ATE352900T1 - Mikromechanischer elektrostatischer resonator - Google Patents
Mikromechanischer elektrostatischer resonatorInfo
- Publication number
- ATE352900T1 ATE352900T1 AT04027961T AT04027961T ATE352900T1 AT E352900 T1 ATE352900 T1 AT E352900T1 AT 04027961 T AT04027961 T AT 04027961T AT 04027961 T AT04027961 T AT 04027961T AT E352900 T1 ATE352900 T1 AT E352900T1
- Authority
- AT
- Austria
- Prior art keywords
- vibration body
- electrodes
- pair
- image
- micromechanical electrostatic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2431—Ring resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2436—Disk resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2457—Clamped-free beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
- H03H2009/02503—Breath-like, e.g. Lam? mode, wine-glass mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02519—Torsional
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003405839 | 2003-12-04 | ||
JP2004038468 | 2004-02-16 | ||
JP2004054180 | 2004-02-27 | ||
JP2004054182 | 2004-02-27 | ||
JP2004244835A JP4086023B2 (ja) | 2003-12-04 | 2004-08-25 | マイクロメカニカル静電振動子 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE352900T1 true ATE352900T1 (de) | 2007-02-15 |
Family
ID=34468539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04027961T ATE352900T1 (de) | 2003-12-04 | 2004-11-25 | Mikromechanischer elektrostatischer resonator |
Country Status (7)
Country | Link |
---|---|
US (1) | US7215061B2 (de) |
EP (1) | EP1538747B1 (de) |
JP (1) | JP4086023B2 (de) |
CN (1) | CN100438334C (de) |
AT (1) | ATE352900T1 (de) |
DE (1) | DE602004004484T2 (de) |
ES (1) | ES2277188T3 (de) |
Families Citing this family (90)
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US7654140B2 (en) * | 2002-03-12 | 2010-02-02 | Cornell Research Foundation, Inc. | Heat pumped parametric MEMS device |
FR2872501B1 (fr) * | 2004-07-01 | 2006-11-03 | Commissariat Energie Atomique | Microresonateur composite a forte deformation |
CN101103515B (zh) * | 2005-01-07 | 2010-10-13 | 波士顿大学托管委员会 | 纳米机械振荡器 |
US20110068834A1 (en) * | 2005-01-07 | 2011-03-24 | Trustees Of Boston University | Electro-mechanical oscillating devices and associated methods |
JP4484778B2 (ja) * | 2005-07-08 | 2010-06-16 | 富士フイルム株式会社 | 微小薄膜可動素子および微小薄膜可動素子アレイ並びに微小薄膜可動素子の駆動方法 |
US7843283B2 (en) * | 2005-11-09 | 2010-11-30 | Cornell Research Foundation, Inc. | MEMS controlled oscillator |
US7808253B2 (en) * | 2005-12-02 | 2010-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Test method of microstructure body and micromachine |
US8447234B2 (en) * | 2006-01-18 | 2013-05-21 | Qualcomm Incorporated | Method and system for powering an electronic device via a wireless link |
US9130602B2 (en) * | 2006-01-18 | 2015-09-08 | Qualcomm Incorporated | Method and apparatus for delivering energy to an electrical or electronic device via a wireless link |
JP5309316B2 (ja) * | 2006-02-06 | 2013-10-09 | 国立大学法人東北大学 | チップ素子 |
JP2008092788A (ja) * | 2006-09-04 | 2008-04-17 | Seiko Epson Corp | 電動モータ、電動モータの製造方法、電動モータ用電磁コイル、電子機器及び燃料電池使用機器 |
US7649426B2 (en) | 2006-09-12 | 2010-01-19 | Cts Corporation | Apparatus and method for temperature compensation of crystal oscillators |
WO2008036830A2 (en) * | 2006-09-20 | 2008-03-27 | Trustees Of Boston University | Nano electromechanical integrated-circuit filter |
US8487715B2 (en) * | 2006-09-20 | 2013-07-16 | Trustees Of Boston University | Nano electromechanical integrated-circuit bank and switch |
US7545238B2 (en) * | 2006-12-20 | 2009-06-09 | Sitime Inc. | Serrated MEMS resonators |
US7545239B2 (en) * | 2006-12-20 | 2009-06-09 | Sitime Inc. | Serrated MEMS resonators |
US7545237B2 (en) * | 2006-12-20 | 2009-06-09 | Sitime Inc. | Serrated MEMS resonators |
US9774086B2 (en) | 2007-03-02 | 2017-09-26 | Qualcomm Incorporated | Wireless power apparatus and methods |
JP5028646B2 (ja) * | 2007-06-07 | 2012-09-19 | 独立行政法人 宇宙航空研究開発機構 | 小型発振子 |
US9124120B2 (en) * | 2007-06-11 | 2015-09-01 | Qualcomm Incorporated | Wireless power system and proximity effects |
JP2009014768A (ja) | 2007-06-29 | 2009-01-22 | Fujitsu Ltd | メムスデバイスおよびその製造方法 |
CN103187629B (zh) * | 2007-08-09 | 2016-08-24 | 高通股份有限公司 | 增加谐振器的q因数 |
JP5028185B2 (ja) * | 2007-08-28 | 2012-09-19 | 三洋電機株式会社 | 静電発電装置 |
JP5055596B2 (ja) * | 2007-08-29 | 2012-10-24 | セイコーインスツル株式会社 | 発振子及び該発振子を有する発振器 |
JP2010539821A (ja) * | 2007-09-13 | 2010-12-16 | クゥアルコム・インコーポレイテッド | ワイヤレス電力磁気共振器から生じた電力を最大にすること |
EP2201641A1 (de) * | 2007-09-17 | 2010-06-30 | Qualcomm Incorporated | Sender und empfänger für drahtlosen energietransfer |
JP2009088854A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | マイクロメカニカル共振器およびその製造方法 |
JP5362733B2 (ja) | 2007-10-11 | 2013-12-11 | クゥアルコム・インコーポレイテッド | 磁気機械システムを使用する無線電力転送 |
US8772999B2 (en) | 2007-10-11 | 2014-07-08 | Sand 9, Inc. | Signal amplification by hierarchal resonating structures |
US8629576B2 (en) * | 2008-03-28 | 2014-01-14 | Qualcomm Incorporated | Tuning and gain control in electro-magnetic power systems |
US7990229B2 (en) | 2008-04-01 | 2011-08-02 | Sand9, Inc. | Methods and devices for compensating a signal using resonators |
US8044736B2 (en) * | 2008-04-29 | 2011-10-25 | Sand9, Inc. | Timing oscillators and related methods |
US8476809B2 (en) | 2008-04-29 | 2013-07-02 | Sand 9, Inc. | Microelectromechanical systems (MEMS) resonators and related apparatus and methods |
US8410868B2 (en) * | 2009-06-04 | 2013-04-02 | Sand 9, Inc. | Methods and apparatus for temperature control of devices and mechanical resonating structures |
US8044737B2 (en) * | 2008-04-29 | 2011-10-25 | Sand9, Inc. | Timing oscillators and related methods |
US20090273242A1 (en) * | 2008-05-05 | 2009-11-05 | Nigelpower, Llc | Wireless Delivery of power to a Fixed-Geometry power part |
WO2009141750A1 (en) * | 2008-05-19 | 2009-11-26 | Nxp B.V. | Improved mems resonator |
US20090299918A1 (en) * | 2008-05-28 | 2009-12-03 | Nigelpower, Llc | Wireless delivery of power to a mobile powered device |
JP5505596B2 (ja) | 2008-06-18 | 2014-05-28 | セイコーエプソン株式会社 | 共振回路、発振回路、フィルタ回路及び電子装置 |
US8111108B2 (en) * | 2008-07-29 | 2012-02-07 | Sand9, Inc. | Micromechanical resonating devices and related methods |
DE102008042350A1 (de) * | 2008-09-25 | 2010-04-01 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zu dessen Herstellung |
US20100155883A1 (en) * | 2008-10-31 | 2010-06-24 | Trustees Of Boston University | Integrated mems and ic systems and related methods |
EP2377176B1 (de) | 2008-12-17 | 2016-12-14 | Analog Devices, Inc. | Mechanische resonierende strukturen mit einer temperaturkompensationsstruktur |
EP2377244A4 (de) * | 2008-12-17 | 2013-09-18 | Sand 9 Inc | Mechanische resonanzvorrichtungen mit mehreren öffnungen und verwandte verfahren |
US8689426B2 (en) | 2008-12-17 | 2014-04-08 | Sand 9, Inc. | Method of manufacturing a resonating structure |
EP2394361A2 (de) * | 2009-02-04 | 2011-12-14 | Sand 9, Inc. | Verfahren und vorrichtungen zum abstimmen von einrichtungen, die mechanische resonatoren aufweisen |
US8395456B2 (en) * | 2009-02-04 | 2013-03-12 | Sand 9, Inc. | Variable phase amplifier circuit and method of use |
US8456250B2 (en) * | 2009-02-04 | 2013-06-04 | Sand 9, Inc. | Methods and apparatus for tuning devices having resonators |
US8446078B2 (en) * | 2009-03-26 | 2013-05-21 | Sand 9, Inc. | Mechanical resonating structures and methods |
US9048811B2 (en) | 2009-03-31 | 2015-06-02 | Sand 9, Inc. | Integration of piezoelectric materials with substrates |
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US8174170B1 (en) | 2009-05-13 | 2012-05-08 | Sand 9, Inc. | Methods and apparatus for mechanical resonating structures |
US8115573B2 (en) * | 2009-05-29 | 2012-02-14 | Infineon Technologies Ag | Resonance frequency tunable MEMS device |
US8513863B2 (en) | 2009-06-11 | 2013-08-20 | Qualcomm Mems Technologies, Inc. | Piezoelectric resonator with two layers |
US8063720B2 (en) * | 2009-08-31 | 2011-11-22 | Georgia Tech Research Corporation | MEMS resonators having resonator bodies therein with concave-shaped sides that support high quality factor and low temperature coefficient of resonant frequency |
US8664836B1 (en) | 2009-09-18 | 2014-03-04 | Sand 9, Inc. | Passivated micromechanical resonators and related methods |
FR2954021B1 (fr) * | 2009-12-10 | 2012-08-03 | Commissariat Energie Atomique | Micro/nano-resonateur compense a detection capacitive amelioree et procede d'elaboration |
US8228127B2 (en) | 2009-12-23 | 2012-07-24 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US8704604B2 (en) | 2009-12-23 | 2014-04-22 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US8604888B2 (en) * | 2009-12-23 | 2013-12-10 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
WO2011109382A1 (en) | 2010-03-01 | 2011-09-09 | Sand9, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
JP5627258B2 (ja) | 2010-03-23 | 2014-11-19 | キヤノン株式会社 | 振動型アクチュエータおよびその製造方法 |
JP5930595B2 (ja) * | 2010-04-06 | 2016-06-08 | キヤノン株式会社 | 振動型アクチュエータ、振動子及び振動子の製造方法 |
US8833161B2 (en) | 2010-04-20 | 2014-09-16 | Sand 9, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
JP5355515B2 (ja) | 2010-05-06 | 2013-11-27 | 株式会社村田製作所 | タッチパネル、ならびにタッチ式入力装置およびその制御方法 |
KR101158200B1 (ko) | 2010-06-04 | 2012-06-19 | 삼성전기주식회사 | 광학식 손 떨림 보정장치 및 이의 제조 방법 |
EP2400662B1 (de) * | 2010-06-18 | 2015-11-04 | Nxp B.V. | Mikroelektromechanische Resonatorgeometrie |
WO2012040043A1 (en) | 2010-09-20 | 2012-03-29 | Sand9, Inc. | Resonant sensing using extensional modes of a plate |
JP5630243B2 (ja) | 2010-11-30 | 2014-11-26 | セイコーエプソン株式会社 | 電子装置、電子機器及び電子装置の製造方法 |
JP2012119822A (ja) | 2010-11-30 | 2012-06-21 | Seiko Epson Corp | 電子装置、電子機器及び電子装置の製造方法 |
JP2012178710A (ja) * | 2011-02-25 | 2012-09-13 | Sanyo Electric Co Ltd | Memsデバイスおよびその製造方法 |
US8501515B1 (en) | 2011-02-25 | 2013-08-06 | Integrated Device Technology Inc. | Methods of forming micro-electromechanical resonators using passive compensation techniques |
JP5875243B2 (ja) * | 2011-04-06 | 2016-03-02 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
US8610336B1 (en) | 2011-09-30 | 2013-12-17 | Integrated Device Technology Inc | Microelectromechanical resonators having resistive heating elements therein configured to provide frequency tuning through convective heating of resonator bodies |
US9383208B2 (en) | 2011-10-13 | 2016-07-05 | Analog Devices, Inc. | Electromechanical magnetometer and applications thereof |
JP5516903B2 (ja) * | 2011-11-11 | 2014-06-11 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP5516904B2 (ja) * | 2011-11-11 | 2014-06-11 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US9299910B1 (en) | 2012-05-17 | 2016-03-29 | Analog Devices, Inc. | Resonator anchors and related apparatus and methods |
US9954513B1 (en) | 2012-12-21 | 2018-04-24 | Analog Devices, Inc. | Methods and apparatus for anchoring resonators |
US9634227B1 (en) | 2013-03-06 | 2017-04-25 | Analog Devices, Inc. | Suppression of spurious modes of vibration for resonators and related apparatus and methods |
US9601267B2 (en) | 2013-07-03 | 2017-03-21 | Qualcomm Incorporated | Wireless power transmitter with a plurality of magnetic oscillators |
JP2015080013A (ja) * | 2013-10-15 | 2015-04-23 | セイコーエプソン株式会社 | 振動子、発振器、電子機器及び移動体 |
JP2015080012A (ja) * | 2013-10-15 | 2015-04-23 | セイコーエプソン株式会社 | 振動子、発振器、電子機器及び移動体 |
JP2016040984A (ja) * | 2014-08-13 | 2016-03-24 | セイコーエプソン株式会社 | 圧電駆動装置及びその駆動方法、ロボット及びその駆動方法 |
CN105375812A (zh) | 2014-08-13 | 2016-03-02 | 精工爱普生株式会社 | 压电驱动装置及其驱动方法、机器人及其驱动方法 |
DE102016112101B4 (de) * | 2016-07-01 | 2018-08-02 | Physik Instrumente (Pi) Gmbh & Co. Kg | Vorrichtung umfassend einen Ultraschallaktor und eine Halterungsvorrichtung, wobei der Ultraschallaktor an der Halterungsvorrichtung angeordnet ist |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
CN107147370B (zh) * | 2017-04-10 | 2020-05-22 | 西安交通大学 | 一种基于振动模态耦合的mems振荡器及控制方法 |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
CN111131949A (zh) * | 2019-12-25 | 2020-05-08 | 中国航空工业集团公司西安飞机设计研究所 | 一种柔性振动装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6369374B1 (en) | 1999-10-15 | 2002-04-09 | Agere Systems Guardian Corp. | Filter including a micro-mechanical resonator |
US20020070816A1 (en) * | 2000-08-24 | 2002-06-13 | Wan-Thai Hsu | Method for making micromechanical structures having at least one lateral, small gap therebetween and micromechanical device produced thereby |
US6628177B2 (en) * | 2000-08-24 | 2003-09-30 | The Regents Of The University Of Michigan | Micromechanical resonator device and micromechanical device utilizing same |
US7023065B2 (en) * | 2002-08-07 | 2006-04-04 | Georgia Tech Research Corporation | Capacitive resonators and methods of fabrication |
US6985051B2 (en) * | 2002-12-17 | 2006-01-10 | The Regents Of The University Of Michigan | Micromechanical resonator device and method of making a micromechanical device |
US6894586B2 (en) * | 2003-05-21 | 2005-05-17 | The Regents Of The University Of California | Radial bulk annular resonator using MEMS technology |
US7056757B2 (en) * | 2003-11-25 | 2006-06-06 | Georgia Tech Research Corporation | Methods of forming oxide masks with submicron openings and microstructures formed thereby |
WO2005074502A2 (en) * | 2004-01-21 | 2005-08-18 | The Regents Of The University Of Michigan | High-q micromechanical resonator devices and filters utilizing same |
-
2004
- 2004-08-25 JP JP2004244835A patent/JP4086023B2/ja not_active Expired - Fee Related
- 2004-11-18 US US10/990,411 patent/US7215061B2/en not_active Expired - Fee Related
- 2004-11-25 AT AT04027961T patent/ATE352900T1/de active
- 2004-11-25 EP EP04027961A patent/EP1538747B1/de not_active Not-in-force
- 2004-11-25 ES ES04027961T patent/ES2277188T3/es active Active
- 2004-11-25 DE DE602004004484T patent/DE602004004484T2/de active Active
- 2004-12-02 CN CNB2004100955860A patent/CN100438334C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7215061B2 (en) | 2007-05-08 |
CN1625046A (zh) | 2005-06-08 |
CN100438334C (zh) | 2008-11-26 |
DE602004004484D1 (de) | 2007-03-15 |
JP2005271191A (ja) | 2005-10-06 |
DE602004004484T2 (de) | 2007-11-08 |
EP1538747A1 (de) | 2005-06-08 |
ES2277188T3 (es) | 2007-07-01 |
US20050151442A1 (en) | 2005-07-14 |
JP4086023B2 (ja) | 2008-05-14 |
EP1538747B1 (de) | 2007-01-24 |
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