DE602005003163D1 - Siliciumhaltige Verbindung, Zusammensetzung und Isolierfilm - Google Patents

Siliciumhaltige Verbindung, Zusammensetzung und Isolierfilm

Info

Publication number
DE602005003163D1
DE602005003163D1 DE602005003163T DE602005003163T DE602005003163D1 DE 602005003163 D1 DE602005003163 D1 DE 602005003163D1 DE 602005003163 T DE602005003163 T DE 602005003163T DE 602005003163 T DE602005003163 T DE 602005003163T DE 602005003163 D1 DE602005003163 D1 DE 602005003163D1
Authority
DE
Germany
Prior art keywords
composition
insulating film
silicon
containing compound
integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005003163T
Other languages
English (en)
Other versions
DE602005003163T2 (de
Inventor
Kensuke Morita
Morio Yagihara
Koji Wariishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of DE602005003163D1 publication Critical patent/DE602005003163D1/de
Application granted granted Critical
Publication of DE602005003163T2 publication Critical patent/DE602005003163T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
DE602005003163T 2004-05-31 2005-05-30 Siliciumhaltige Verbindung, Zusammensetzung und Isolierfilm Active DE602005003163T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004161361 2004-05-31
JP2004161361 2004-05-31
JP2005075136 2005-03-16
JP2005075136A JP4610379B2 (ja) 2004-05-31 2005-03-16 ケイ素含有化合物、該化合物を含有する組成物及び絶縁材料

Publications (2)

Publication Number Publication Date
DE602005003163D1 true DE602005003163D1 (de) 2007-12-20
DE602005003163T2 DE602005003163T2 (de) 2008-08-28

Family

ID=35057136

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005003163T Active DE602005003163T2 (de) 2004-05-31 2005-05-30 Siliciumhaltige Verbindung, Zusammensetzung und Isolierfilm

Country Status (6)

Country Link
US (1) US7534904B2 (de)
EP (1) EP1602692B1 (de)
JP (1) JP4610379B2 (de)
KR (1) KR20060048135A (de)
AT (1) ATE377630T1 (de)
DE (1) DE602005003163T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542927B2 (ja) * 2005-03-17 2010-09-15 富士フイルム株式会社 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス
JP2007091844A (ja) * 2005-09-28 2007-04-12 Fujifilm Corp 重合体および膜形成用組成物
JP5003288B2 (ja) * 2007-05-30 2012-08-15 株式会社Ｓｕｍｃｏ シリコンウェーハの評価方法およびシリコンウェーハの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455072A (en) 1992-11-18 1995-10-03 Bension; Rouvain M. Initiation and bonding of diamond and other thin films
JP2000302791A (ja) * 1999-04-20 2000-10-31 Fujitsu Ltd シリコン化合物、絶縁膜形成材料及び半導体装置
JP4026386B2 (ja) * 2001-12-26 2007-12-26 チッソ株式会社 新規高分子化合物、該高分子前駆体、および該高分子前駆体を用いた薄膜形成方法
KR101227664B1 (ko) 2002-01-31 2013-01-29 도소 가부시키가이샤 유기실란화합물을 포함하여 구성되는 절연막용 재료, 그 제조방법 및 반도체장치
US7514709B2 (en) * 2003-04-11 2009-04-07 Silecs Oy Organo-silsesquioxane polymers for forming low-k dielectrics

Also Published As

Publication number Publication date
EP1602692A1 (de) 2005-12-07
DE602005003163T2 (de) 2008-08-28
EP1602692B1 (de) 2007-11-07
ATE377630T1 (de) 2007-11-15
JP4610379B2 (ja) 2011-01-12
US20050267308A1 (en) 2005-12-01
JP2006016596A (ja) 2006-01-19
US7534904B2 (en) 2009-05-19
KR20060048135A (ko) 2006-05-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition