DE602004004018D1 - VCSEL mit monolitisch integriertem Photodetektor und hybriden Spiegeln - Google Patents
VCSEL mit monolitisch integriertem Photodetektor und hybriden SpiegelnInfo
- Publication number
- DE602004004018D1 DE602004004018D1 DE602004004018T DE602004004018T DE602004004018D1 DE 602004004018 D1 DE602004004018 D1 DE 602004004018D1 DE 602004004018 T DE602004004018 T DE 602004004018T DE 602004004018 T DE602004004018 T DE 602004004018T DE 602004004018 D1 DE602004004018 D1 DE 602004004018D1
- Authority
- DE
- Germany
- Prior art keywords
- vcsel
- monolithically integrated
- integrated photodetector
- hybrid mirrors
- mirrors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18341—Intra-cavity contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
- H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
- H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
- H01S5/18313—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation by oxidizing at least one of the DBR layers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003289049 | 2003-08-07 | ||
JP2003289049A JP3738849B2 (ja) | 2003-08-07 | 2003-08-07 | 面発光型半導体レーザ、光モジュール、ならびに光伝達装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004004018D1 true DE602004004018D1 (de) | 2007-02-15 |
DE602004004018T2 DE602004004018T2 (de) | 2007-05-31 |
Family
ID=34131540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004004018T Active DE602004004018T2 (de) | 2003-08-07 | 2004-08-06 | VCSEL mit monolitisch integriertem Photodetektor und hybriden Spiegeln |
Country Status (6)
Country | Link |
---|---|
US (1) | US7221693B2 (de) |
EP (1) | EP1513235B1 (de) |
JP (1) | JP3738849B2 (de) |
KR (1) | KR100631359B1 (de) |
CN (1) | CN100438240C (de) |
DE (1) | DE602004004018T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3729271B2 (ja) | 2004-01-08 | 2005-12-21 | セイコーエプソン株式会社 | 光素子およびその製造方法 |
JP2006339418A (ja) * | 2005-06-02 | 2006-12-14 | Seiko Epson Corp | 光素子及びその製造方法 |
JP2007019313A (ja) * | 2005-07-08 | 2007-01-25 | Seiko Epson Corp | 光素子および光モジュール |
JP4525921B2 (ja) * | 2005-07-15 | 2010-08-18 | セイコーエプソン株式会社 | 光素子およびその製造方法、ならびに光モジュール |
US20070081568A1 (en) * | 2005-10-06 | 2007-04-12 | Seiko Epson Corporation | Optical semiconductor element and method for manufacturing the same |
JP4985954B2 (ja) * | 2006-06-27 | 2012-07-25 | セイコーエプソン株式会社 | 面発光型半導体レーザ |
EP2533380B8 (de) * | 2011-06-06 | 2017-08-30 | Mellanox Technologies, Ltd. | Hochgeschwindigkeitslaservorrichtung |
TWI463700B (zh) * | 2012-12-27 | 2014-12-01 | Genesis Photonics Inc | 發光元件的電極墊結構 |
CN105552715B (zh) * | 2016-01-29 | 2018-07-27 | 中国科学院长春光学精密机械与物理研究所 | 适合高温工作的高增益垂直腔面发射半导体激光器 |
CN105807378B (zh) * | 2016-05-24 | 2017-07-04 | 北京邮电大学 | 一种收发一体的光电集成芯片 |
DE102017108322A1 (de) * | 2017-04-19 | 2018-10-25 | Osram Opto Semiconductors Gmbh | Halbleiterlaser |
CN111987080B (zh) * | 2019-05-24 | 2023-09-26 | 晶元光电股份有限公司 | 封装体与显示模块 |
CN110233425B (zh) * | 2019-07-17 | 2023-12-15 | 厦门乾照光电股份有限公司 | 一种vcsel激光器及其制作方法 |
DE102021116631A1 (de) | 2021-06-28 | 2022-12-29 | Trumpf Photonic Components Gmbh | Halbleiterbauteil |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893390A (ja) * | 1981-11-30 | 1983-06-03 | Fujitsu Ltd | 光半導体装置 |
JPH0669491A (ja) * | 1992-08-18 | 1994-03-11 | Fujitsu Ltd | 光送受信装置 |
JPH06204454A (ja) * | 1992-12-28 | 1994-07-22 | Mitsubishi Electric Corp | 光変調器付半導体レーザ及びその製造方法 |
US5475701A (en) * | 1993-12-29 | 1995-12-12 | Honeywell Inc. | Integrated laser power monitor |
US5606572A (en) * | 1994-03-24 | 1997-02-25 | Vixel Corporation | Integration of laser with photodiode for feedback control |
US5633527A (en) * | 1995-02-06 | 1997-05-27 | Sandia Corporation | Unitary lens semiconductor device |
US5848088A (en) * | 1995-07-11 | 1998-12-08 | Seiko Epson Corporation | Surface emission type semiconductor for laser with optical detector, method of manufacturing thereof, and sensor using the same |
US5978401A (en) * | 1995-10-25 | 1999-11-02 | Honeywell Inc. | Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver |
US5719891A (en) * | 1995-12-18 | 1998-02-17 | Picolight Incorporated | Conductive element with lateral oxidation barrier |
JP3058077B2 (ja) | 1996-01-16 | 2000-07-04 | 松下電器産業株式会社 | 半導体受発光装置 |
US6001664A (en) * | 1996-02-01 | 1999-12-14 | Cielo Communications, Inc. | Method for making closely-spaced VCSEL and photodetector on a substrate |
KR0185950B1 (ko) | 1996-04-25 | 1999-04-15 | 김광호 | 레이저다이오드의 광출력모니터링패케지 |
US5729566A (en) * | 1996-06-07 | 1998-03-17 | Picolight Incorporated | Light emitting device having an electrical contact through a layer containing oxidized material |
US6026108A (en) * | 1996-10-16 | 2000-02-15 | The Regents Of The University Of California | Vertical-cavity surface-emitting laser with an intracavity quantum-well optical absorber |
US5757837A (en) * | 1996-10-16 | 1998-05-26 | The Regents Of The University Of California | Intracavity quantum well photodetector integrated within a vertical-cavity surface-emitting laser and method of operating same |
KR100234340B1 (ko) * | 1996-10-29 | 1999-12-15 | 윤종용 | 광출력장치 |
US5892786A (en) * | 1997-03-26 | 1999-04-06 | The United States Of America As Represented By The Secretary Of The Air Force | Output control of vertical microcavity light emitting device |
US5974071A (en) * | 1997-05-20 | 1999-10-26 | Motorola, Inc. | VCSEL with integrated photodetectors for automatic power control and signal detection in data storage |
US5943357A (en) * | 1997-08-18 | 1999-08-24 | Motorola, Inc. | Long wavelength vertical cavity surface emitting laser with photodetector for automatic power control and method of fabrication |
DE19807783A1 (de) | 1998-02-18 | 1999-09-02 | Siemens Ag | Bauelement mit einem Lichtsender und einem Lichtempfänger |
US6483862B1 (en) * | 1998-12-11 | 2002-11-19 | Agilent Technologies, Inc. | System and method for the monolithic integration of a light emitting device and a photodetector using a native oxide semiconductor layer |
KR100317576B1 (ko) * | 1999-11-08 | 2001-12-24 | 윤덕용 | 모니터용 광검출기 일체형 표면광 레이저장치 |
JP2001284725A (ja) * | 2000-03-31 | 2001-10-12 | Seiko Epson Corp | 面発光型半導体レーザおよびその製造方法 |
JP2003248204A (ja) * | 2002-02-25 | 2003-09-05 | Mitsubishi Electric Corp | 半導体光素子、半導体光変調素子、及び半導体光受光素子 |
-
2003
- 2003-08-07 JP JP2003289049A patent/JP3738849B2/ja not_active Expired - Fee Related
-
2004
- 2004-08-03 KR KR1020040061027A patent/KR100631359B1/ko active IP Right Grant
- 2004-08-05 US US10/911,605 patent/US7221693B2/en active Active
- 2004-08-06 EP EP04018720A patent/EP1513235B1/de not_active Expired - Fee Related
- 2004-08-06 CN CNB2004100584023A patent/CN100438240C/zh not_active Expired - Fee Related
- 2004-08-06 DE DE602004004018T patent/DE602004004018T2/de active Active
Also Published As
Publication number | Publication date |
---|---|
JP2005057197A (ja) | 2005-03-03 |
US20050053110A1 (en) | 2005-03-10 |
CN100438240C (zh) | 2008-11-26 |
EP1513235B1 (de) | 2007-01-03 |
JP3738849B2 (ja) | 2006-01-25 |
DE602004004018T2 (de) | 2007-05-31 |
KR100631359B1 (ko) | 2006-10-09 |
KR20050016105A (ko) | 2005-02-21 |
CN1581611A (zh) | 2005-02-16 |
US7221693B2 (en) | 2007-05-22 |
EP1513235A1 (de) | 2005-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |