DE60144045D1 - Waferhalterung, waferhalterungsanordnung und wärmebehandlungsofen - Google Patents
Waferhalterung, waferhalterungsanordnung und wärmebehandlungsofenInfo
- Publication number
- DE60144045D1 DE60144045D1 DE60144045T DE60144045T DE60144045D1 DE 60144045 D1 DE60144045 D1 DE 60144045D1 DE 60144045 T DE60144045 T DE 60144045T DE 60144045 T DE60144045 T DE 60144045T DE 60144045 D1 DE60144045 D1 DE 60144045D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer bracket
- heat treatment
- wafer
- treatment oven
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000315553A JP4575570B2 (ja) | 2000-10-16 | 2000-10-16 | ウェーハ保持具、ウェーハ保持装置及び熱処理炉 |
JP2000326003A JP2002134595A (ja) | 2000-10-25 | 2000-10-25 | 熱処理用ウェーハ支持具 |
JP2001042476A JP4589545B2 (ja) | 2001-02-19 | 2001-02-19 | ウェハ支持部材、ウェハ保持具およびウェハ保持装置 |
PCT/JP2001/009081 WO2002033743A1 (fr) | 2000-10-16 | 2001-10-16 | Porte-plaquette, element de support de plaquette, dispositif porte-plaquette et four de traitement thermique |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60144045D1 true DE60144045D1 (de) | 2011-03-31 |
Family
ID=27344948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60144045T Expired - Lifetime DE60144045D1 (de) | 2000-10-16 | 2001-10-16 | Waferhalterung, waferhalterungsanordnung und wärmebehandlungsofen |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1253631B1 (de) |
KR (1) | KR100469379B1 (de) |
DE (1) | DE60144045D1 (de) |
TW (1) | TW561571B (de) |
WO (1) | WO2002033743A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100491161B1 (ko) | 2002-11-26 | 2005-05-24 | 주식회사 테라세미콘 | 반도체 제조장치 |
JP2006128316A (ja) * | 2004-10-27 | 2006-05-18 | Shin Etsu Handotai Co Ltd | 熱処理用縦型ボートおよび熱処理方法 |
KR100818842B1 (ko) * | 2006-12-27 | 2008-04-01 | 주식회사 실트론 | 웨이퍼의 열처리시 슬립을 방지할 수 있는 웨이퍼 지지 핀및 웨이퍼의 열처리 방법 |
CN105895517A (zh) * | 2008-10-07 | 2016-08-24 | 应用材料公司 | 用于从蚀刻基板有效地移除卤素残余物的设备 |
CN103386566B (zh) * | 2013-07-10 | 2015-04-01 | 中国电子科技集团公司第四十一研究所 | 介质基片激光加工夹具及其使用方法 |
TWI718501B (zh) * | 2019-03-20 | 2021-02-11 | 漢民科技股份有限公司 | 用於氣相沉積設備之晶圓承載裝置 |
JPWO2022195886A1 (de) * | 2021-03-19 | 2022-09-22 | ||
EP4386819A1 (de) * | 2022-12-15 | 2024-06-19 | Siltronic AG | Verfahren zum testen der widerstandsfähigkeit von halbleiterscheiben aus einkristallinem silizium gegen thermisch induzierte versetzungen |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152228A (ja) * | 1991-11-26 | 1993-06-18 | Mitsubishi Materials Corp | ボートへのウエーハ搭載方法 |
JPH05235156A (ja) * | 1992-02-21 | 1993-09-10 | Sony Corp | 縦型炉用ボート |
JP3140227B2 (ja) * | 1992-11-27 | 2001-03-05 | 沖電気工業株式会社 | ウエハ熱処理方法およびこれに用いるガードリング構造 |
JP3067509B2 (ja) * | 1993-03-24 | 2000-07-17 | 住友金属工業株式会社 | 半導体製造装置 |
JPH0745691A (ja) * | 1993-07-29 | 1995-02-14 | Kokusai Electric Co Ltd | ウェーハホルダ |
JP3151118B2 (ja) * | 1995-03-01 | 2001-04-03 | 東京エレクトロン株式会社 | 熱処理装置 |
JPH0992625A (ja) * | 1995-09-20 | 1997-04-04 | Tokyo Electron Ltd | 熱処理用ボ−ト |
JP3328763B2 (ja) * | 1995-10-30 | 2002-09-30 | エヌティティエレクトロニクス株式会社 | 縦型ウエハボートのウエハ支持構造 |
EP0884769A1 (de) * | 1996-02-29 | 1998-12-16 | Tokyo Electron Limited | Wärme behandlungshalter für halbleiterscheiben |
JPH10284429A (ja) * | 1997-03-31 | 1998-10-23 | Sumitomo Sitix Corp | ウェーハ支持装置 |
JP2000091406A (ja) | 1998-09-08 | 2000-03-31 | Mitsubishi Materials Silicon Corp | ウェーハ保持具 |
JP2000150402A (ja) * | 1998-11-09 | 2000-05-30 | Shin Etsu Handotai Co Ltd | 基板支持治具 |
-
2001
- 2001-10-16 EP EP01974883A patent/EP1253631B1/de not_active Expired - Lifetime
- 2001-10-16 TW TW090125588A patent/TW561571B/zh not_active IP Right Cessation
- 2001-10-16 KR KR10-2002-7007717A patent/KR100469379B1/ko active IP Right Grant
- 2001-10-16 DE DE60144045T patent/DE60144045D1/de not_active Expired - Lifetime
- 2001-10-16 WO PCT/JP2001/009081 patent/WO2002033743A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2002033743A1 (fr) | 2002-04-25 |
EP1253631A4 (de) | 2009-06-10 |
EP1253631A1 (de) | 2002-10-30 |
TW561571B (en) | 2003-11-11 |
KR100469379B1 (ko) | 2005-02-02 |
EP1253631B1 (de) | 2011-02-16 |
KR20020064940A (ko) | 2002-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R082 | Change of representative |
Ref document number: 1253631 Country of ref document: EP Representative=s name: VOSSIUS & PARTNER, DE |