DE60143334D1 - Vernetzte, positiv arbeitende Photoresist-Zusammensetzung - Google Patents

Vernetzte, positiv arbeitende Photoresist-Zusammensetzung

Info

Publication number
DE60143334D1
DE60143334D1 DE60143334T DE60143334T DE60143334D1 DE 60143334 D1 DE60143334 D1 DE 60143334D1 DE 60143334 T DE60143334 T DE 60143334T DE 60143334 T DE60143334 T DE 60143334T DE 60143334 D1 DE60143334 D1 DE 60143334D1
Authority
DE
Germany
Prior art keywords
acid
units
group
solubility
photoresist composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60143334T
Other languages
English (en)
Inventor
Katsumi Oomori
Yohei Kinoshita
Tomotaka Yamada
Toshikazu Takayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000250174A external-priority patent/JP4062655B2/ja
Priority claimed from JP2000250175A external-priority patent/JP4144726B2/ja
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of DE60143334D1 publication Critical patent/DE60143334D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DE60143334T 2000-08-21 2001-08-14 Vernetzte, positiv arbeitende Photoresist-Zusammensetzung Expired - Lifetime DE60143334D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000250174A JP4062655B2 (ja) 2000-08-21 2000-08-21 架橋化ポジ型レジスト組成物
JP2000250175A JP4144726B2 (ja) 2000-08-21 2000-08-21 架橋形成ポジ型ホトレジスト組成物

Publications (1)

Publication Number Publication Date
DE60143334D1 true DE60143334D1 (de) 2010-12-09

Family

ID=26598188

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60143334T Expired - Lifetime DE60143334D1 (de) 2000-08-21 2001-08-14 Vernetzte, positiv arbeitende Photoresist-Zusammensetzung

Country Status (4)

Country Link
US (1) US6630282B2 (de)
EP (1) EP1182506B1 (de)
AT (1) ATE486301T1 (de)
DE (1) DE60143334D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645695B2 (en) * 2000-09-11 2003-11-11 Shipley Company, L.L.C. Photoresist composition
TWI269118B (en) * 2001-03-05 2006-12-21 Sumitomo Chemical Co Chemical amplifying type positive resist composition
KR20050094828A (ko) * 2002-12-26 2005-09-28 도오꾜오까고오교 가부시끼가이샤 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
JP2004333548A (ja) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物およびレジストパターン形成方法
TWI282907B (en) 2003-05-20 2007-06-21 Tokyo Ohka Kogyo Co Ltd Chemical amplification type positive photoresist composition and resist pattern forming method using the same
JP2005053936A (ja) * 2003-06-13 2005-03-03 Jsr Corp 光硬化性液状樹脂組成物
JP2007522262A (ja) 2003-06-26 2007-08-09 シミックス・テクノロジーズ・インコーポレイテッド フォトレジストポリマー
WO2005003198A1 (en) 2003-06-26 2005-01-13 Jsr Corporation Photoresist polymer compositions
WO2005003192A1 (en) * 2003-06-26 2005-01-13 Symyx Technologies, Inc. Synthesis of photoresist polymers
TWI465467B (zh) * 2004-03-08 2014-12-21 Mitsubishi Rayon Co 光阻用聚合物、光阻組成物及圖案製造方法與光阻用聚合物用原料化合物
KR100848031B1 (ko) * 2004-04-13 2008-07-23 도오꾜오까고오교 가부시끼가이샤 고분자 화합물, 이 고분자 화합물을 함유하는 포토레지스트조성물, 및 레지스트 패턴 형성 방법
US7951522B2 (en) 2004-12-29 2011-05-31 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
US7927778B2 (en) 2004-12-29 2011-04-19 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
EP1684120A1 (de) * 2005-01-19 2006-07-26 Rohm and Haas Electronic Materials LLC Fotoresistzusammensetzungen, die Mischungen von Harzen enthalten
KR101266564B1 (ko) * 2005-08-03 2013-05-22 제이에스알 가부시끼가이샤 도금 조형물 제조용 포지티브형 감방사선성 수지 조성물,전사 필름 및 도금 조형물의 제조 방법
TW200830050A (en) * 2006-09-21 2008-07-16 Fujifilm Corp Resist composition and pattern-forming method using the same
US8715918B2 (en) * 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
KR102261808B1 (ko) 2016-08-09 2021-06-07 리지필드 액퀴지션 환경적으로 안정한 후막성 화학증폭형 레지스트
CN107151287B (zh) * 2017-05-24 2020-06-02 儒芯微电子材料（上海）有限公司 一种交联型丙烯酸酯类共聚物及其光刻胶
WO2019171957A1 (ja) * 2018-03-07 2019-09-12 丸善石油化学株式会社 新規の二官能（メタ）アクリレート化合物および重合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0422628A3 (en) * 1989-10-13 1992-02-26 E.I. Du Pont De Nemours And Company Photosensitive element
JP3206989B2 (ja) 1992-11-13 2001-09-10 富士写真フイルム株式会社 ポジ型感光性材料
JPH06230574A (ja) 1993-02-05 1994-08-19 Fuji Photo Film Co Ltd ポジ型感光性組成物
JP3373056B2 (ja) 1994-08-17 2003-02-04 富士写真フイルム株式会社 ポジ型感光性組成物
US5849808A (en) 1995-04-21 1998-12-15 Olin Microelectronic Chemicals, Inc. Organic solvent soluble photoresists which are developable in aqueous alkaline solutions
JP3695024B2 (ja) 1996-11-14 2005-09-14 Ｊｓｒ株式会社 半導体デバイス製造用感放射線性樹脂組成物
US6120972A (en) * 1997-09-02 2000-09-19 Jsr Corporation Radiation-sensitive resin composition
KR100557368B1 (ko) 1998-01-16 2006-03-10 제이에스알 가부시끼가이샤 감방사선성 수지 조성물
TW487828B (en) 1998-10-29 2002-05-21 Shinetsu Chemical Co Positive resist composition
JP3941268B2 (ja) * 1998-11-10 2007-07-04 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP3796560B2 (ja) * 1999-01-27 2006-07-12 信越化学工業株式会社 化学増幅ポジ型レジスト組成物及びパターン形成方法
JP3662774B2 (ja) 1999-06-02 2005-06-22 東京応化工業株式会社 ポジ型レジスト組成物
JP2001166478A (ja) * 1999-12-03 2001-06-22 Jsr Corp 感放射線性樹脂組成物
JP4694686B2 (ja) * 2000-08-31 2011-06-08 東京応化工業株式会社 半導体素子製造方法

Also Published As

Publication number Publication date
US20020034704A1 (en) 2002-03-21
EP1182506A1 (de) 2002-02-27
ATE486301T1 (de) 2010-11-15
EP1182506B1 (de) 2010-10-27
US6630282B2 (en) 2003-10-07

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