TWI318170B - Pressure-sensitive adhesive sheet and method of processing articles - Google Patents

Pressure-sensitive adhesive sheet and method of processing articles

Info

Publication number
TWI318170B
TWI318170B TW095132433A TW95132433A TWI318170B TW I318170 B TWI318170 B TW I318170B TW 095132433 A TW095132433 A TW 095132433A TW 95132433 A TW95132433 A TW 95132433A TW I318170 B TWI318170 B TW I318170B
Authority
TW
Taiwan
Prior art keywords
pressure
sensitive adhesive
adhesive sheet
processing articles
articles
Prior art date
Application number
TW095132433A
Other languages
English (en)
Other versions
TW200720081A (en
Inventor
Kohei Yano
Kouji Akazawa
Yoshinori Yoshida
Tomohiro Kontani
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200720081A publication Critical patent/TW200720081A/zh
Application granted granted Critical
Publication of TWI318170B publication Critical patent/TWI318170B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW095132433A 2005-09-06 2006-09-01 Pressure-sensitive adhesive sheet and method of processing articles TWI318170B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005257674A JP2007070432A (ja) 2005-09-06 2005-09-06 粘着シート及びこの粘着シートを用いた製品の加工方法

Publications (2)

Publication Number Publication Date
TW200720081A TW200720081A (en) 2007-06-01
TWI318170B true TWI318170B (en) 2009-12-11

Family

ID=37198994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132433A TWI318170B (en) 2005-09-06 2006-09-01 Pressure-sensitive adhesive sheet and method of processing articles

Country Status (7)

Country Link
US (1) US20070054469A1 (zh)
EP (1) EP1760131B1 (zh)
JP (1) JP2007070432A (zh)
KR (1) KR20070027465A (zh)
CN (1) CN1927978A (zh)
DE (1) DE602006003961D1 (zh)
TW (1) TWI318170B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568825B (zh) * 2012-03-12 2017-02-01 Lintec Corp A backing substrate for a polishing film and a sheet for bonding, a method for manufacturing the substrate and the sheet, and a method of manufacturing the workpiece

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4837490B2 (ja) 2006-08-22 2011-12-14 日東電工株式会社 加工用粘着シート
JP5399625B2 (ja) * 2007-11-13 2014-01-29 日東電工株式会社 複合フィルム
JP2011054827A (ja) * 2009-09-03 2011-03-17 Fujitsu Semiconductor Ltd 半導体装置の製造方法及び表面保護テープ
JP5535670B2 (ja) 2010-01-28 2014-07-02 富士フイルム株式会社 放射線画像検出器の製造方法
WO2011145620A1 (ja) * 2010-05-17 2011-11-24 日東電工株式会社 下塗り剤組成物および粘着シート
JP2013147664A (ja) * 2010-11-30 2013-08-01 Nitto Denko Corp 表面保護シート
JP2013147665A (ja) * 2010-11-30 2013-08-01 Nitto Denko Corp 表面保護シート
JP6045055B2 (ja) * 2010-11-30 2016-12-14 日東電工株式会社 表面保護シート
JP6231254B2 (ja) * 2010-11-30 2017-11-15 日東電工株式会社 表面保護シート
JP2013177603A (ja) * 2010-11-30 2013-09-09 Nitto Denko Corp 表面保護シート
JP6045056B2 (ja) * 2010-11-30 2016-12-14 日東電工株式会社 表面保護シート
WO2014141512A1 (ja) * 2013-03-14 2014-09-18 三井化学東セロ株式会社 離型フィルム
JP5801010B2 (ja) * 2013-03-15 2015-10-28 日東電工株式会社 粘着シート
WO2015111310A1 (ja) * 2014-01-21 2015-07-30 リンテック株式会社 ウエハ保護用粘着シート
AU2015220797B2 (en) * 2014-02-19 2018-08-30 Basf Se Aqueous co-formulation of metalaxyl
JP6906402B2 (ja) * 2017-09-07 2021-07-21 日東電工株式会社 半導体ウエハ保護用粘着テープ
CN207537386U (zh) * 2017-11-23 2018-06-26 宁德新能源科技有限公司 胶纸
JP7152233B2 (ja) * 2018-09-25 2022-10-12 日東電工株式会社 半導体保護用粘着テープ
JPWO2020137980A1 (ja) * 2018-12-25 2021-11-18 積水化学工業株式会社 粘着テープ
FR3093229B1 (fr) * 2019-02-21 2024-04-19 Commissariat Energie Atomique Procédé de transfert d’un film mince depuis un substrat sur un support souple
WO2020203438A1 (ja) * 2019-03-29 2020-10-08 リンテック株式会社 半導体加工用保護シートおよび半導体装置の製造方法
KR20210149688A (ko) * 2019-03-29 2021-12-09 린텍 가부시키가이샤 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4988742A (en) * 1988-09-02 1991-01-29 Minnesota Mining And Manufacturing Company Tackified terpolymer adhesives
US4943461A (en) * 1989-02-01 1990-07-24 Minnesota Mining And Manufacturing Company Radiation-curable pressure-sensitive adhesive having improved adhesion to plasticized vinyl substrates
US5965256A (en) * 1997-10-14 1999-10-12 Minnesota Mining And Manufacturing Company Protective films and coatings
JP3383227B2 (ja) 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP2002069396A (ja) 2000-08-29 2002-03-08 Mitsui Chemicals Inc 半導体ウエハ保護用粘着フィルム及びそれを用いる半導体ウエハの裏面加工方法
JP4219605B2 (ja) 2002-03-12 2009-02-04 リンテック株式会社 半導体ウエハ加工用粘着シートおよびその使用方法
JP2004054008A (ja) * 2002-07-22 2004-02-19 Nitto Denko Corp 粘着型光学フィルムおよび画像表示装置
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
JP4195646B2 (ja) 2002-07-26 2008-12-10 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
US20050153129A1 (en) * 2002-07-26 2005-07-14 Nitto Denko Corporation Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same
JP4493296B2 (ja) * 2002-07-26 2010-06-30 日東電工株式会社 加工用粘着シートとその製造方法
JP2004200451A (ja) 2002-12-19 2004-07-15 Nitto Denko Corp 半導体ウエハ加工用保護シート
JP4341813B2 (ja) * 2003-05-15 2009-10-14 日東電工株式会社 粘着剤付光学部材、その製造方法および画像表示装置
JP2005019518A (ja) * 2003-06-24 2005-01-20 Nitto Denko Corp 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法
JP4261260B2 (ja) * 2003-06-26 2009-04-30 日東電工株式会社 半導体ウエハの研削方法および半導体ウエハ研削用粘着シート
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
JP4666565B2 (ja) * 2003-10-06 2011-04-06 日東電工株式会社 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法
JP4592535B2 (ja) * 2005-02-23 2010-12-01 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP4711777B2 (ja) * 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
JP4721834B2 (ja) * 2005-09-06 2011-07-13 日東電工株式会社 粘着シート及びこの粘着シートを用いた製品の加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568825B (zh) * 2012-03-12 2017-02-01 Lintec Corp A backing substrate for a polishing film and a sheet for bonding, a method for manufacturing the substrate and the sheet, and a method of manufacturing the workpiece

Also Published As

Publication number Publication date
JP2007070432A (ja) 2007-03-22
EP1760131B1 (en) 2008-12-03
EP1760131A1 (en) 2007-03-07
US20070054469A1 (en) 2007-03-08
DE602006003961D1 (de) 2009-01-15
CN1927978A (zh) 2007-03-14
TW200720081A (en) 2007-06-01
KR20070027465A (ko) 2007-03-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees