DE60128191D1 - Elektrische Einrichtung und Abschirmung - Google Patents
Elektrische Einrichtung und AbschirmungInfo
- Publication number
- DE60128191D1 DE60128191D1 DE60128191T DE60128191T DE60128191D1 DE 60128191 D1 DE60128191 D1 DE 60128191D1 DE 60128191 T DE60128191 T DE 60128191T DE 60128191 T DE60128191 T DE 60128191T DE 60128191 D1 DE60128191 D1 DE 60128191D1
- Authority
- DE
- Germany
- Prior art keywords
- cpu
- processing unit
- image processing
- shielding member
- metal shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Manufacturing Of Electric Cables (AREA)
- Surgical Instruments (AREA)
- Liquid Crystal (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000058729 | 2000-03-03 | ||
JP2000058729 | 2000-03-03 | ||
PCT/JP2001/001555 WO2001065901A2 (en) | 2000-03-03 | 2001-03-01 | Electronic device and shield |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60128191D1 true DE60128191D1 (de) | 2007-06-14 |
DE60128191T2 DE60128191T2 (de) | 2007-12-27 |
Family
ID=18579278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60128191T Expired - Lifetime DE60128191T2 (de) | 2000-03-03 | 2001-03-01 | Elektrische Einrichtung und Abschirmung |
Country Status (14)
Country | Link |
---|---|
US (1) | US6498733B2 (de) |
EP (1) | EP1181853B1 (de) |
KR (1) | KR100790204B1 (de) |
CN (1) | CN1197446C (de) |
AT (1) | ATE361656T1 (de) |
AU (1) | AU3601701A (de) |
BR (1) | BR0105555A (de) |
CA (1) | CA2370716A1 (de) |
DE (1) | DE60128191T2 (de) |
HK (1) | HK1040474A1 (de) |
MX (1) | MXPA01011118A (de) |
NZ (1) | NZ515116A (de) |
RU (1) | RU2001132865A (de) |
WO (1) | WO2001065901A2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4048435B2 (ja) * | 2003-10-23 | 2008-02-20 | ソニー株式会社 | 電子機器 |
KR100652621B1 (ko) | 2003-11-21 | 2006-12-06 | 엘지전자 주식회사 | 휴대용 단말기의 방열장치 |
JP2005249909A (ja) * | 2004-03-02 | 2005-09-15 | Pioneer Electronic Corp | 画像表示装置のシールドケース及び画像表示装置 |
TWI264993B (en) * | 2005-03-08 | 2006-10-21 | Asustek Comp Inc | Shielding structure |
US7733659B2 (en) | 2006-08-18 | 2010-06-08 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
US9237685B2 (en) | 2006-08-18 | 2016-01-12 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
JP4914678B2 (ja) * | 2006-08-31 | 2012-04-11 | 任天堂株式会社 | 電子機器 |
WO2010099415A1 (en) | 2009-02-27 | 2010-09-02 | Delphi Technologies, Inc. | Lightweight audio system for automotive appalications and method |
US9072169B1 (en) * | 2010-07-13 | 2015-06-30 | Cascodium Inc. | Pulse generator and systems and methods for using same |
JP5634644B2 (ja) * | 2012-08-03 | 2014-12-03 | 三菱電機株式会社 | シャーシ組付構造 |
JP5619966B2 (ja) * | 2012-10-11 | 2014-11-05 | アサステック・コンピューター・インコーポレイテッドAsustek Computer Inc. | 放熱構造 |
US9781819B2 (en) * | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
CN108886242B (zh) * | 2016-03-28 | 2020-07-31 | 松下知识产权经营株式会社 | 电连接构造体 |
CN111757660B (zh) * | 2020-07-15 | 2022-06-21 | 太原理工大学 | 一种非封闭式电磁屏蔽室 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2454251B1 (fr) | 1979-04-13 | 1987-06-12 | Klein Siegfried | Circuit blinde depourvu de fuites d'ondes electromagnetiques perturbatrices |
EP0360971A3 (de) * | 1988-08-31 | 1991-07-17 | Mitsui Mining & Smelting Co., Ltd. | Substrat für die Montage und sein Herstellungsverfahren und gedruckte Leiterplatte mit Verbinderfunktion und Verbindungsverfahren hierfür |
US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
US5366664A (en) | 1992-05-04 | 1994-11-22 | The Penn State Research Foundation | Electromagnetic shielding materials |
JPH08116195A (ja) * | 1994-10-14 | 1996-05-07 | Matsushita Electric Ind Co Ltd | 回路ユニットのシールド装置 |
JPH08279689A (ja) * | 1995-04-10 | 1996-10-22 | Matsushita Electric Ind Co Ltd | 半導体素子のシールド装置 |
US5981043A (en) * | 1996-04-25 | 1999-11-09 | Tatsuta Electric Wire And Cable Co., Ltd | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
WO1998010632A1 (en) | 1996-09-09 | 1998-03-12 | Tokin Corporation | Highly heat-conductive composite magnetic material |
JPH10224061A (ja) * | 1997-02-10 | 1998-08-21 | Matsushita Electric Ind Co Ltd | ヒートシンクユニット及び電子機器 |
JPH10322085A (ja) | 1997-03-14 | 1998-12-04 | Daido Steel Co Ltd | 遮蔽用シートとその製造方法 |
US5880930A (en) | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
GB2327537B (en) * | 1997-07-18 | 2002-05-22 | Nokia Mobile Phones Ltd | Electronic device |
US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
US6350951B1 (en) * | 1997-12-29 | 2002-02-26 | Intel Corporation | Electric shielding of on-board devices |
JP3969618B2 (ja) | 1998-03-23 | 2007-09-05 | 富士高分子工業株式会社 | 電磁波吸収性熱伝導性シリコーンゲル成形シートおよびその製造方法 |
JP3032505B1 (ja) * | 1998-10-19 | 2000-04-17 | 北川工業株式会社 | ヒートシンク |
US6208516B1 (en) * | 1999-05-11 | 2001-03-27 | Apple Computer, Inc. | Electromagnetic interference shield and gap filler for a circuit board |
US6219239B1 (en) * | 1999-05-26 | 2001-04-17 | Hewlett-Packard Company | EMI reduction device and assembly |
US6195267B1 (en) * | 1999-06-23 | 2001-02-27 | Ericsson Inc. | Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
-
2001
- 2001-03-01 DE DE60128191T patent/DE60128191T2/de not_active Expired - Lifetime
- 2001-03-01 AU AU36017/01A patent/AU3601701A/en not_active Abandoned
- 2001-03-01 EP EP01908186A patent/EP1181853B1/de not_active Expired - Lifetime
- 2001-03-01 RU RU2001132865/09A patent/RU2001132865A/ru not_active Application Discontinuation
- 2001-03-01 BR BR0105555-0A patent/BR0105555A/pt not_active Application Discontinuation
- 2001-03-01 CA CA002370716A patent/CA2370716A1/en not_active Abandoned
- 2001-03-01 WO PCT/JP2001/001555 patent/WO2001065901A2/en active IP Right Grant
- 2001-03-01 CN CNB018010377A patent/CN1197446C/zh not_active Expired - Lifetime
- 2001-03-01 NZ NZ515116A patent/NZ515116A/xx not_active IP Right Cessation
- 2001-03-01 MX MXPA01011118A patent/MXPA01011118A/es unknown
- 2001-03-01 AT AT01908186T patent/ATE361656T1/de not_active IP Right Cessation
- 2001-03-01 US US09/797,421 patent/US6498733B2/en not_active Expired - Lifetime
- 2001-03-01 KR KR1020017014022A patent/KR100790204B1/ko active IP Right Grant
-
2002
- 2002-03-07 HK HK02101748.1A patent/HK1040474A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
DE60128191T2 (de) | 2007-12-27 |
HK1040474A1 (zh) | 2002-06-07 |
CN1197446C (zh) | 2005-04-13 |
MXPA01011118A (es) | 2002-06-04 |
US6498733B2 (en) | 2002-12-24 |
CN1366800A (zh) | 2002-08-28 |
WO2001065901A3 (en) | 2002-03-14 |
NZ515116A (en) | 2002-12-20 |
EP1181853A1 (de) | 2002-02-27 |
BR0105555A (pt) | 2002-03-19 |
RU2001132865A (ru) | 2003-09-10 |
KR100790204B1 (ko) | 2007-12-31 |
KR20020007394A (ko) | 2002-01-26 |
US20010019477A1 (en) | 2001-09-06 |
AU3601701A (en) | 2001-09-12 |
EP1181853B1 (de) | 2007-05-02 |
WO2001065901A2 (en) | 2001-09-07 |
CA2370716A1 (en) | 2001-09-07 |
ATE361656T1 (de) | 2007-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |