DE602004010998D1 - Ein wärmeabstrahlendes System und die entsprechende Methode für ein mobiles Kommunikationsendgerät - Google Patents
Ein wärmeabstrahlendes System und die entsprechende Methode für ein mobiles KommunikationsendgerätInfo
- Publication number
- DE602004010998D1 DE602004010998D1 DE602004010998T DE602004010998T DE602004010998D1 DE 602004010998 D1 DE602004010998 D1 DE 602004010998D1 DE 602004010998 T DE602004010998 T DE 602004010998T DE 602004010998 T DE602004010998 T DE 602004010998T DE 602004010998 D1 DE602004010998 D1 DE 602004010998D1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- circuit board
- heat radiating
- mobile communication
- shield frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030083149A KR100652621B1 (ko) | 2003-11-21 | 2003-11-21 | 휴대용 단말기의 방열장치 |
KR2003083149 | 2003-11-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004010998D1 true DE602004010998D1 (de) | 2008-02-14 |
DE602004010998T2 DE602004010998T2 (de) | 2008-12-24 |
Family
ID=36655479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004010998T Active DE602004010998T2 (de) | 2003-11-21 | 2004-11-18 | Ein wärmeabstrahlendes System und die entsprechende Methode für ein mobiles Kommunikationsendgerät |
Country Status (8)
Country | Link |
---|---|
US (1) | US7286360B2 (de) |
EP (1) | EP1533840B1 (de) |
JP (1) | JP4562498B2 (de) |
KR (1) | KR100652621B1 (de) |
CN (1) | CN100373999C (de) |
AT (1) | ATE382953T1 (de) |
DE (1) | DE602004010998T2 (de) |
RU (1) | RU2291599C2 (de) |
Families Citing this family (76)
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US20070002607A1 (en) * | 2005-06-29 | 2007-01-04 | Khellah Muhammad M | Memory circuit |
US7535726B2 (en) * | 2006-03-08 | 2009-05-19 | Research In Motion Limited | System and method for assembling components in an electronic device |
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US20080310108A1 (en) * | 2007-06-13 | 2008-12-18 | Sony Ericsson Mobile Communications Ab | External heat sink for electronic device |
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JP4888413B2 (ja) * | 2008-02-14 | 2012-02-29 | 富士通株式会社 | 携帯型電子装置 |
WO2009129446A2 (en) * | 2008-04-17 | 2009-10-22 | Laird Technologies, Inc. | Emi shielding slide assemblies for slidably opening and closing portable electronic devices and for providing emi shielding for board-mounted electronic components |
JP5698894B2 (ja) * | 2008-10-24 | 2015-04-08 | 三菱電機株式会社 | 電子部品の放熱構造 |
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MD249Z (ro) * | 2009-04-29 | 2011-02-28 | Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы | Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat |
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JP2011137985A (ja) * | 2009-12-28 | 2011-07-14 | Sanyo Electric Co Ltd | 携帯型電子機器 |
CN201657295U (zh) * | 2010-03-29 | 2010-11-24 | 瑞声光电科技(常州)有限公司 | 微型发声器 |
DE102010030460A1 (de) * | 2010-06-24 | 2011-12-29 | Robert Bosch Gmbh | Elektronisches Gerät mit Gehäuse aus Profilmaterial |
RU2456783C1 (ru) * | 2011-03-30 | 2012-07-20 | Открытое акционерное общество "Государственный Рязанский приборный завод" (ОАО "ГРПЗ") | Экранированный корпус прибора с охлаждением |
KR101980679B1 (ko) * | 2012-04-24 | 2019-05-22 | 엘지전자 주식회사 | 단말기 |
CN102711416B (zh) * | 2012-05-24 | 2015-10-21 | 中兴通讯股份有限公司 | 散热处理装置及移动终端 |
CN103516838A (zh) * | 2012-06-29 | 2014-01-15 | 华为终端有限公司 | 一种无线终端设备 |
KR102043396B1 (ko) * | 2013-02-22 | 2019-11-12 | 삼성전자주식회사 | 방열 안테나 장치, 이를 구비한 휴대 단말기와 배터리 커버 및 배터리 커버 제조 방법 |
CN103160859A (zh) * | 2013-03-21 | 2013-06-19 | 东北大学设计研究院(有限公司) | 一种可调节的电解槽散热装置 |
US9411385B2 (en) | 2013-05-13 | 2016-08-09 | Google Technology Holdings LLC | Electronic device assembly with compression gasket |
CN104159391A (zh) * | 2013-05-15 | 2014-11-19 | 中兴通讯股份有限公司 | 一种用于终端的散热装置及终端 |
CN104640414A (zh) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子(郑州)有限公司 | 移动终端 |
KR102334326B1 (ko) | 2014-02-24 | 2021-12-02 | 삼성전자주식회사 | 하드웨어 쉴드 장치 및 이를 포함하는 전자 장치 |
KR101926470B1 (ko) * | 2014-03-11 | 2018-12-07 | 주식회사 아모그린텍 | 이중 방열 시트, 그의 제조 방법 및 그를 구비한 휴대용 단말기 |
US9456529B2 (en) * | 2014-06-06 | 2016-09-27 | Google Technology Holdings LLC | Heat management structure for a wearable electronic device and method for manufacturing same |
US9930785B2 (en) * | 2014-10-15 | 2018-03-27 | AzTrong Inc. | Configurable heat conducting path for portable electronic device |
TWI631887B (zh) * | 2014-10-28 | 2018-08-01 | 富智康(香港)有限公司 | 散熱結構及具有所述散熱結構的電子裝置 |
US9414527B2 (en) | 2014-11-06 | 2016-08-09 | International Business Machines Corporation | Thermal spreading for an externally pluggable electronic module |
US20160192544A1 (en) * | 2014-12-26 | 2016-06-30 | Intel Corporation | Integrated thermal emi structure for electronic devices |
KR20160090144A (ko) * | 2015-01-21 | 2016-07-29 | 주식회사 아모그린텍 | 방열 시트 일체형 안테나 모듈 |
US9560737B2 (en) | 2015-03-04 | 2017-01-31 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
KR102376981B1 (ko) * | 2015-04-22 | 2022-03-21 | 삼성전자주식회사 | 방열 구조를 갖는 전자 장치 |
KR101691797B1 (ko) * | 2015-06-03 | 2017-01-02 | 엘지전자 주식회사 | 이동 단말기 |
KR101609642B1 (ko) * | 2015-07-10 | 2016-04-08 | 주식회사 아모그린텍 | Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기 |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
US9781819B2 (en) * | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
US9924591B2 (en) | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US10143090B2 (en) | 2015-10-19 | 2018-11-27 | International Business Machines Corporation | Circuit layouts of tamper-respondent sensors |
US9978231B2 (en) | 2015-10-21 | 2018-05-22 | International Business Machines Corporation | Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s) |
US9913389B2 (en) | 2015-12-01 | 2018-03-06 | International Business Corporation Corporation | Tamper-respondent assembly with vent structure |
US10327343B2 (en) | 2015-12-09 | 2019-06-18 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9555606B1 (en) | 2015-12-09 | 2017-01-31 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9554477B1 (en) | 2015-12-18 | 2017-01-24 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
CN105792612B (zh) * | 2016-04-20 | 2018-10-12 | 联想(北京)有限公司 | 一种电子设备 |
US9904811B2 (en) | 2016-04-27 | 2018-02-27 | International Business Machines Corporation | Tamper-proof electronic packages with two-phase dielectric fluid |
US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US9913370B2 (en) | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
US9858776B1 (en) | 2016-06-28 | 2018-01-02 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
CN106211553B (zh) * | 2016-07-28 | 2019-04-19 | Oppo广东移动通信有限公司 | Pcb板组件及具有其的移动终端 |
US10321589B2 (en) | 2016-09-19 | 2019-06-11 | International Business Machines Corporation | Tamper-respondent assembly with sensor connection adapter |
US10271424B2 (en) | 2016-09-26 | 2019-04-23 | International Business Machines Corporation | Tamper-respondent assemblies with in situ vent structure(s) |
US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US9999124B2 (en) | 2016-11-02 | 2018-06-12 | International Business Machines Corporation | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
US10327329B2 (en) | 2017-02-13 | 2019-06-18 | International Business Machines Corporation | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor |
CN107580449A (zh) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | 屏蔽罩、散热组件及电子设备 |
US10359812B2 (en) * | 2017-12-12 | 2019-07-23 | Motorola Mobility Llc | Device component exposure protection |
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JP2003318585A (ja) * | 2002-04-24 | 2003-11-07 | Toshiba Corp | 電子機器 |
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-
2003
- 2003-11-21 KR KR1020030083149A patent/KR100652621B1/ko active IP Right Grant
-
2004
- 2004-11-17 JP JP2004333800A patent/JP4562498B2/ja active Active
- 2004-11-18 DE DE602004010998T patent/DE602004010998T2/de active Active
- 2004-11-18 AT AT04027410T patent/ATE382953T1/de not_active IP Right Cessation
- 2004-11-18 EP EP04027410A patent/EP1533840B1/de active Active
- 2004-11-19 US US10/993,304 patent/US7286360B2/en active Active
- 2004-11-19 RU RU2004133862/09A patent/RU2291599C2/ru active
- 2004-11-19 CN CNB2004100471580A patent/CN100373999C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US7286360B2 (en) | 2007-10-23 |
ATE382953T1 (de) | 2008-01-15 |
EP1533840B1 (de) | 2008-01-02 |
CN1625327A (zh) | 2005-06-08 |
DE602004010998T2 (de) | 2008-12-24 |
EP1533840A1 (de) | 2005-05-25 |
US20050111194A1 (en) | 2005-05-26 |
KR20050049235A (ko) | 2005-05-25 |
JP2005159346A (ja) | 2005-06-16 |
RU2291599C2 (ru) | 2007-01-10 |
KR100652621B1 (ko) | 2006-12-06 |
RU2004133862A (ru) | 2006-04-27 |
CN100373999C (zh) | 2008-03-05 |
JP4562498B2 (ja) | 2010-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |