DE602005000529D1 - Steuerschaltung eines Motors - Google Patents
Steuerschaltung eines MotorsInfo
- Publication number
- DE602005000529D1 DE602005000529D1 DE602005000529T DE602005000529T DE602005000529D1 DE 602005000529 D1 DE602005000529 D1 DE 602005000529D1 DE 602005000529 T DE602005000529 T DE 602005000529T DE 602005000529 T DE602005000529 T DE 602005000529T DE 602005000529 D1 DE602005000529 D1 DE 602005000529D1
- Authority
- DE
- Germany
- Prior art keywords
- engine
- control circuit
- circuit
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electrical Control Of Air Or Fuel Supplied To Internal-Combustion Engine (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004206218A JP2006032490A (ja) | 2004-07-13 | 2004-07-13 | エンジン制御回路装置 |
JP2004206218 | 2004-07-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005000529D1 true DE602005000529D1 (de) | 2007-03-22 |
DE602005000529T2 DE602005000529T2 (de) | 2007-11-22 |
Family
ID=35355771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005000529T Expired - Fee Related DE602005000529T2 (de) | 2004-07-13 | 2005-07-13 | Steuerschaltung eines Motors |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060012034A1 (de) |
EP (1) | EP1626616B1 (de) |
JP (1) | JP2006032490A (de) |
CN (1) | CN1722431A (de) |
DE (1) | DE602005000529T2 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4478007B2 (ja) * | 2004-12-16 | 2010-06-09 | 日立オートモティブシステムズ株式会社 | 電子回路装置及びその製造方法 |
EP1761114A3 (de) | 2005-08-31 | 2009-09-16 | Kabushiki Kaisha Toyota Jidoshokki | Leiterplatte |
US9713258B2 (en) * | 2006-04-27 | 2017-07-18 | International Business Machines Corporation | Integrated circuit chip packaging |
JP4948160B2 (ja) * | 2006-12-29 | 2012-06-06 | 三洋電機株式会社 | 回路モジュール |
TWM315956U (en) * | 2006-12-29 | 2007-07-21 | Bothhand Entpr Inc | Improved structure of composite circuit substrate |
JP4864742B2 (ja) * | 2007-01-29 | 2012-02-01 | 日立オートモティブシステムズ株式会社 | モジュール装置 |
JP5247045B2 (ja) * | 2007-02-22 | 2013-07-24 | サンデン株式会社 | インバータ一体型電動圧縮機の製造方法 |
DE102007019098B4 (de) * | 2007-04-23 | 2020-02-13 | Continental Automotive Gmbh | Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau |
JP4942541B2 (ja) * | 2007-04-25 | 2012-05-30 | 日立オートモティブシステムズ株式会社 | 電気電子モジュールおよびその製造方法 |
JP5098772B2 (ja) * | 2007-06-29 | 2012-12-12 | ダイキン工業株式会社 | 電装品ユニット |
KR101387549B1 (ko) * | 2007-09-03 | 2014-04-24 | 삼성전자주식회사 | 인쇄회로기판 및 그의 제조 방법, 및 이를 갖는 메모리모듈 및 그의 제조 방법 |
JP4884406B2 (ja) * | 2008-01-28 | 2012-02-29 | 日立オートモティブシステムズ株式会社 | 樹脂封止型電子モジュール及びその樹脂封止成形方法 |
JP5038271B2 (ja) * | 2008-09-10 | 2012-10-03 | 日立オートモティブシステムズ株式会社 | 電気電子制御装置及びその製造方法 |
JP5203894B2 (ja) * | 2008-11-10 | 2013-06-05 | 本田技研工業株式会社 | エンジンの電子制御ユニット |
DE102008043774A1 (de) | 2008-11-17 | 2010-05-20 | Robert Bosch Gmbh | AVT-Technik mit Transfermolding |
JP5110049B2 (ja) * | 2009-07-16 | 2012-12-26 | 株式会社デンソー | 電子制御装置 |
JP2011100718A (ja) * | 2009-10-05 | 2011-05-19 | Yazaki Corp | コネクタ |
DE102010002140A1 (de) * | 2010-02-19 | 2011-08-25 | Robert Bosch GmbH, 70469 | Verlustwärmeableitung für Leistungsbauelemente |
JP5165012B2 (ja) * | 2010-02-22 | 2013-03-21 | 三菱電機株式会社 | 樹脂封止形電子制御装置及びその製造方法 |
DE102010002947A1 (de) * | 2010-03-17 | 2011-09-22 | Robert Bosch Gmbh | Steuergerät |
JP5019646B2 (ja) * | 2010-04-28 | 2012-09-05 | 日本サーモスタット株式会社 | 内燃機関における冷却水通路装置 |
US8966759B1 (en) * | 2010-06-25 | 2015-03-03 | Maxq Technology, Llc | Method of making a fluid cooled assembly |
JP5533350B2 (ja) * | 2010-06-30 | 2014-06-25 | 株式会社デンソー | 半導体装置及びその製造方法 |
CN102316699B (zh) * | 2010-07-07 | 2015-10-14 | 富泰华工业(深圳)有限公司 | 冷却方法、使用该冷却设备方法的电路板维修装置及设备 |
JP5335749B2 (ja) * | 2010-09-28 | 2013-11-06 | 本田技研工業株式会社 | エンジン制御装置 |
NL2005718C2 (en) * | 2010-11-18 | 2012-05-22 | Isaka Ltd | Cooling system for a data centre as well as such a data centre. |
US8929081B2 (en) * | 2011-03-11 | 2015-01-06 | Marvell Israel (M.I.S.L) Ltd. | Heat dissipating high power systems |
JP5449249B2 (ja) * | 2011-04-26 | 2014-03-19 | 三菱電機株式会社 | 電子制御装置 |
US8730675B2 (en) * | 2011-08-25 | 2014-05-20 | Sony Corporation | Electronic device and method of radiating heat from electronic device |
DE102011113929B4 (de) * | 2011-09-21 | 2016-11-24 | Oechsler Aktiengesellschaft | Elektromechanischer Schaltungsaufbau |
EP2584876A1 (de) * | 2011-10-21 | 2013-04-24 | Thales Nederland B.V. | System zum schnellen und genauen Auffüllen einer Vorrichtung zur zweiphasigen Kühlung, insbesondere eines Wärmerohrs, das zur Verwendung in einem automatischen Verfahren angepasst ist |
US8736048B2 (en) * | 2012-02-16 | 2014-05-27 | International Business Machines Corporation | Flexible heat sink with lateral compliance |
FR2987495B1 (fr) * | 2012-02-23 | 2014-02-14 | Thales Sa | Canaux de circulation d'un fluide dans une carte imprimee a structure multicouche |
JP2014093414A (ja) * | 2012-11-02 | 2014-05-19 | Hitachi Automotive Systems Ltd | 電子制御装置 |
DE102013206256A1 (de) | 2013-04-10 | 2014-10-16 | Zf Friedrichshafen Ag | Verfahren zur Herstellung eines Steckers |
JP6271164B2 (ja) * | 2013-06-17 | 2018-01-31 | 日立オートモティブシステムズ株式会社 | 箱型車載制御装置 |
DE102013212446A1 (de) * | 2013-06-27 | 2015-01-15 | Zf Friedrichshafen Ag | Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung zur Ansteuerung einer Last |
US9385059B2 (en) * | 2013-08-28 | 2016-07-05 | Infineon Technologies Ag | Overmolded substrate-chip arrangement with heat sink |
EP2884829A1 (de) * | 2013-12-12 | 2015-06-17 | Continental Automotive GmbH | Gehäuse |
WO2015098569A1 (ja) | 2013-12-26 | 2015-07-02 | 矢崎総業株式会社 | 電子回路ユニット及びその製造方法 |
US9357670B2 (en) * | 2014-02-18 | 2016-05-31 | Lockheed Martin Corporation | Efficient heat transfer from conduction-cooled circuit cards |
JP5865408B2 (ja) * | 2014-02-26 | 2016-02-17 | 京セラ株式会社 | 電子機器 |
JP6265260B2 (ja) * | 2014-02-28 | 2018-01-24 | 株式会社村田製作所 | 電源モジュール |
EP3065516B1 (de) * | 2015-03-03 | 2019-01-02 | Simoldes Plásticos, SA | Mehrschichtiges polymerspritzgussteil mit einer elektrischen schaltung, herstellungsverfahren dafür |
US9293870B1 (en) * | 2015-03-10 | 2016-03-22 | Continental Automotive Systems, Inc. | Electronic control module having a cover allowing for inspection of right angle press-fit pins |
DE102015207310A1 (de) * | 2015-04-22 | 2016-10-27 | Zf Friedrichshafen Ag | Elektronikmodul und Verfahren zum Umkapseln desselben |
DE102015207867A1 (de) | 2015-04-29 | 2016-11-03 | Robert Bosch Gmbh | Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul |
US10641409B2 (en) * | 2015-08-31 | 2020-05-05 | Hitachi Automotive Systems, Ltd. | Driver and driver-integrated electric actuator |
US10517181B2 (en) | 2015-09-29 | 2019-12-24 | Hitachi Automotive Systems, Ltd. | Electronic control device and manufacturing method for same |
EP3182045B1 (de) * | 2015-12-14 | 2023-01-25 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Komponententräger mit eingebettetem wärmerohr und verfahren zur herstellung |
WO2017127109A1 (en) | 2016-01-22 | 2017-07-27 | Hewlett Packard Enterprise Development Lp | Routing a cooling member along a board |
US20170287838A1 (en) * | 2016-04-02 | 2017-10-05 | Intel Corporation | Electrical interconnect bridge |
DE102016211637A1 (de) * | 2016-06-28 | 2017-12-28 | Robert Bosch Gmbh | Elektronikeinheit und Verfahren zur Ausbildung einer Elektronikeinheit |
FR3056712B1 (fr) * | 2016-09-27 | 2019-07-12 | Valeo Systemes Thermiques | Dispositif d’echange thermique pour un vehicule automobile, associant un module thermoelectrique et un echangeur de chaleur a circulation d’un fluide |
GB2554735A (en) * | 2016-10-07 | 2018-04-11 | Jaguar Land Rover Ltd | Control unit |
DE112017005077T5 (de) * | 2016-10-07 | 2019-06-19 | Jaguar Land Rover Limited | Steuergerät |
CN110087851B (zh) * | 2016-12-22 | 2024-04-12 | 日立安斯泰莫株式会社 | 电子控制装置 |
JP6852649B2 (ja) * | 2017-10-24 | 2021-03-31 | 株式会社オートネットワーク技術研究所 | 回路構成体及び回路構成体の製造方法 |
CN116685134A (zh) * | 2017-10-26 | 2023-09-01 | 三菱电机株式会社 | 散热器以及回路装置 |
DE102018218967A1 (de) * | 2018-04-25 | 2019-10-31 | Mitsubishi Electric Corporation | Elektronikvorrichtungseinheit |
CN108718509B (zh) * | 2018-05-31 | 2020-06-26 | 湖北省雄雄电子科技有限公司 | 一种具备高散热性能的电动车控制器 |
WO2019245148A1 (ko) * | 2018-06-20 | 2019-12-26 | 엘지이노텍 주식회사 | 컨버터 |
DE102018214474A1 (de) * | 2018-08-27 | 2020-02-27 | Robert Bosch Gmbh | Elektronikmodul und Verfahren zum Fertigen desselben |
DE102018217456B4 (de) * | 2018-10-11 | 2020-07-09 | Conti Temic Microelectronic Gmbh | Elektronische Steuervorrichtung und Verfahren zur Herstellung einer elektronischen Steuervorrichtung |
US11166363B2 (en) * | 2019-01-11 | 2021-11-02 | Tactotek Oy | Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node |
DE102019111366B3 (de) * | 2019-05-02 | 2020-05-14 | Fachhochschule Kiel | Kompaktes Leistungselektronik-Modul mit vergrößerter Kühlfläche |
KR20210058074A (ko) * | 2019-11-13 | 2021-05-24 | 엘지이노텍 주식회사 | 컨버터 |
US11309676B2 (en) * | 2020-05-12 | 2022-04-19 | Tactotek Oy | Integrated multilayer structure and a method for manufacturing a multilayer structure |
DE102020215142B4 (de) | 2020-12-01 | 2022-09-22 | Vitesco Technologies Germany Gmbh | Leistungshalbleitermodul und Antriebsstrang für ein Fahrzeug aufweisend ein derartiges Leistungshalbleitermodul |
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DE102021205038A1 (de) | 2021-05-18 | 2022-11-24 | Robert Bosch Gesellschaft mit beschränkter Haftung | Steckerelement und Elektronikmodul |
KR102590521B1 (ko) * | 2021-06-23 | 2023-10-17 | 중앙대학교 산학협력단 | 반도체 패키징 |
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-
2004
- 2004-07-13 JP JP2004206218A patent/JP2006032490A/ja active Pending
-
2005
- 2005-07-12 CN CNA200510083671XA patent/CN1722431A/zh active Pending
- 2005-07-12 US US11/178,407 patent/US20060012034A1/en not_active Abandoned
- 2005-07-13 EP EP05015217A patent/EP1626616B1/de not_active Expired - Fee Related
- 2005-07-13 DE DE602005000529T patent/DE602005000529T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060012034A1 (en) | 2006-01-19 |
CN1722431A (zh) | 2006-01-18 |
EP1626616A1 (de) | 2006-02-15 |
DE602005000529T2 (de) | 2007-11-22 |
EP1626616B1 (de) | 2007-01-31 |
JP2006032490A (ja) | 2006-02-02 |
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