ATE486301T1 - Vernetzte, positiv arbeitende photoresist- zusammensetzung - Google Patents

Vernetzte, positiv arbeitende photoresist- zusammensetzung

Info

Publication number
ATE486301T1
ATE486301T1 AT01306923T AT01306923T ATE486301T1 AT E486301 T1 ATE486301 T1 AT E486301T1 AT 01306923 T AT01306923 T AT 01306923T AT 01306923 T AT01306923 T AT 01306923T AT E486301 T1 ATE486301 T1 AT E486301T1
Authority
AT
Austria
Prior art keywords
acid
units
group
solubility
photoresist composition
Prior art date
Application number
AT01306923T
Other languages
English (en)
Inventor
Katsumi Oomori
Yohei Kinoshita
Tomotaka Yamada
Toshikazu Takayama
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000250174A external-priority patent/JP4062655B2/ja
Priority claimed from JP2000250175A external-priority patent/JP4144726B2/ja
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of ATE486301T1 publication Critical patent/ATE486301T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT01306923T 2000-08-21 2001-08-14 Vernetzte, positiv arbeitende photoresist- zusammensetzung ATE486301T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000250174A JP4062655B2 (ja) 2000-08-21 2000-08-21 架橋化ポジ型レジスト組成物
JP2000250175A JP4144726B2 (ja) 2000-08-21 2000-08-21 架橋形成ポジ型ホトレジスト組成物

Publications (1)

Publication Number Publication Date
ATE486301T1 true ATE486301T1 (de) 2010-11-15

Family

ID=26598188

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01306923T ATE486301T1 (de) 2000-08-21 2001-08-14 Vernetzte, positiv arbeitende photoresist- zusammensetzung

Country Status (4)

Country Link
US (1) US6630282B2 (de)
EP (1) EP1182506B1 (de)
AT (1) ATE486301T1 (de)
DE (1) DE60143334D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645695B2 (en) * 2000-09-11 2003-11-11 Shipley Company, L.L.C. Photoresist composition
TWI269118B (en) * 2001-03-05 2006-12-21 Sumitomo Chemical Co Chemical amplifying type positive resist composition
CN100576076C (zh) * 2002-12-26 2009-12-30 东京应化工业株式会社 正性抗蚀剂组合物和形成抗蚀剂图案的方法
JP2004333548A (ja) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物およびレジストパターン形成方法
US7358028B2 (en) 2003-05-20 2008-04-15 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photo resist composition and method for forming resist pattern
JP2005053936A (ja) * 2003-06-13 2005-03-03 Jsr Corp 光硬化性液状樹脂組成物
JP4725739B2 (ja) 2003-06-26 2011-07-13 Ｊｓｒ株式会社 フォトレジストポリマー組成物
US7250475B2 (en) 2003-06-26 2007-07-31 Symyx Technologies, Inc. Synthesis of photoresist polymers
WO2005000924A1 (en) 2003-06-26 2005-01-06 Symyx Technologies, Inc. Photoresist polymers
US8241829B2 (en) * 2004-03-08 2012-08-14 Mitsubishi Rayon Co., Ltd. Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymer
US7700259B2 (en) * 2004-04-13 2010-04-20 Tokyo Ohka Kogyo Co., Ltd. Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern
US7927778B2 (en) 2004-12-29 2011-04-19 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
US7951522B2 (en) 2004-12-29 2011-05-31 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
JP5047502B2 (ja) * 2005-01-19 2012-10-10 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 樹脂混合物を含むフォトレジスト組成物
EP1750176A3 (de) * 2005-08-03 2011-04-20 JSR Corporation Positive strahlungsempfindliche Harzzusammensetzung zur Herstellung eines Metallplattierungsmaterials, Transkriptionsfilm und Herstellungsverfahren für ein Metallplattierungsmaterial
TW200830050A (en) * 2006-09-21 2008-07-16 Fujifilm Corp Resist composition and pattern-forming method using the same
US8715918B2 (en) * 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
US11385543B2 (en) 2016-08-09 2022-07-12 Merck Patent Gmbh Enviromentally stable, thick film, chemically amplified resist
CN107151287B (zh) * 2017-05-24 2020-06-02 儒芯微电子材料（上海）有限公司 一种交联型丙烯酸酯类共聚物及其光刻胶
JP7119065B2 (ja) * 2018-03-07 2022-08-16 丸善石油化学株式会社 新規の二官能（メタ）アクリレート化合物および重合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0422628A3 (en) 1989-10-13 1992-02-26 E.I. Du Pont De Nemours And Company Photosensitive element
JP3206989B2 (ja) 1992-11-13 2001-09-10 富士写真フイルム株式会社 ポジ型感光性材料
JPH06230574A (ja) 1993-02-05 1994-08-19 Fuji Photo Film Co Ltd ポジ型感光性組成物
JP3373056B2 (ja) 1994-08-17 2003-02-04 富士写真フイルム株式会社 ポジ型感光性組成物
JP3495503B2 (ja) 1995-04-21 2004-02-09 アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド 架橋されたポリマー
JP3695024B2 (ja) 1996-11-14 2005-09-14 Ｊｓｒ株式会社 半導体デバイス製造用感放射線性樹脂組成物
US6120972A (en) * 1997-09-02 2000-09-19 Jsr Corporation Radiation-sensitive resin composition
US6180316B1 (en) 1998-01-16 2001-01-30 Jsr Corporation Radiation sensitive resin composition
TW487828B (en) 1998-10-29 2002-05-21 Shinetsu Chemical Co Positive resist composition
JP3941268B2 (ja) 1998-11-10 2007-07-04 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP3796560B2 (ja) 1999-01-27 2006-07-12 信越化学工業株式会社 化学増幅ポジ型レジスト組成物及びパターン形成方法
JP3662774B2 (ja) 1999-06-02 2005-06-22 東京応化工業株式会社 ポジ型レジスト組成物
JP2001166478A (ja) * 1999-12-03 2001-06-22 Jsr Corp 感放射線性樹脂組成物
JP4694686B2 (ja) * 2000-08-31 2011-06-08 東京応化工業株式会社 半導体素子製造方法

Also Published As

Publication number Publication date
US20020034704A1 (en) 2002-03-21
US6630282B2 (en) 2003-10-07
EP1182506A1 (de) 2002-02-27
EP1182506B1 (de) 2010-10-27
DE60143334D1 (de) 2010-12-09

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