JP5865408B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- JP5865408B2 JP5865408B2 JP2014034954A JP2014034954A JP5865408B2 JP 5865408 B2 JP5865408 B2 JP 5865408B2 JP 2014034954 A JP2014034954 A JP 2014034954A JP 2014034954 A JP2014034954 A JP 2014034954A JP 5865408 B2 JP5865408 B2 JP 5865408B2
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- 239000000758 substrate Substances 0.000 claims description 33
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
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- 238000003384 imaging method Methods 0.000 description 22
- 239000000919 ceramic Substances 0.000 description 18
- 238000006073 displacement reaction Methods 0.000 description 15
- 230000009467 reduction Effects 0.000 description 12
- 230000005236 sound signal Effects 0.000 description 12
- 210000004556 brain Anatomy 0.000 description 10
- 238000004891 communication Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 210000003454 tympanic membrane Anatomy 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000001514 detection method Methods 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
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- 210000003477 cochlea Anatomy 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- 229920005989 resin Polymers 0.000 description 5
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- 230000005540 biological transmission Effects 0.000 description 4
- 210000000988 bone and bone Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- -1 but for example Substances 0.000 description 3
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- 210000000613 ear canal Anatomy 0.000 description 3
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- 238000003825 pressing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
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- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000002066 L-histidyl group Chemical group [H]N1C([H])=NC(C([H])([H])[C@](C(=O)[*])([H])N([H])[H])=C1[H] 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 210000004728 ear cartilage Anatomy 0.000 description 1
- 210000003027 ear inner Anatomy 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 210000004373 mandible Anatomy 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920006381 polylactic acid film Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- 210000003625 skull Anatomy 0.000 description 1
- 230000004936 stimulating effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3888—Arrangements for carrying or protecting transceivers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
- G06F1/1605—Multimedia displays, e.g. with integrated or attached speakers, cameras, microphones
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1635—Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
- H04R2460/13—Hearing devices using bone conduction transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Description
図1〜3は、それぞれ、実施の形態に係る電子機器1の外観を示す斜視図、前面図及び裏面図である。図4は図2に示される電子機器1の矢視A−Aにおける断面構造の概略を示す図である。図5は、電子機器1が備えるカバーパネル2の裏面図である。図5に示されるカバーパネル2には、電子機器1が備える圧電振動素子190及び表示パネル120が取り付けられている。本実施の形態に係る電子機器1は、例えば、スマートフォン等の携帯電話機である。
図6は電子機器1の電気的構成を主に示すブロック図である。図6に示されるように、電子機器1には、制御部100、無線通信部110、表示パネル120、タッチパネル130、近接センサ140及びマイク150が設けられている。さらに電子機器1には、前面側撮像部160、裏面側撮像部170、外部スピーカ180、圧電振動素子190、操作部200及び電池210が設けられている。電子機器1に設けられた、カバーパネル2以外のこれらの構成要素はケース3内に収められている。
図7,8は、それぞれ、圧電振動素子190の構造を示す上面図及び側面図である。図7,8に示されるように、圧電振動素子190は一方向に長い形状を成している。具体的には、圧電振動素子190は、平面視で長方形の細長い板状を成している。圧電振動素子190は、例えばバイモルフ構造を有している。圧電振動素子190は、シム材190cを介して互いに貼り合わされた第1圧電セラミック板190a及び第2圧電セラミック板190bを備えている。
本実施の形態に係る電子機器1では、圧電振動素子190がカバーパネル2を振動させることによって、当該カバーパネル2から気導音及び伝導音が使用者に伝達される。言い換えれば、圧電振動素子190自身の振動がカバーパネル2に伝わることにより、当該カバーパネル2から気導音及び伝導音が使用者に伝達される。
図4の例示では、プリント基板260は、基板262と複数の部品264とを備える。基板262は例えば板状に形成されており、基板262は、カバーパネル2と対向する領域(即ち、カバーパネル2の内側主面21側)に設けられる。より詳細には、基板262は表示パネル120と対向して設けられており、言い換えれば、表示パネル120およびタッチパネル130を介してカバーパネル2に対向する。複数の部品264としては、例えば制御部100などを構成する各種の電子部品(抵抗、スイッチ素子または特定の機能を発揮する半導体モジュール等)、或いは、これらの電子部品を保護、シールド若しくは固定するための部品、或いは、例えば外部メモリ等を基板262と電気的に接続しつつ、当該外部メモリを保持するコネクタなどが挙げられる。これらの複数の部品264は基板262の上に設けられている。図4の例示では、複数の部品264は基板262の、表示パネル120側の主面に設けられる。部品264のいくつかは、互いに異なる高さ(基板262の主面に垂直な方向の高さ)を有する。
2 カバーパネル
3 ケース
20 第1主面
21 第2主面
262 基板
264 部品
270 隙間低減部材
Claims (4)
- 電子機器であって、
外側主面および内側主面を有し、前記外側主面を外側に向けて前記電子機器の表面に設けられた、サファイアから成るパネルと、
前記パネルと共に前記電子機器の筐体を形成するケースと、
前記パネルの前記内側主面側に設けられる基板と、
前記基板の上に設けられ、異なる高さを有する複数の部品と、
前記ケースとは別体であり、前記複数の部品と対向して設けられ、前記複数の部品との対向面に、前記複数の部品の高さに応じた段差が形成された隙間低減部材と、
前記基板と隣り合って設けられる電池と
を備え、
前記隙間低減部材は、前記基板に垂直な方向における前記複数の部品の高さと、前記電池の高さとの差を埋めるように設けられ、
前記隙間低減部材は、前記電池と前記基板との間の境界に沿って延在し、
前記電池は前記複数の部品よりも高い位置まで存在し、
前記隙間低減部材は、前記方向において前記電池と対向する領域を避けて設けられ、
前記パネルは前記方向において前記電池および前記基板の両方と対向する、電子機器。 - 前記隙間低減部材は空気よりも高い熱伝達率を有する、請求項1に記載の電子機器。
- 前記隙間低減部材は導電性を有し、グランドに電気的に接続される、請求項1または2に記載の電子機器。
- 前記複数の部品は前記基板の前記パネル側の表面に設けられ、
前記隙間低減部材は、前記パネルと前記基板との間に設けられる、請求項1から3のいずれか一つに記載の電子機器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014034954A JP5865408B2 (ja) | 2014-02-26 | 2014-02-26 | 電子機器 |
US14/459,067 US8988886B1 (en) | 2014-02-26 | 2014-08-13 | Electronic apparatus |
US14/615,181 US9354665B2 (en) | 2014-02-26 | 2015-02-05 | Electronic apparatus |
PCT/JP2015/001006 WO2015129276A1 (en) | 2014-02-26 | 2015-02-26 | Electronic apparatus |
US15/094,931 US9595992B2 (en) | 2014-02-26 | 2016-04-08 | Electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014034954A JP5865408B2 (ja) | 2014-02-26 | 2014-02-26 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015162704A JP2015162704A (ja) | 2015-09-07 |
JP5865408B2 true JP5865408B2 (ja) | 2016-02-17 |
Family
ID=52683351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014034954A Expired - Fee Related JP5865408B2 (ja) | 2014-02-26 | 2014-02-26 | 電子機器 |
Country Status (3)
Country | Link |
---|---|
US (3) | US8988886B1 (ja) |
JP (1) | JP5865408B2 (ja) |
WO (1) | WO2015129276A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9504175B2 (en) * | 2012-12-12 | 2016-11-22 | Fourte Internatinal, Ltd. | Solid-state drive housing, a solid-state disk using the same and an assembling process thereof |
JP6616059B2 (ja) * | 2014-02-27 | 2019-12-04 | 京セラ株式会社 | 機器 |
JP6348822B2 (ja) * | 2014-10-29 | 2018-06-27 | 京セラ株式会社 | 電子機器 |
CN106714507B (zh) * | 2015-11-16 | 2019-09-13 | 华为技术有限公司 | 中框件及其生产方法 |
CN109040379B (zh) * | 2018-09-28 | 2021-06-04 | 北京小米移动软件有限公司 | 透明移动终端 |
CN111711891B (zh) * | 2020-06-24 | 2022-06-07 | 歌尔股份有限公司 | 球顶、扬声器单体和发声装置 |
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US9429997B2 (en) | 2012-06-12 | 2016-08-30 | Apple Inc. | Electronic device with wrapped display |
US20140023430A1 (en) | 2012-07-19 | 2014-01-23 | Apple Inc. | Attachment Techniques |
US9221289B2 (en) | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
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- 2014-08-13 US US14/459,067 patent/US8988886B1/en active Active
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WO2015129276A1 (en) | 2015-09-03 |
US9354665B2 (en) | 2016-05-31 |
US20160226549A1 (en) | 2016-08-04 |
US8988886B1 (en) | 2015-03-24 |
JP2015162704A (ja) | 2015-09-07 |
US9595992B2 (en) | 2017-03-14 |
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