DE60200467D1 - Additionsvernetztbare Silikonzusammensetzung mit verbesserter Adhäsion und vernetztes Silikonprodukt - Google Patents

Additionsvernetztbare Silikonzusammensetzung mit verbesserter Adhäsion und vernetztes Silikonprodukt

Info

Publication number
DE60200467D1
DE60200467D1 DE60200467T DE60200467T DE60200467D1 DE 60200467 D1 DE60200467 D1 DE 60200467D1 DE 60200467 T DE60200467 T DE 60200467T DE 60200467 T DE60200467 T DE 60200467T DE 60200467 D1 DE60200467 D1 DE 60200467D1
Authority
DE
Germany
Prior art keywords
addition
improved adhesion
product
crosslinkable
crosslinked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60200467T
Other languages
English (en)
Other versions
DE60200467T2 (de
Inventor
Dongchan Ahn
Michael Andrew Lutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Application granted granted Critical
Publication of DE60200467D1 publication Critical patent/DE60200467D1/de
Publication of DE60200467T2 publication Critical patent/DE60200467T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
DE60200467T 2001-06-06 2002-03-22 Additionsvernetztbare Silikonzusammensetzung mit verbesserter Adhäsion und vernetztes Silikonprodukt Expired - Lifetime DE60200467T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US874954 2001-06-06
US09/874,954 US6512037B1 (en) 2001-06-06 2001-06-06 Silicone composition and cured silicone product

Publications (2)

Publication Number Publication Date
DE60200467D1 true DE60200467D1 (de) 2004-06-17
DE60200467T2 DE60200467T2 (de) 2005-06-02

Family

ID=25364946

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60200467T Expired - Lifetime DE60200467T2 (de) 2001-06-06 2002-03-22 Additionsvernetztbare Silikonzusammensetzung mit verbesserter Adhäsion und vernetztes Silikonprodukt

Country Status (6)

Country Link
US (1) US6512037B1 (de)
EP (1) EP1264865B1 (de)
JP (1) JP4885390B2 (de)
KR (1) KR100812552B1 (de)
DE (1) DE60200467T2 (de)
TW (1) TW557318B (de)

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US6482888B1 (en) * 2001-06-06 2002-11-19 Dow Corning Corporation Silicone composition and cured silicone product
US7749920B2 (en) * 2003-07-17 2010-07-06 Rorze Corporation Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same
EP1502572B1 (de) * 2003-08-01 2012-03-07 3M Deutschland GmbH Automischbare Kitt-Abformmasse
US7045586B2 (en) 2003-08-14 2006-05-16 Dow Corning Corporation Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
US20050038188A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
CN1922253B (zh) * 2004-01-22 2011-03-23 陶氏康宁公司 与可加成固化的材料的粘合性得到改进的组合物和掺入该组合物的复合制品
US20050211254A1 (en) * 2004-03-23 2005-09-29 Olson Mark A Method and apparatus for forming ear and nose plugs
EP1652889A1 (de) * 2004-10-12 2006-05-03 3M Espe AG Zusammensetzung enthaltend ungesättigte Silikon-Komponenten, Zahnmaterialien auf Basis von denselben und deren Verwendung
JP4965111B2 (ja) * 2005-11-09 2012-07-04 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
TWI403560B (zh) * 2005-11-22 2013-08-01 Shinetsu Chemical Co Solvent - free release silicone paper for use in release paper
DE102005057460A1 (de) 2005-12-01 2007-06-06 Wacker Chemie Ag Zu hochfesten Elastomeren vernetzbare ionisch und/oder organometallisch funktionalisierte Siliconpolymere
JP5057078B2 (ja) * 2007-03-12 2012-10-24 信越化学工業株式会社 ヒドロシリル化反応制御剤、ヒドロシリル化触媒組成物、及び硬化性組成物
JP5555989B2 (ja) * 2008-08-08 2014-07-23 横浜ゴム株式会社 シリコーン樹脂組成物、これを用いるシリコーン樹脂および光半導体素子封止体
EP2505613A4 (de) * 2009-11-27 2012-12-12 Jsr Corp Zusammensetzung, gehärtetes produkt und elektronische vorrichtung
JP6014971B2 (ja) * 2010-06-18 2016-10-26 東ソー株式会社 典型金属含有ポリシロキサン組成物、その製造方法、およびその用途
JP5605551B2 (ja) * 2010-06-22 2014-10-15 Ｊｓｒ株式会社 重合体、組成物、硬化体および電子デバイス
CN102453327A (zh) * 2010-10-27 2012-05-16 3M新设资产公司 具有高折射率的聚硅氧树脂组合物
WO2012173459A2 (ko) * 2011-06-17 2012-12-20 주식회사 엘지화학 고굴절 조성물
JP5640944B2 (ja) * 2011-10-11 2014-12-17 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物
JP5958262B2 (ja) * 2011-10-28 2016-07-27 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
US9528027B2 (en) * 2013-03-11 2016-12-27 Panasonic Intellectual Property Management Co., Ltd. Coating for preventing scattering of fragments
EP3041897B1 (de) * 2013-09-03 2017-05-24 Dow Corning Corporation Additiv für eine silikoneinkapselungsmasse
JP6196897B2 (ja) * 2013-12-05 2017-09-13 東京応化工業株式会社 ネガ型レジスト組成物、レジストパターン形成方法及び錯体
US20150307759A1 (en) 2014-04-28 2015-10-29 Ames Rubber Corporation Solventless curable coating systems and uses thereof
KR102194374B1 (ko) * 2016-07-13 2020-12-24 다우 실리콘즈 코포레이션 금속 비양성자성 유기실란옥사이드 화합물
EP3484900B1 (de) * 2016-07-13 2020-07-01 Dow Corning Corporation Formulierung mit einer metallischen aprotischen organosilanoxidverbindung
JP6816681B2 (ja) * 2017-09-11 2021-01-20 信越化学工業株式会社 硬化触媒、湿気硬化型室温硬化性オルガノポリシロキサン組成物及び成形体
CN108384509B (zh) * 2018-03-15 2021-01-01 深圳市新纶科技股份有限公司 一种低粘度光学胶组合物及其制备方法及其用于灌注触摸屏以实现全贴合的用途
ES2913783T3 (es) * 2019-05-28 2022-06-06 Evonik Operations Gmbh Procedimiento para la purificación de acetoxisiloxanos
CN115651532B (zh) * 2022-10-28 2024-01-30 南方电网科学研究院有限责任公司 一种裸导线绝缘涂覆材料及其制备方法和应用

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GB596534A (en) 1945-07-30 1948-01-06 William Henry Bishop A new or improved display stand or the like
GB8401016D0 (en) * 1984-01-14 1984-02-15 Hagen Perennatorwerk Organopolysiloxane compositions
JPS62158746A (ja) * 1986-01-06 1987-07-14 Toshiba Silicone Co Ltd プライマ−組成物
JPH0751686B2 (ja) * 1986-03-27 1995-06-05 川研ファインケミカル株式会社 塗料およびインキ類の鮮明度向上剤
US4749741A (en) * 1986-04-07 1988-06-07 Toray Silicone Co., Ltd. Primer composition
JPS62240361A (ja) * 1986-04-11 1987-10-21 Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP2614472B2 (ja) * 1987-12-29 1997-05-28 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
GB9300611D0 (en) * 1993-01-14 1993-03-03 Dow Corning Gmbh Elastomer-forming composition
US5364921A (en) * 1993-08-17 1994-11-15 Dow Corning Corporation Silicone rubber with self-adhesion to glass and metal
US5399650A (en) * 1993-08-17 1995-03-21 Dow Corning Corporation Adhesion promoting additives and low temperature curing organosiloxane compositions containing same
JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
GB9424602D0 (en) * 1994-12-06 1995-01-25 Dow Corning Curable coating compositions
US5595826A (en) 1995-10-11 1997-01-21 Dow Corning Corporation Curable organopolysiloxane compositions with improved adhesion
JP4768902B2 (ja) * 2000-04-17 2011-09-07 東レ・ダウコーニング株式会社 オルガノポリシロキサン組成物およびその製造方法
US6482888B1 (en) * 2001-06-06 2002-11-19 Dow Corning Corporation Silicone composition and cured silicone product

Also Published As

Publication number Publication date
KR20020095030A (ko) 2002-12-20
US20030013802A1 (en) 2003-01-16
DE60200467T2 (de) 2005-06-02
TW557318B (en) 2003-10-11
KR100812552B1 (ko) 2008-03-13
JP2002371185A (ja) 2002-12-26
EP1264865A1 (de) 2002-12-11
US6512037B1 (en) 2003-01-28
EP1264865B1 (de) 2004-05-12
JP4885390B2 (ja) 2012-02-29

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