EP3065516B1 - Mehrschichtiges polymerspritzgussteil mit einer elektrischen schaltung, herstellungsverfahren dafür - Google Patents
Mehrschichtiges polymerspritzgussteil mit einer elektrischen schaltung, herstellungsverfahren dafür Download PDFInfo
- Publication number
- EP3065516B1 EP3065516B1 EP15169245.6A EP15169245A EP3065516B1 EP 3065516 B1 EP3065516 B1 EP 3065516B1 EP 15169245 A EP15169245 A EP 15169245A EP 3065516 B1 EP3065516 B1 EP 3065516B1
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- EP
- European Patent Office
- Prior art keywords
- injection
- laminated foil
- article
- car
- article according
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present disclosure relates to a polymeric multi-layered injection-moulded article with an electric circuit, in particular for lighting and sensing performances for the interior of a vehicle, the interior compartment of a vehicle and/or for the identification of a possible obstacle for a driver.
- the present disclosure also relates to a process to obtain a final article - an injected plastic article and an injected plastic covered by a textile layer, and production methods thereof.
- the DE102011105190 A1 and DE102011117985 A1 concern to a plastic part and a method for producing it for use in automotive industry.
- the DE102011105190 A1 regards in particular to a transparent plastic part, while the DE102011117985 A1 document concerns an electronic device with a plastic part-integrated touch sensor.
- US2010246146 refers to a method of producing an electronic device and includes a holding of a circuit board and a decoration sheet in a cavity of a mould, and a filling and solidifying the thermosetting resin in the cavity.
- US2006198128 refers to methods and means for embedding electronic components, such as LED-based light sources and associated control circuitry, into moulded or continuously cast surface materials.
- the document DE102013101064 A1 relates to a film with at least one electrical or electronic function layer.
- the documents previously mentioned present several shortcomings, which the present disclosure overcomes.
- the documents refer to metal mesh printed on a polyethylene terephthalate (PET) with a screen print roll-to-roll (R2R) system.
- PET polyethylene terephthalate
- R2R screen print roll-to-roll
- the technology used is the vacuum in-mould labelling and the plastic used is a transparent ABS thermoplastic.
- the fabricated piece is entirely made of plastic and includes a touch-sensitive panel with integrated sensing.
- One aspect of the present invention relates to a polymeric multi-layered injection-moulded article comprising an electric circuit, said article comprising:
- the crimped connectors enable a direct connection to the external surface of the injection-moulded article, for example by soldering conductive wiring, dispensing with recesses or scraping injection material to reach the circuit electric contacts.
- a polymeric multi-layered injection-moulded article that may further comprise one or more electronic components disposed on the same side of the support layer as the circuit trace or traces, said components being electrically connected to said circuit trace or traces and said electronic components have been also laminated together in the laminated foil.
- the laminated foil may be embedded in the injection-moulded part with the encapsulation layer facing the injection-moulded part.
- the encapsulation layer may be transparent or translucent white or translucent coloured.
- the laminated foil may be embedded in the injection-moulded part with the support layer facing the injection-moulded part.
- the laminated foil the support layer may be transparent or translucent white or translucent coloured.
- the laminated foil may further comprise a secondary encapsulation layer covering the crimping connectors in the area of the support layer where the crimping connectors protrude.
- the encapsulation layer can be extended to the area of the support layer where the crimping connectors protrude.
- the laminated foil further comprises a secondary encapsulation layer covering the crimping connectors in the area of the encapsulation layer where the crimping connectors protrude.
- the electronic components may be light-emitting diodes - LED's, electroluminescent lamps, resistors or a combination thereof.
- the conductive circuit traces printed may use a silver based paste.
- the electronic components are electrically connected to said circuit trace or traces by silver based paste or by secondary crimping connectors.
- the article may further comprise a textile or non-textile material or their mixtures covering the injection-moulded part (2), in particular on the opposite side of the side where the laminated foil is embedded.
- the final piece could comprise a single or a multi-layer structure.
- the multi-layer structures may involve two or three layers namely: decorative fabric, foam (ex.: PUR, coPA, co PES) and a backing material, that could be assembled by flat-bed, hot-melt or flamebonding processes.
- the textile material may be one of the following:
- the thickness of the support layer may vary between 25 - 150 micrometres, preferably between 50 - 125 micrometres, more preferably between 75 - 105 micrometres.
- the thickness of the laminated foil may vary between 100 - 2000 micrometres, preferably between 100 - 1000 micrometres, more preferably between 170 - 800 micrometres.
- the support layer may be provided with an adhesive layer.
- the support layer may be a polymeric material selected from a list consisting of: polyolefins and polyesters, more preferable polyethylene, polypropylene, and polyethylene terephthalate, polyethylene terephthalate glycol, or mixtures thereof.
- the support layer (5) is one of the following YupoTM FPU 80, YupoTM AISE 105, YupoTM IHC 75, Adhesive PETG, PET Hostaphan and/or PET Melinex.
- the encapsulation material may be polyethylene terephthalate glycol.
- the encapsulation layer (8) may be provided with an adhesive layer.
- the article may be a car pillar, a car door panel, a car door, a car armrest, a car console, a car instrument panel, a car glove box compartment, a car trunk door, a car trunk panel, or baby seat car or an electric home appliance.
- the polymeric multi-layered injection-moulded article of the present invention is obtained by in-mould labelling, in some embodiments the injection-moulded article may further comprise a textile.
- An aspect of the disclosure relates to a method for producing a polymeric multi-layered injection-moulded article comprising an electric circuit, said method comprising the following steps:
- An embodiment comprises, before closing the mould, placing of a textile material in the mould and attaching to the mould, in particular at an opposite location in respect of the laminated foil.
- the adhesive is a liquid or semi solid adhesive.
- the encapsulating is with 1-5 bar pressure and 20-120 °C temperature, more preferably 3 - 4 bar.
- the article is a car pillar, a car door panel, a car door, a car armrest, a car console, a car instrument panel, a car glove box compartment, a car trunk door, or a car trunk panel, or baby seat car or an electric home appliance.
- the removable protective layer element (8') is obtained from the protective carrier layer of the encapsulation layer (8) or of the support layer (5).
- a PCB is attached to the crimping connectors, in particular by soldering/bonding and or welding and conductive solid state bonding materials, or by coupling connectors to the crimping connectors.
- a silver paste to print in proper substrates using a sheet to sheet or a R2R system and wherein the encapsulation is made using proper labels.
- the technology used involves electric discharge IML, the injection process is possible to be scale-up and the polymers may be used with or without charge/filler, with and without colouring dyes.
- the plastic piece may be covered with textile substrate, which none of the mentioned documents refer or purpose. The plastic piece may be used for sensing and lighting.
- IML in-mould labelling
- the IML products comprise a label, which may be a polymeric film, on which a decorative pattern is printed.
- a label which may be a polymeric film, on which a decorative pattern is printed.
- the adhesion of such labels to a polymeric article can be enhanced by applying a heat sealable layer (e.g. a film or a coating) onto the backing side (i.e., not printed surface) of the in-mould label which is to be in contact with the polymeric article.
- the in-mould label may be cut to the desired shape and size from a larger sheet of the label material, using label cutting apparatus.
- the present disclosure allows to improve the lighting and sensing performances for the interior of a vehicle, the interior compartment of a vehicle and/or for the identification of a possible obstacle for a driver using articles obtained by IML.
- This disclosure has a wide range of applications in the automobile sector as it may be applied in decorative lighting, in low lighting applications, in normal lighting applications and in sensing applications.
- Decorative lighting and low lighting are understood as applications designed with the purpose of, for example, indicating the presence of objects, attract the attention of the driver, and/or make the ambient more comfortable.
- Lighting applications are understood as all the application wherein the lighting is used for illuminating the dark areas of a given vehicle, for example, and facilitate the search of objects.
- Sensing applications are understood as applications wherein in low-light environments, a proximity sensor is able to activate a light indicating the position of a given object (such as the open/close window status). Also sensing applications are applications to open/ close the door car window or open the glove compartment, for example.
- the polymeric multi-layered injection-moulded article describes said article comprising a laminated foil; an injection-moulded part (2), in which the laminated foil has been embedded by injection-moulding, flush with one surface of the injection-moulded part; wherein said laminated foil comprises: a circuit support layer (5) composed of a thin flexible sheet of polymeric material; one or more electrically conductive circuit traces (4) printed on one side of said support layer; one or more electrically conductive crimping connectors (3), each crimped to the support layer and a conductive circuit trace; an encapsulation layer (8) composed of a thin flexible sheet of polymeric material, wherein said support layer, circuit traces, crimping connectors and encapsulation layer have been laminated together in the laminated foil; and wherein the crimping connectors and the encapsulation layer are located such that the crimping connectors are directly the injection-moulded part.
- the polymeric multi-layered injection-moulded article describes a circuit support layer (substrate), the silver paste, the electric material, the electronic material, and the encapsulation substrate are properly assembled; the injection process by IML may be conducted and the end piece is obtained.
- the circuit support layer may comprise polymeric base materials, like polyolefin such as polypropylene (PP), or polyethylene (PE); or polyesters, such us polyethylene terephthalate (PET) and polyethylene terephthalate glycol (PETG).
- polymeric base materials like polyolefin such as polypropylene (PP), or polyethylene (PE); or polyesters, such us polyethylene terephthalate (PET) and polyethylene terephthalate glycol (PETG).
- Table 1 Examples of material of the circuit support layer (substrate) Substrate Thickness ( ⁇ m) Base material Colour Yupo®FPU 80 80 PP white Yupo®AISE 105 105 PP or PE white Yupo®IHC 75 75 PP or PE transparent Adhesive PETG 96 PETG transparent PET Hostaphan 75 PET transparent PET Melinex 125 PET thermally stabilized transparent
- circuit support layer may be transparent, white or coloured, according to the final application of the end-product. Transparent, white or coloured when have a textile as decorative layer; White or coloured or transparent when the injected plastic is the decorative layer, for example.
- circuit support layer in table 1 several examples of the circuit support layer (substrate) may be one of the following: Yupo®AISE and Yupo®IHC substrates are labels largely used in the IML process, and compatible with it.
- the PETG is not largely used, however it is still compatible with the IML process.
- PET substrates are not used with the IML process because they do not adhere to the injected plastic.
- PET substrates were also used because they show advantages during the printing process of the support layer, namely during the drying step it is possible to use higher temperatures (140 °C - 160 °C) than when other substrates are used.
- Some substrates such as Yupo and PETG may have a temperature limitation, as 130 °C which not be exceeded as the properties of the substrate used could be compromised.
- the PET substrates are highly transparent, which depending on the final application is an advantage to the use of PET instead of other substrates.
- At least one substrate, the support layer or the encapsulation substrate, must be compatible with the IML process as this will enable the multilayered structure to adhere to the mould.
- the encapsulation substrate used in the solution now disclosed was adhesive PETG and all the samples were encapsulated. Encapsulation is done through a laminating process under pressure at room temperature. Other kinds of encapsulation substrate may be used, like polyolefins or other polyesters films; however they need to have an adhesive layer (pressure activated at room or higher temperatures - till 140 °C). The encapsulation step is performed because silver tracks oxidize in contact with air, disenabling the electric conduction signal.
- support layer (substrates) used for encapsulation layer may be transparent, white or coloured.
- Table 2 illustrates individual thicknesses of the support layer (75-125 ⁇ m), the electric or electronic materials (5 -838 ⁇ m, preferably 50 - 212 ⁇ m), as well as the laminated foil (174-790 ⁇ m) and some examples of the material used.
- Table 2 Examples of individual layer materials and thicknesses Material Thickness ( ⁇ m) Yupo®FPU 80 80 Yupo®AISE 105 105 Yupo® IHC 75 75 PET Hostaphan GN 50 4660 75 PET Melinex ST504 125 Adhesive PETG 96 Adhesive PETG + substrate 96+56 (152) Dried silver layer 5 Male crimping 212 Miniaturized LED 400 Resistor 450 EL 338-838 Multilayer deposited on Yupo®FPU with or without LEDs 174-695 Multilayer deposited on Yupo®AISE with or without LEDs 204-697 Multilayer deposited on Yupo®IHC with or without LEDs 181-710 Multilayer deposited on PET Hostaphan GN 50 4660 with or without LEDs 175-790 Multilayer deposited on PET Melinex ST504 with or without LEDs 229-738
- the process to integrate sensing and lighting using the IML process inhere disclosed comprises the following steps:
- the adhesive used may be liquid to enable the use of the dispensing equipment.
- the adhesive may be transparent, translucent or coloured if, for example, it is to be placed on the LED light direction or it may be coloured.
- the adhesive used in the process disclosed is an adhesion promoter indicated for polyolefin (PP or PE). Adhesive film can also be used.
- Each plastic piece with label/ EL lamps incorporated presents a PCB (or a insert) which controls all the system.
- the injection-moulded part will protect the label/ ELs lamps, and PCB.
- said insert may include an insulating film, like polyvinyl chloride (usually material thickness is 600 ⁇ m; or between 200-1300 ⁇ m) or other material with identical dielectric properties (200-1300 ⁇ m).
- an insulating film like polyvinyl chloride (usually material thickness is 600 ⁇ m; or between 200-1300 ⁇ m) or other material with identical dielectric properties (200-1300 ⁇ m).
- male crimpings are soldered to PCB.
- the said insert article may be soldered, bonded or clipped to the injection moulded part
- the laminated foil is cut to size with laser equipment, wherein the final structures may be formed by:
- ELs electroluminescent lamps
- Figure 2 The ELs are multi-layered printed structures that can have the design and size indicated for each application. In the EL contacts it is crimp male crimping. This will enable the connection between EL lamp and electronic components after injection process.
- the articles disclosed allows to obtain:
- the structures without LEDs and ELs have the functions of conductive track and sensing.
- the structures with LEDs and ELs with conductive tracks have the functions of lighting, conductive tracks and sensing, while the structures with ELs without conductive tracks have the function of lighting.
- substrates, electric materials and multilayer structures may have different thickness:
- the industrial injection conditions may include within the following general conditions:
- the present disclosure for injected plastics may have several uses in decorative material, automotive industrial: decorative lighting / low lighting applications; lighting sensing.
- the articles of the present subject-matter in decorative lighting and in low lighting applications may be applied in pillars, car doors, armrests, consoles, glove box compartments, car trunks, instrument panels or other plastic injected articles with the purpose of illuminating dark areas of a given vehicle and therefore facilitating the search of objects on the vehicle, vehicle entrance or other.
- the functionality of these plastic injected articles is to indicate the presence of an object, attract the attention of the driver, make the ambient more cosy or other.
- the developments may be applied in pillars, car doors, armrests, consoles, instrument panels or other plastic injection-moulded article with the purpose of a proximity sensor activating a light indicating the cup holder location in low light environments, open the glove box compartment, actuation on the car window or other.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Claims (17)
- Ein mehrschichtiger polymerer Spritzgussartikel mit einer elektrischen Schaltung, wobei der genannte Artikel umfasst:eine Verbundfolie;ein Spritzgussteil (2), in das die Verbundfolie durch Spritzgießen eingebettet ist und bündig mit einer Oberfläche des Spritzgussteils abschließt;wobei die genannte Verbundfolie umfasst:eine Trägerschicht für Schaltkreise (5), bestehend aus einer dünnen, flexiblen Folie aus Polymerwerkstoff;eine oder mehrere elektrische Leiterbahnen (4), die auf einer Seite der genannten Trägerschicht (5) aufgedruckt sind;eine oder mehrere elektrisch leitende Crimpverbinder (3), die jeweils mit der Trägerschicht (5) und einer Leiterbahn (4) vercrimpt sind;eine Verkapselungsschicht (8) bestehend aus einer dünnen, flexiblen Folie aus Polymerwerkstoff,dadurch gekennzeichnet, dass die genannte Trägerschicht (5) Leiterbahnen (4), Crimpvebinder (3) und Verkapselungsschicht (8) in der Verbundfolie aufeinander laminiert sind; undwobei die Crimpverbinder (3) und die Verkapselungsschicht (8) so angeordnet sind, dass die Crimpverbinder (3) aus der äußersten Schicht des Spritzgussartikels herausstehen,wobei die Verbundfolie in das Spritzgussteil (2) eingebettet und die Verkapselungsschicht (8) dem Spritzgussteil (2) zugewandt ist,wobei die Verbundfolie ferner ein abnehmbares Schutzschichtelement (8') umfasst, das die Crimpverbinder (3) und die Trägerschicht (5) in dem Bereich abdeckt, in dem die Crimpverbinder (3) herausstehen, so dass die Verbundfolie kein leitendes Element auf ihrer Außenseite aufweist.
- Artikel nach Anspruch 1, der ferner ein oder mehrere elektronische Bauteile (6, 7) umfasst, die auf derselben Seite der Trägerschicht (5) wie die Leiterbahn oder Leiterbahnen (4) angeordnet sind, wobei die genannten Bauteile (6, 7) mit der Leiterbahn oder den Leiterbahnen (4) elektrisch verbunden sind und die genannten elektronischen Bauteile (6, 7) ebenfalls in der Verbundfolie aufeinander laminiert sind.
- Artikel nach dem vorangehenden Anspruch, wobei die Verkapselungsschicht (8) transparent oder weiß oder farbig durchscheinend ist.
- Artikel nach Anspruch 1 oder 2, wobei die Verbundfolie in das Spritzgussteil (2) eingebettet und die Trägerschicht (5) dem Spritzgussteil (2) zugewandt ist.
- Artikel nach dem vorangehenden Anspruch, wobei die Verbundfolie ferner eine sekundäre Verkapselungsschicht (9) umfasst, die die Crimpverbinder (3) und die Trägerschicht (5) in dem Bereich, in dem die Crimpverbinder (3) herausstehen, abdeckt.
- Artikel nach einem der Ansprüche 4 - 5, wobei die Verbundfolie ferner ein abnehmbares Schutzschichtelement (8') umfasst, das die Crimpverbinder (3) und die Leiterbahnen (4) in dem Bereich abdeckt, in dem die Crimpverbinder (3) herausstehen, so dass die Verbundfolie kein leitendes Element auf ihrer Außenseite aufweist.
- Artikel nach einem der vorangehenden Ansprüche, wobei die elektronischen Bauteile Leuchtdioden - LEDs, Elektrolumineszenzlampen, Widerstände oder eine Kombination davon sind.
- Artikel nach einem der vorangehenden Ansprüche, wobei die Leiterbahnen (4) mit einer Paste auf Silberbasis aufgedruckt werden.
- Artikel nach einem der vorangehenden Ansprüche, wobei die elektronischen Bauteile mit der genannten Leiterbahn oder den genannten Leiterbahnen durch eine Paste auf Silberbasis oder durch sekundäre Crimpverbinder elektrisch verbunden sind.
- Artikel nach den vorangehenden Ansprüchen ferner umfassend ein textiles oder nicht textiles Material oder deren Mischungen, die das Spritzgussteil (2) abdecken.
- Artikel nach einem der vorangehenden Ansprüche, wobei die Stärke der Trägerschicht (5) zwischen 25 - 150 Mikrometern, vorzugsweise zwischen 50 - 125 Mikrometern, besonders bevorzugt zwischen 75 - 105 Mikrometern liegt.
- Artikel nach einem der vorangehenden Ansprüche, wobei die Stärke der Verbundfolie zwischen 100 - 2000 Mikrometern, vorzugsweise zwischen 150 - 1000 Mikrometern, besonders bevorzugt zwischen 170 - 800 Mikrometern liegt.
- Artikel nach einem der vorangehenden Ansprüche, wobei die Trägerschicht (5) ein Polymerwerkstoff ist, der aus einer im Folgenden genannten Liste ausgewählt wird: Polyolefin, Polyethylen, Polypropylen, Polyester, Polyethylenterephthalat, Polyethylenterephthalatglykol oder Mischungen davon.
- Artikel nach den vorangehenden Ansprüchen, wobei das Verkapselungsmaterial Polyethylenterephthalatglykol ist.
- Artikel nach den vorangehenden Ansprüchen, wobei das Teil die Säule eines Autos, eine Autotürverkleidung, eine Autotür, eine Autoarmlehne, eine Autokonsole, eine Autoinstrumententafel, ein Autohandschuhfach, eine Autokofferraumklappe oder eine Autokofferraumverkleidung oder ein Kindersitz für Autos oder ein elektrisches Haushaltsgerät ist.
- Auto, das ein in einem der vorangehenden Ansprüche beschriebenes Teil umfasst.
- Verfahren zur Herstellung eines mehrschichtigen polymeren Spritzgussartikels mit einer elektrischen Schaltung, wobei das genannte Verfahren folgende Schritte umfasst:Einlegen einer Verbundfolie, wie in einem der Ansprüche 1-16 beschrieben, in eine Spritzgussform des Artikels, wobei die Verbundfolie ferner mit einem abnehmbaren Schutzschichtelement (8') ausgestattet ist, das die Crimpverbinder (3) in dem Bereich abdeckt, in dem die Crimpverbinder (3) herausstehen , so dass die Verbundfolie kein leitendes Element auf ihrer Außenseite aufweist;Aufbringen einer elektrostatischen Ladung auf die Verbundfolie um die genannte Folie elektrostatisch aufzuladen und die genannte Verbundfolie an der Form zu befestigen;Schließen der Form und Einspritzen des Kunststoffmaterials um ein Spritzgussteil (2) zu erhalten, wobei die Verbundfolie durch ein Teil der Spritzgussform bündig mit einer Oberfläche des Spritzgussteils eingebettet wird;Entfernen des abnehmbaren Schutzschichtelements (8');wobei die Crimpverbinder (3) und die Verkapselungsschicht (8) so angeordnet sind, dass die Crimpverbinder (3) aus der äußersten Schicht des Spritzgussartikels herausstehen.
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EP3148299B1 (de) * | 2015-09-28 | 2022-03-16 | Simoldes Plásticos, SA | Textiler mehrschichtiger spritzgussartikel mit leiterbahnen |
DE112017005087T5 (de) | 2016-10-07 | 2019-08-14 | Jaguar Land Rover Limited | Steuereinheit |
GB2557707B (en) * | 2016-10-07 | 2020-04-08 | Jaguar Land Rover Ltd | Control unit |
US11665830B2 (en) * | 2017-06-28 | 2023-05-30 | Honda Motor Co., Ltd. | Method of making smart functional leather |
CN109266235B (zh) * | 2018-08-31 | 2021-03-16 | 武汉理工大学 | 一种具有木质纹理的imd膜及其制备方法 |
FR3121101B1 (fr) | 2021-03-29 | 2023-05-26 | Psa Automobiles Sa | Méthode de détection et d’identification d’un objet disposé dans un compartiment de rangement d’un véhicule automobile et compartiment de rangement associé |
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JP2006032490A (ja) * | 2004-07-13 | 2006-02-02 | Hitachi Ltd | エンジン制御回路装置 |
WO2006093889A2 (en) * | 2005-02-28 | 2006-09-08 | Color Kinetics Incorporated | Configurations and methods for embedding electronics or light emitters in manufactured materials |
JP5077275B2 (ja) * | 2009-03-25 | 2012-11-21 | 株式会社デンソー | 電子装置の製造方法及び電子装置 |
DE102011105190A1 (de) | 2011-06-09 | 2012-12-13 | Leonhard Kurz Stiftung & Co. Kg | Kunststoffteil |
DE102011117985B8 (de) | 2011-11-09 | 2016-12-01 | Leonhard Kurz Stiftung & Co. Kg | Kunststoffteil sowie Verfahren zur Herstellung eines Kunststoffteils |
DE102013101064A1 (de) | 2013-02-01 | 2014-08-07 | Polyic Gmbh & Co. Kg | Folie sowie Körper mit einer solchen Folie |
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