DE602004004484T2 - Mikromechanischer elektrostatischer Resonator - Google Patents
Mikromechanischer elektrostatischer Resonator Download PDFInfo
- Publication number
- DE602004004484T2 DE602004004484T2 DE602004004484T DE602004004484T DE602004004484T2 DE 602004004484 T2 DE602004004484 T2 DE 602004004484T2 DE 602004004484 T DE602004004484 T DE 602004004484T DE 602004004484 T DE602004004484 T DE 602004004484T DE 602004004484 T2 DE602004004484 T2 DE 602004004484T2
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- vibrating body
- vibrator
- electrode
- vibrator according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 107
- 230000005284 excitation Effects 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 20
- 239000010703 silicon Substances 0.000 claims description 20
- 239000012212 insulator Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 2
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000010276 construction Methods 0.000 description 15
- 239000010408 film Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000001413 cellular effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000010355 oscillation Effects 0.000 description 5
- 244000126211 Hericium coralloides Species 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2431—Ring resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2436—Disk resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2457—Clamped-free beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
- H03H2009/02503—Breath-like, e.g. Lam? mode, wine-glass mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02519—Torsional
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003405839 | 2003-12-04 | ||
| JP2003405839 | 2003-12-04 | ||
| JP2004038468 | 2004-02-16 | ||
| JP2004038468 | 2004-02-16 | ||
| JP2004054182 | 2004-02-27 | ||
| JP2004054180 | 2004-02-27 | ||
| JP2004054180 | 2004-02-27 | ||
| JP2004054182 | 2004-02-27 | ||
| JP2004244835 | 2004-08-25 | ||
| JP2004244835A JP4086023B2 (ja) | 2003-12-04 | 2004-08-25 | マイクロメカニカル静電振動子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE602004004484D1 DE602004004484D1 (de) | 2007-03-15 |
| DE602004004484T2 true DE602004004484T2 (de) | 2007-11-08 |
Family
ID=34468539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602004004484T Expired - Lifetime DE602004004484T2 (de) | 2003-12-04 | 2004-11-25 | Mikromechanischer elektrostatischer Resonator |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7215061B2 (enExample) |
| EP (1) | EP1538747B1 (enExample) |
| JP (1) | JP4086023B2 (enExample) |
| CN (1) | CN100438334C (enExample) |
| AT (1) | ATE352900T1 (enExample) |
| DE (1) | DE602004004484T2 (enExample) |
| ES (1) | ES2277188T3 (enExample) |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2872501B1 (fr) * | 2004-07-01 | 2006-11-03 | Commissariat Energie Atomique | Microresonateur composite a forte deformation |
| WO2006083482A2 (en) * | 2005-01-07 | 2006-08-10 | Trustees Of Boston University | Nanomechanical oscillator |
| US20110068834A1 (en) * | 2005-01-07 | 2011-03-24 | Trustees Of Boston University | Electro-mechanical oscillating devices and associated methods |
| JP4484778B2 (ja) * | 2005-07-08 | 2010-06-16 | 富士フイルム株式会社 | 微小薄膜可動素子および微小薄膜可動素子アレイ並びに微小薄膜可動素子の駆動方法 |
| US7843283B2 (en) * | 2005-11-09 | 2010-11-30 | Cornell Research Foundation, Inc. | MEMS controlled oscillator |
| US7808253B2 (en) * | 2005-12-02 | 2010-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Test method of microstructure body and micromachine |
| US9130602B2 (en) * | 2006-01-18 | 2015-09-08 | Qualcomm Incorporated | Method and apparatus for delivering energy to an electrical or electronic device via a wireless link |
| US8447234B2 (en) * | 2006-01-18 | 2013-05-21 | Qualcomm Incorporated | Method and system for powering an electronic device via a wireless link |
| JP5309316B2 (ja) * | 2006-02-06 | 2013-10-09 | 国立大学法人東北大学 | チップ素子 |
| JP2008092788A (ja) * | 2006-09-04 | 2008-04-17 | Seiko Epson Corp | 電動モータ、電動モータの製造方法、電動モータ用電磁コイル、電子機器及び燃料電池使用機器 |
| US7649426B2 (en) | 2006-09-12 | 2010-01-19 | Cts Corporation | Apparatus and method for temperature compensation of crystal oscillators |
| WO2008036845A2 (en) * | 2006-09-20 | 2008-03-27 | Trustees Of Boston University | Nano electromechanical integrated-circuit bank and switch |
| US8314665B2 (en) * | 2006-09-20 | 2012-11-20 | Trustees Of Boston University | Nano electromechanical integrated-circuit filter |
| US7545237B2 (en) * | 2006-12-20 | 2009-06-09 | Sitime Inc. | Serrated MEMS resonators |
| US7545238B2 (en) * | 2006-12-20 | 2009-06-09 | Sitime Inc. | Serrated MEMS resonators |
| US7545239B2 (en) * | 2006-12-20 | 2009-06-09 | Sitime Inc. | Serrated MEMS resonators |
| US8482157B2 (en) * | 2007-03-02 | 2013-07-09 | Qualcomm Incorporated | Increasing the Q factor of a resonator |
| US9774086B2 (en) | 2007-03-02 | 2017-09-26 | Qualcomm Incorporated | Wireless power apparatus and methods |
| JP5028646B2 (ja) * | 2007-06-07 | 2012-09-19 | 独立行政法人 宇宙航空研究開発機構 | 小型発振子 |
| US9124120B2 (en) * | 2007-06-11 | 2015-09-01 | Qualcomm Incorporated | Wireless power system and proximity effects |
| JP2009014768A (ja) | 2007-06-29 | 2009-01-22 | Fujitsu Ltd | メムスデバイスおよびその製造方法 |
| JP5028185B2 (ja) * | 2007-08-28 | 2012-09-19 | 三洋電機株式会社 | 静電発電装置 |
| JP5055596B2 (ja) * | 2007-08-29 | 2012-10-24 | セイコーインスツル株式会社 | 発振子及び該発振子を有する発振器 |
| EP2188863A1 (en) * | 2007-09-13 | 2010-05-26 | QUALCOMM Incorporated | Maximizing power yield from wireless power magnetic resonators |
| KR20100067676A (ko) * | 2007-09-17 | 2010-06-21 | 퀄컴 인코포레이티드 | 무선 에너지 전송을 위한 송신기 및 수신기 |
| JP2009088854A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | マイクロメカニカル共振器およびその製造方法 |
| WO2009048468A1 (en) | 2007-10-11 | 2009-04-16 | Sand 9, Inc. | Signal amplification by hierarchal resonating structures |
| JP5362733B2 (ja) | 2007-10-11 | 2013-12-11 | クゥアルコム・インコーポレイテッド | 磁気機械システムを使用する無線電力転送 |
| US8629576B2 (en) * | 2008-03-28 | 2014-01-14 | Qualcomm Incorporated | Tuning and gain control in electro-magnetic power systems |
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| US8410868B2 (en) * | 2009-06-04 | 2013-04-02 | Sand 9, Inc. | Methods and apparatus for temperature control of devices and mechanical resonating structures |
| US8044737B2 (en) * | 2008-04-29 | 2011-10-25 | Sand9, Inc. | Timing oscillators and related methods |
| US8044736B2 (en) * | 2008-04-29 | 2011-10-25 | Sand9, Inc. | Timing oscillators and related methods |
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| US8680951B2 (en) * | 2008-05-19 | 2014-03-25 | Nxp, B.V. | MEMS resonator |
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| JP5516903B2 (ja) * | 2011-11-11 | 2014-06-11 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
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| US9954513B1 (en) | 2012-12-21 | 2018-04-24 | Analog Devices, Inc. | Methods and apparatus for anchoring resonators |
| US9634227B1 (en) | 2013-03-06 | 2017-04-25 | Analog Devices, Inc. | Suppression of spurious modes of vibration for resonators and related apparatus and methods |
| US9601267B2 (en) | 2013-07-03 | 2017-03-21 | Qualcomm Incorporated | Wireless power transmitter with a plurality of magnetic oscillators |
| JP2015080013A (ja) * | 2013-10-15 | 2015-04-23 | セイコーエプソン株式会社 | 振動子、発振器、電子機器及び移動体 |
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| JP2016040984A (ja) * | 2014-08-13 | 2016-03-24 | セイコーエプソン株式会社 | 圧電駆動装置及びその駆動方法、ロボット及びその駆動方法 |
| CN105375812A (zh) | 2014-08-13 | 2016-03-02 | 精工爱普生株式会社 | 压电驱动装置及其驱动方法、机器人及其驱动方法 |
| DE102016112101B4 (de) * | 2016-07-01 | 2018-08-02 | Physik Instrumente (Pi) Gmbh & Co. Kg | Vorrichtung umfassend einen Ultraschallaktor und eine Halterungsvorrichtung, wobei der Ultraschallaktor an der Halterungsvorrichtung angeordnet ist |
| US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
| CN107147370B (zh) * | 2017-04-10 | 2020-05-22 | 西安交通大学 | 一种基于振动模态耦合的mems振荡器及控制方法 |
| US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
| CN111131949A (zh) * | 2019-12-25 | 2020-05-08 | 中国航空工业集团公司西安飞机设计研究所 | 一种柔性振动装置 |
| WO2022097328A1 (ja) * | 2020-11-06 | 2022-05-12 | 株式会社村田製作所 | 共振装置及び共振装置製造方法 |
| CN114124025B (zh) * | 2021-11-04 | 2025-01-03 | 北京晶芯微科技有限公司 | 一种微机械谐振器及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6369374B1 (en) | 1999-10-15 | 2002-04-09 | Agere Systems Guardian Corp. | Filter including a micro-mechanical resonator |
| US20020070816A1 (en) * | 2000-08-24 | 2002-06-13 | Wan-Thai Hsu | Method for making micromechanical structures having at least one lateral, small gap therebetween and micromechanical device produced thereby |
| US6628177B2 (en) | 2000-08-24 | 2003-09-30 | The Regents Of The University Of Michigan | Micromechanical resonator device and micromechanical device utilizing same |
| WO2004027796A2 (en) * | 2002-08-07 | 2004-04-01 | Georgia Tech Research Corporation | Capacitive resonators and methods of fabrication |
| US6985051B2 (en) * | 2002-12-17 | 2006-01-10 | The Regents Of The University Of Michigan | Micromechanical resonator device and method of making a micromechanical device |
| US6894586B2 (en) * | 2003-05-21 | 2005-05-17 | The Regents Of The University Of California | Radial bulk annular resonator using MEMS technology |
| US7056757B2 (en) * | 2003-11-25 | 2006-06-06 | Georgia Tech Research Corporation | Methods of forming oxide masks with submicron openings and microstructures formed thereby |
| WO2005074502A2 (en) * | 2004-01-21 | 2005-08-18 | The Regents Of The University Of Michigan | High-q micromechanical resonator devices and filters utilizing same |
-
2004
- 2004-08-25 JP JP2004244835A patent/JP4086023B2/ja not_active Expired - Fee Related
- 2004-11-18 US US10/990,411 patent/US7215061B2/en not_active Expired - Fee Related
- 2004-11-25 AT AT04027961T patent/ATE352900T1/de active
- 2004-11-25 EP EP04027961A patent/EP1538747B1/en not_active Expired - Lifetime
- 2004-11-25 ES ES04027961T patent/ES2277188T3/es not_active Expired - Lifetime
- 2004-11-25 DE DE602004004484T patent/DE602004004484T2/de not_active Expired - Lifetime
- 2004-12-02 CN CNB2004100955860A patent/CN100438334C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1538747B1 (en) | 2007-01-24 |
| CN100438334C (zh) | 2008-11-26 |
| EP1538747A1 (en) | 2005-06-08 |
| ES2277188T3 (es) | 2007-07-01 |
| DE602004004484D1 (de) | 2007-03-15 |
| JP2005271191A (ja) | 2005-10-06 |
| ATE352900T1 (de) | 2007-02-15 |
| US7215061B2 (en) | 2007-05-08 |
| US20050151442A1 (en) | 2005-07-14 |
| JP4086023B2 (ja) | 2008-05-14 |
| CN1625046A (zh) | 2005-06-08 |
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