JP5640944B2 - 硬化性オルガノポリシロキサン組成物 - Google Patents
硬化性オルガノポリシロキサン組成物 Download PDFInfo
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- JP5640944B2 JP5640944B2 JP2011223842A JP2011223842A JP5640944B2 JP 5640944 B2 JP5640944 B2 JP 5640944B2 JP 2011223842 A JP2011223842 A JP 2011223842A JP 2011223842 A JP2011223842 A JP 2011223842A JP 5640944 B2 JP5640944 B2 JP 5640944B2
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- JP
- Japan
- Prior art keywords
- group
- organopolysiloxane composition
- curable organopolysiloxane
- groups
- silane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims description 52
- 229920001296 polysiloxane Polymers 0.000 title claims description 45
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 27
- 229910000077 silane Inorganic materials 0.000 claims description 27
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 239000004945 silicone rubber Substances 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 230000007062 hydrolysis Effects 0.000 claims description 6
- 238000006460 hydrolysis reaction Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- CVBUKMMMRLOKQR-UHFFFAOYSA-N 1-phenylbutane-1,3-dione Chemical compound CC(=O)CC(=O)C1=CC=CC=C1 CVBUKMMMRLOKQR-UHFFFAOYSA-N 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- NIMVMJAUKVPWEV-UHFFFAOYSA-N CC(C)O.CC(C)O.CC(C)O.C=CC(O)=O Chemical compound CC(C)O.CC(C)O.CC(C)O.C=CC(O)=O NIMVMJAUKVPWEV-UHFFFAOYSA-N 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- -1 polysiloxane Polymers 0.000 description 38
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 10
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical group CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229940126062 Compound A Drugs 0.000 description 5
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- KOAUHLUAUFQHBM-UHFFFAOYSA-M 2-methylprop-2-enoate;propan-2-olate;titanium(4+) Chemical compound [Ti+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(=C)C([O-])=O KOAUHLUAUFQHBM-UHFFFAOYSA-M 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical group CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- NAQQTJZRCYNBRX-UHFFFAOYSA-N n-pentan-3-ylidenehydroxylamine Chemical group CCC(CC)=NO NAQQTJZRCYNBRX-UHFFFAOYSA-N 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- WXWYJCSIHQKADM-ZNAKCYKMSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-ethenylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)C=C WXWYJCSIHQKADM-ZNAKCYKMSA-N 0.000 description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- GNKZMNRKLCTJAY-UHFFFAOYSA-N 4'-Methylacetophenone Chemical compound CC(=O)C1=CC=C(C)C=C1 GNKZMNRKLCTJAY-UHFFFAOYSA-N 0.000 description 2
- JVVRCYWZTJLJSG-UHFFFAOYSA-N 4-dimethylaminophenol Chemical compound CN(C)C1=CC=C(O)C=C1 JVVRCYWZTJLJSG-UHFFFAOYSA-N 0.000 description 2
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- INETXKGLHYNTHK-AQWWNALJSA-N tetrakis[(e)-butan-2-ylideneamino] silicate Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)O\N=C(/C)CC INETXKGLHYNTHK-AQWWNALJSA-N 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- VMFJVWPCRCAWBS-UHFFFAOYSA-N (3-methoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 VMFJVWPCRCAWBS-UHFFFAOYSA-N 0.000 description 1
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- JYAQYXOVOHJRCS-UHFFFAOYSA-N 1-(3-bromophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(Br)=C1 JYAQYXOVOHJRCS-UHFFFAOYSA-N 0.000 description 1
- SKBBQSLSGRSQAJ-UHFFFAOYSA-N 1-(4-acetylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(C(C)=O)C=C1 SKBBQSLSGRSQAJ-UHFFFAOYSA-N 0.000 description 1
- HDMHXSCNTJQYOS-UHFFFAOYSA-N 1-(4-prop-2-enylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(CC=C)C=C1 HDMHXSCNTJQYOS-UHFFFAOYSA-N 0.000 description 1
- NZZYRBJEGRIYIF-UHFFFAOYSA-N 1-propan-2-yloxyoctane-1,8-diol;titanium Chemical compound [Ti].CC(C)OC(O)CCCCCCCO NZZYRBJEGRIYIF-UHFFFAOYSA-N 0.000 description 1
- OPWQHYSPLFFRMU-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-amine Chemical compound CCC(N)[Si](OC)(OC)OC OPWQHYSPLFFRMU-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- LEUJIOLEGDAICX-UHFFFAOYSA-N 3-chloroxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=C(Cl)C=C3OC2=C1 LEUJIOLEGDAICX-UHFFFAOYSA-N 0.000 description 1
- KMSYDDGPKBBSNA-UHFFFAOYSA-N 3-ethyl-1-phenylpentan-1-one Chemical compound CCC(CC)CC(=O)C1=CC=CC=C1 KMSYDDGPKBBSNA-UHFFFAOYSA-N 0.000 description 1
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- DLGLWFGFEQRRCP-UHFFFAOYSA-N 6-chloro-1-nonylxanthen-9-one Chemical compound O1C2=CC(Cl)=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCC DLGLWFGFEQRRCP-UHFFFAOYSA-N 0.000 description 1
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical group CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241001674044 Blattodea Species 0.000 description 1
- XEWDHRTWFOELEM-UHFFFAOYSA-N C(C1=CC=CC=C1)OC(C(O)CC(=O)OCC1=CC=CC=C1)=O.C(CCC)[Sn]CCCC Chemical compound C(C1=CC=CC=C1)OC(C(O)CC(=O)OCC1=CC=CC=C1)=O.C(CCC)[Sn]CCCC XEWDHRTWFOELEM-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Chemical group 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 125000005083 alkoxyalkoxy group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001231 benzoyloxy group Chemical group C(C1=CC=CC=C1)(=O)O* 0.000 description 1
- 230000000975 bioactive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- 125000006309 butyl amino group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- PWEVMPIIOJUPRI-UHFFFAOYSA-N dimethyltin Chemical compound C[Sn]C PWEVMPIIOJUPRI-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- FSPSELPMWGWDRY-UHFFFAOYSA-N m-Methylacetophenone Chemical compound CC(=O)C1=CC=CC(C)=C1 FSPSELPMWGWDRY-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- QFWAHMAYYWUGTI-UHFFFAOYSA-N methyl-tris(prop-1-enoxy)silane Chemical compound CC=CO[Si](C)(OC=CC)OC=CC QFWAHMAYYWUGTI-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- HZCRFUPEBRNAAI-UHFFFAOYSA-N n-(3-methylbutan-2-ylidene)hydroxylamine Chemical compound CC(C)C(C)=NO HZCRFUPEBRNAAI-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-AZXPZELESA-N n-methylacetamide Chemical group C[15NH]C(C)=O OHLUUHNLEMFGTQ-AZXPZELESA-N 0.000 description 1
- NCCHARWOCKOHIH-UHFFFAOYSA-N n-methylbenzamide Chemical group CNC(=O)C1=CC=CC=C1 NCCHARWOCKOHIH-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical class O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000000341 volatile oil Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F30/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F30/04—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F30/08—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
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- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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Description
〔1〕
(A)水酸基及び/又は加水分解性基が結合した珪素原子を1分子中に少なくとも2個有するジオルガノポリシロキサン:100質量部、
(B)下記一般式(3)で示されるチタン−(メタ)アクリレート−トリアルコキサイドとβ−ジケトンの錯体化合物:0.1〜30質量部
を含有する硬化性オルガノポリシロキサン組成物。
〔2〕
(B)成分のチタン−(メタ)アクリレート−トリアルコキサイドとβ−ジケトンの錯体化合物が、チタン−(メタ)アクリレート−トリイソプロポキサイドとベンゾイルアセトンの錯体化合物であることを特徴とする〔1〕に記載の硬化性オルガノポリシロキサン組成物。
〔3〕
(A)成分が、分子鎖両末端が水酸基及び/又は加水分解性基で封鎖されたジオルガノポリシロキサンであることを特徴とする〔1〕又は〔2〕に記載の硬化性オルガノポリシロキサン組成物。
〔4〕
更に、(C)1分子中に加水分解性基を2個以上有するシラン及び/又はその部分加水分解縮合物を含有することを特徴とする〔1〕〜〔3〕のいずれかに記載の硬化性オルガノポリシロキサン組成物。
〔5〕
更に、(D)光開始剤を含有することを特徴とする〔1〕〜〔4〕のいずれかに記載の硬化性オルガノポリシロキサン組成物。
〔6〕
〔1〕〜〔5〕のいずれかに記載の硬化性オルガノポリシロキサン組成物に紫外線を照射して硬化することからなるシリコーンゴム硬化物の製造方法。
〔7〕
照射する紫外線の波長が10〜400nmであり、照射量が100〜10,000mJ/cm 2 である〔6〕に記載のシリコーンゴム硬化物の製造方法。
本発明に係る硬化性オルガノポリシロキサン組成物は、
(A)水酸基及び/又は加水分解性基が結合した珪素原子を1分子中に少なくとも2個有するジオルガノポリシロキサン:100質量部、
(B)チタン−(メタ)アクリレート−トリアルコキサイドとβ−ジケトンの錯体化合物:0.1〜30質量部、
更に必要により
(C)1分子中に加水分解性基を2個以上有するシラン及び/又はその部分加水分解縮合物:及び/又は
(D)光開始剤:
を含有する。
(A)水酸基及び/又は加水分解性基が結合した珪素原子を1分子中に少なくとも2個有するジオルガノポリシロキサンは、本発明の硬化性オルガノポリシロキサン組成物の主剤(ベースポリマー)であり、分子中に少なくとも2個の珪素原子に結合した水酸基又は加水分解性基を有するものである。直鎖状、分岐鎖状、レジン状のいずれのものでも良いが、直鎖状が好ましい。このようなジオルガノポリシロキサンとして、具体的には、下記一般式(1)又は(2)で表される分子鎖末端が水酸基又は加水分解性基で封鎖されたジオルガノポリシロキサンが例示される。
(B)成分であるチタン−(メタ)アクリレート−トリアルコキサイドとβ−ジケトンの錯体化合物は、本発明の組成物に硬化性を付与する必須成分であり、下記一般式(3)で示される。
RaSiZ4-a
(式中、Rは前記と同様、Zは独立に加水分解性基であり、aは0〜2の整数である。)
これらは1種単独でも2種以上組み合わせても使用することができる。
(D)成分としては、当業界で公知のアセトフェノン、プロピオフェノン、ベンゾフェノン、キサントール、フルオレイン、ベンズアルデヒド、アンスラキノン、トリフェニルアミン、カルバゾール、3−メチルアセトフェノン、4−メチルアセトフェノン、3−ペンチルアセトフェノン、4−メトキシアセトフェノン、2,2−ジエトキシアセトフェノン、3−ブロモアセトフェノン、4−アリルアセトフェノン、p−ジアセチルベンゼン、3−メトキシベンゾフェノン、4−メチルベンゾフェノン、4−クロロベンゾフェノン、4,4−ジメトキシベンゾフェノン、4−クロロ−4−ベンジルベンゾフェノン、3−クロロキサントーン、3,9−ジクロロキサントーン、3−クロロ−8−ノニルキサントーン、ベンゾイン、ベンゾインメチルエーテル、ベンゾインブチルエーテル、ビス(4−ジメチルアミノフェノール)ケトン、ベンジルメトキシケタール、2−クロロチオキサントーン等が例示される。その配合量は(A)成分100質量部に対して0.01〜5質量部であることが好ましい。
本発明においては、従来公知の縮合反応触媒を使用することも有効であり、これらは1種を単独で使用しても2種以上の混合物として使用してもよい。
具体例としては、スズジオクトエート、ジメチルスズジバーサテート、ジブチルジメトキシスズ、ジブチルスズジアセテート、ジブチルスズジオクトエート、ジブチルスズジラウレート、ジブチルスズジベンジルマレート、ジオクチルスズジラウレート、スズキレート等のスズ触媒、グアニジン、DBU(1,8−ジアザビシクロ[5.4.0]−7−ウンデセン)等の強塩基化合物及びそれらの基を有するアルコキシシラン、テトライソプロポキシチタン、テトラ−n−ブトキシチタン、テトラキス(2−エチルヘキソキシ)チタン、ジプロポキシビス(アセチルアセトナ)チタン、チタニウムイソプロポキシオクチレングリコール等のチタン酸エステル又はチタンキレート化合物等が例示される。その配合量は(A)成分100質量部に対して0.001〜20質量部、特に0.01〜10質量部が好ましい。
当業界で公知のアミン系シランカップリング剤も好適に使用される。具体例としては、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルメチルジエトキシシラン、エチレンジアミノプロピルトリメトキシシラン、エチレンジアミノプロピルトリエトキシシラン、エチレンジアミノプロピルメチルジメトキシシラン、エチレンジアミノプロピルメチルジエトキシシラン、α−アミノプロピルトリメトキシシラン等が例示される。
一級アミノ基を有する有機化合物として有機アミンも適用可能であるが、その腐食性、臭気等の点から一級アミノ基を有するポリマー、オリゴマー、一級アミノ基を官能基として有するシランカップリング剤又はその部分加水分解物等であることが好ましい。その配合量は(A)成分100質量部に対して0.1〜20質量部であることが好ましい。
本発明の組成物において、上記成分以外に室温硬化性オルガノポリシロキサン組成物の添加剤として公知の添加剤を添加してもよい。例えば、充填剤としては、煙霧質シリカ、湿式シリカ、沈降性シリカ、炭酸カルシウム等の補強性充填剤、酸化アルミニウム、酸化亜鉛等の金属酸化物、金属水酸化物、カーボンブラック、ガラスビーズ、ガラスバルーン、樹脂ビーズ、樹脂バルーンなどが挙げられる。これらの充填剤は表面処理されていなくても、公知の処理剤で表面処理されていてもよい。また、チキソトロピー向上剤としてのポリエーテル、可塑剤としてイソパラフィン、架橋密度向上剤としてのトリメチルシロキシ単位とSiO2単位とからなる網状ポリシロキサン等も挙げられる。更に、必要に応じて、顔料、染料、蛍光増白剤等の着色剤、防かび剤、抗菌剤、ゴキブリ忌避剤、海洋生物忌避剤等の生理活性添加剤、シリコーンと非相溶の有機液体等の表面改質剤を添加してもよい。
本発明の硬化性オルガノポリシロキサン組成物は、紫外線照射することにより硬化させることができる。この場合、紫外線波長としては、特に制限されないが、近紫外線が好ましく、10〜400nm、特に200〜380nmであることが好ましく公知の高圧水銀灯を用いることができる。照射量は適宜選定し得るが、通常高圧水銀灯メタルハライドランプで100〜10,000mJ/cm2とすることが好ましい。
なお、硬化は室温で行うことができ、硬化時間は通常数秒〜1週間程度である。
本発明の硬化性オルガノポリシロキサン組成物は、シーリング剤、接着剤、コーティング剤等に好適に用いられ、特に基材を良好に接着することができる。
チタン−メタクリレート−トリイソプロポキサイド3.02gをテトラヒドロフラン(THF)2gに溶解させ(淡黄色透明液体)、次いで、ベンゾイルアセトン1.63gをTHF2.5gに溶解させた溶液を室温で混合した。速やかに錯体が形成され、橙黄色透明液体の下記化合物Aが得られた。
両末端が水酸基で封鎖された粘度700mPa・sのジメチルポリシロキサン100質量部、化合物A(THF溶液)4質量部を均一になるまで混合して組成物を調製した。
実施例1にメチルトリメトキシシラン3質量部を追加し、均一になるまで混合して組成物を調製した。
実施例1に2,2−ジエトキシアセトフェノン0.3質量部を追加し、均一になるまで混合して組成物を調製した。
実施例1から化合物Aを除いた組成物を調製した。
実施例1の化合物Aを除き、代わりに、ベンゾイルアセトン1.6質量部を追加し、均一になるまで混合して組成物を調製した。
実施例1の化合物Aを除き、代わりに、チタン−メタクリレート−トリイソプロポキサイド3.02gを追加し、均一になるまで混合して組成物を調製した。
円筒型ガラスシャーレ(サイズ、内径約30mm、深さ約20mm)に、組成物を充填し、紫外線照射直後の硬化状態を確認した。
紫外線照射条件:高圧水銀灯(80W/cm)1灯、距離10cm、搬送速度1m/min×3回、1,500mJ/cm2
全体を100とし、硬化している部分の体積を表示した。
Claims (7)
- (B)成分のチタン−(メタ)アクリレート−トリアルコキサイドとβ−ジケトンの錯体化合物が、チタン−(メタ)アクリレート−トリイソプロポキサイドとベンゾイルアセトンの錯体化合物であることを特徴とする請求項1に記載の硬化性オルガノポリシロキサン組成物。
- (A)成分が、分子鎖両末端が水酸基及び/又は加水分解性基で封鎖されたジオルガノポリシロキサンであることを特徴とする請求項1又は2に記載の硬化性オルガノポリシロキサン組成物。
- 更に、(C)1分子中に加水分解性基を2個以上有するシラン及び/又はその部分加水分解縮合物を含有することを特徴とする請求項1乃至3のいずれか1項に記載の硬化性オルガノポリシロキサン組成物。
- 更に、(D)光開始剤を含有することを特徴とする請求項1乃至4のいずれか1項に記載の硬化性オルガノポリシロキサン組成物。
- 請求項1乃至5のいずれか1項に記載の硬化性オルガノポリシロキサン組成物に紫外線を照射して硬化することからなるシリコーンゴム硬化物の製造方法。
- 照射する紫外線の波長が10〜400nmであり、照射量が100〜10,000mJ/cm 2 である請求項6に記載のシリコーンゴム硬化物の製造方法。
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JP2011223842A JP5640944B2 (ja) | 2011-10-11 | 2011-10-11 | 硬化性オルガノポリシロキサン組成物 |
US13/644,774 US8791170B2 (en) | 2011-10-11 | 2012-10-04 | Photocurable organopolysiloxane composition |
TW101136854A TWI534206B (zh) | 2011-10-11 | 2012-10-05 | Hardened organopolysiloxane composition |
EP12187669.2A EP2581416B1 (en) | 2011-10-11 | 2012-10-08 | Photocurable Organopolysiloxane Composition |
KR1020120112269A KR101856788B1 (ko) | 2011-10-11 | 2012-10-10 | 경화성 오르가노폴리실록산 조성물 |
CN201210383083.8A CN103044921B (zh) | 2011-10-11 | 2012-10-11 | 可光固化的有机基聚硅氧烷组合物 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619255A (en) * | 1969-11-10 | 1971-11-09 | Stauffer Wacker Silicone Corp | Substrate coated with an organopolysiloxane employing a primer comprising a titanate and an organopolysilicate |
DE2153860C2 (de) | 1970-10-29 | 1982-06-09 | Dai Nippon Printing Co., Ltd. | Verwendung von photopolymerisierbaren Gemischen zur Herstellung ätzmittelbeständiger Masken |
JPS5336515B1 (ja) | 1971-07-19 | 1978-10-03 | ||
US4064027A (en) | 1973-09-28 | 1977-12-20 | Dow Corning Corporation | UV curable composition |
JPS5240334A (en) | 1975-09-27 | 1977-03-29 | Mitsubishi Paper Mills Ltd | Method of processing color photographic elements |
US4098155A (en) | 1976-09-17 | 1978-07-04 | The Fletcher-Terry Company | Self-compensating scoring head |
US4675346A (en) | 1983-06-20 | 1987-06-23 | Loctite Corporation | UV curable silicone rubber compositions |
JPS60104158A (ja) | 1983-11-09 | 1985-06-08 | Shin Etsu Chem Co Ltd | 硬化性オルガノポリシロキサン組成物 |
US4921880A (en) * | 1988-08-15 | 1990-05-01 | Dow Corning Corporation | Adhesion promoter for UV curable siloxane compositions and compositions containing same |
US5391677A (en) | 1991-07-23 | 1995-02-21 | Shin-Etsu Chemical Co., Ltd. | Acrylic-functional organopolysiloxane and method for the preparation thereof |
JP2647285B2 (ja) | 1991-07-23 | 1997-08-27 | 信越化学工業株式会社 | アクリル官能性オルガノポリシロキサンおよびその製造方法 |
JPH05125284A (ja) | 1991-10-23 | 1993-05-21 | Three Bond Co Ltd | 硬化性シリコーン組成物 |
JP2782405B2 (ja) | 1992-12-14 | 1998-07-30 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物 |
JPH09255782A (ja) * | 1996-03-25 | 1997-09-30 | Nippon Steel Corp | 光硬化型無機・有機ハイブリッド材料とそれより成る三次元光導波路 |
JP3539167B2 (ja) * | 1996-12-05 | 2004-07-07 | 信越化学工業株式会社 | プライマー組成物 |
KR100335395B1 (ko) | 2000-02-25 | 2002-05-06 | 김장연 | 하이솔리드 아크릴수지 조성물 및 그 조성물을 함유하는도료 |
US20030031958A1 (en) | 2001-04-27 | 2003-02-13 | Noboru Tohge | Photosensitive composition and process for producing articles covered with a patterned film |
US6512037B1 (en) * | 2001-06-06 | 2003-01-28 | Dow Corning Corporation | Silicone composition and cured silicone product |
JP4864421B2 (ja) * | 2005-11-08 | 2012-02-01 | マツモトファインケミカル株式会社 | 硬化性組成物 |
DE102007038030B4 (de) * | 2007-08-10 | 2009-07-09 | Henkel Ag & Co. Kgaa | Härtbare Zusammensetzungen aus Dimethoxysilanen |
JP2010037507A (ja) | 2008-08-08 | 2010-02-18 | Shin-Etsu Chemical Co Ltd | 油面接着性室温硬化型オルガノポリシロキサン組成物及びシール |
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KR101856788B1 (ko) | 2018-05-10 |
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