten von Gegenständen |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070054469A1 (de) |
EP (1) | EP1760131B1 (de) |
JP (1) | JP2007070432A (de) |
KR (1) | KR20070027465A (de) |
CN (1) | CN1927978A (de) |
DE (1) | DE602006003961D1 (de) |
TW (1) | TWI318170B (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4837490B2 (ja) | 2006-08-22 | 2011-12-14 | 日東電工株式会社 | 加工用粘着シート |
JP5399625B2 (ja) * | 2007-11-13 | 2014-01-29 | 日東電工株式会社 | 複合フィルム |
JP2011054827A (ja) * | 2009-09-03 | 2011-03-17 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法及び表面保護テープ |
JP5535670B2 (ja) | 2010-01-28 | 2014-07-02 | 富士フイルム株式会社 | 放射線画像検出器の製造方法 |
US20130052460A1 (en) * | 2010-05-17 | 2013-02-28 | Nitto Denko Corporation | Primer composition and pressure-sensitive adhesive sheet |
JP2013177603A (ja) * | 2010-11-30 | 2013-09-09 | Nitto Denko Corp | 表面保護シート |
JP6231254B2 (ja) * | 2010-11-30 | 2017-11-15 | 日東電工株式会社 | 表面保護シート |
JP6045056B2 (ja) * | 2010-11-30 | 2016-12-14 | 日東電工株式会社 | 表面保護シート |
JP6045055B2 (ja) * | 2010-11-30 | 2016-12-14 | 日東電工株式会社 | 表面保護シート |
JP2013147665A (ja) * | 2010-11-30 | 2013-08-01 | Nitto Denko Corp | 表面保護シート |
JP2013147664A (ja) * | 2010-11-30 | 2013-08-01 | Nitto Denko Corp | 表面保護シート |
JP6068438B2 (ja) * | 2012-03-12 | 2017-01-25 | リンテック株式会社 | バックグラインドシート用基材および粘着シート、当該基材およびシートの製造方法、ならびにワークの製造方法 |
JP5992091B2 (ja) * | 2013-03-14 | 2016-09-14 | 三井化学東セロ株式会社 | 離型フィルム |
KR101637862B1 (ko) * | 2013-03-15 | 2016-07-07 | 닛토덴코 가부시키가이샤 | 점착 시트 |
US10253222B2 (en) * | 2014-01-21 | 2019-04-09 | Lintec Corporation | Adhesive sheet for wafer protection |
RU2711811C2 (ru) * | 2014-02-19 | 2020-01-22 | Басф Се | Водная совместная композиция металаксила |
JP6906402B2 (ja) * | 2017-09-07 | 2021-07-21 | 日東電工株式会社 | 半導体ウエハ保護用粘着テープ |
CN207537386U (zh) * | 2017-11-23 | 2018-06-26 | 宁德新能源科技有限公司 | 胶纸 |
JP7152233B2 (ja) * | 2018-09-25 | 2022-10-12 | 日東電工株式会社 | 半導体保護用粘着テープ |
JPWO2020137980A1 (ja) * | 2018-12-25 | 2021-11-18 | 積水化学工業株式会社 | 粘着テープ |
FR3093229B1 (fr) | 2019-02-21 | 2024-04-19 | Commissariat Energie Atomique | Procédé de transfert d’un film mince depuis un substrat sur un support souple |
KR20210149688A (ko) * | 2019-03-29 | 2021-12-09 | 린텍 가부시키가이샤 | 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법 |
JPWO2020203438A1 (de) * | 2019-03-29 | 2020-10-08 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4988742A (en) * | 1988-09-02 | 1991-01-29 | Minnesota Mining And Manufacturing Company | Tackified terpolymer adhesives |
US4943461A (en) * | 1989-02-01 | 1990-07-24 | Minnesota Mining And Manufacturing Company | Radiation-curable pressure-sensitive adhesive having improved adhesion to plasticized vinyl substrates |
US5965256A (en) * | 1997-10-14 | 1999-10-12 | Minnesota Mining And Manufacturing Company | Protective films and coatings |
JP3383227B2 (ja) | 1998-11-06 | 2003-03-04 | リンテック株式会社 | 半導体ウエハの裏面研削方法 |
JP2002069396A (ja) | 2000-08-29 | 2002-03-08 | Mitsui Chemicals Inc | 半導体ウエハ保護用粘着フィルム及びそれを用いる半導体ウエハの裏面加工方法 |
JP4219605B2 (ja) | 2002-03-12 | 2009-02-04 | リンテック株式会社 | 半導体ウエハ加工用粘着シートおよびその使用方法 |
JP2004054008A (ja) * | 2002-07-22 | 2004-02-19 | Nitto Denko Corp | 粘着型光学フィルムおよび画像表示装置 |
JP4195646B2 (ja) | 2002-07-26 | 2008-12-10 | 日東電工株式会社 | 多層シートとその製造方法及びこの多層シートを用いた粘着シート |
KR101016081B1 (ko) * | 2002-07-26 | 2011-02-17 | 닛토덴코 가부시키가이샤 | 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법 |
JP4493296B2 (ja) * | 2002-07-26 | 2010-06-30 | 日東電工株式会社 | 加工用粘着シートとその製造方法 |
US20050153129A1 (en) * | 2002-07-26 | 2005-07-14 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same |
JP2004200451A (ja) | 2002-12-19 | 2004-07-15 | Nitto Denko Corp | 半導体ウエハ加工用保護シート |
JP4341813B2 (ja) * | 2003-05-15 | 2009-10-14 | 日東電工株式会社 | 粘着剤付光学部材、その製造方法および画像表示装置 |
JP2005019518A (ja) * | 2003-06-24 | 2005-01-20 | Nitto Denko Corp | 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法 |
JP4261260B2 (ja) * | 2003-06-26 | 2009-04-30 | 日東電工株式会社 | 半導体ウエハの研削方法および半導体ウエハ研削用粘着シート |
JP4566527B2 (ja) * | 2003-08-08 | 2010-10-20 | 日東電工株式会社 | 再剥離型粘着シート |
JP4666565B2 (ja) * | 2003-10-06 | 2011-04-06 | 日東電工株式会社 | 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法 |
JP4592535B2 (ja) * | 2005-02-23 | 2010-12-01 | 日東電工株式会社 | 多層シートとその製造方法及びこの多層シートを用いた粘着シート |
JP4711777B2 (ja) * | 2005-08-11 | 2011-06-29 | 日東電工株式会社 | 粘着シートとその製造方法、及び、製品の加工方法 |
JP4721834B2 (ja) * | 2005-09-06 | 2011-07-13 | 日東電工株式会社 | 粘着シート及びこの粘着シートを用いた製品の加工方法 |
-
2005
- 2005-09-06 JP JP2005257674A patent/JP2007070432A/ja active Pending
-
2006
- 2006-09-01 US US11/514,454 patent/US20070054469A1/en not_active Abandoned
- 2006-09-01 TW TW095132433A patent/TWI318170B/zh not_active IP Right Cessation
- 2006-09-04 DE DE602006003961T patent/DE602006003961D1/de active Active
- 2006-09-04 CN CNA2006101286340A patent/CN1927978A/zh active Pending
- 2006-09-04 EP EP06018447A patent/EP1760131B1/de not_active Expired - Fee Related
- 2006-09-05 KR KR1020060085306A patent/KR20070027465A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2007070432A (ja) | 2007-03-22 |
CN1927978A (zh) | 2007-03-14 |
EP1760131A1 (de) | 2007-03-07 |
TW200720081A (en) | 2007-06-01 |
EP1760131B1 (de) | 2008-12-03 |
TWI318170B (en) | 2009-12-11 |
KR20070027465A (ko) | 2007-03-09 |
US20070054469A1 (en) | 2007-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |