BR0105555A - Dispositivo eletrônico blindado - Google Patents

Dispositivo eletrônico blindado

Info

Publication number
BR0105555A
BR0105555A BR0105555-0A BR0105555A BR0105555A BR 0105555 A BR0105555 A BR 0105555A BR 0105555 A BR0105555 A BR 0105555A BR 0105555 A BR0105555 A BR 0105555A
Authority
BR
Brazil
Prior art keywords
cpu
processing unit
image processing
shielding member
metal shielding
Prior art date
Application number
BR0105555-0A
Other languages
English (en)
Inventor
Osamu Murasawa
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Publication of BR0105555A publication Critical patent/BR0105555A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Surgical Instruments (AREA)
  • Liquid Crystal (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

"DISPOSITIVO ELETRôNICO BLINDADO". Onde um dispositivo de entretenimento que possui um elemento de blindagem metálico que cobre a CPU e a unidade de processamento de imagem e uma folha flexível que é intercalada entre a CPU e o elemento de blindagem metálico. O elemento de blindagem metálico contém partículas magnéticas de óxido de metal para cortar a radiação eletromagnética gerada da CPU e da unidade de processamento de imagem, enquanto que a folha flexível é posicionada para afastar o calor irradiado da CPU e da unidade de processamento de imagem.
BR0105555-0A 2000-03-03 2001-03-01 Dispositivo eletrônico blindado BR0105555A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000058729 2000-03-03
PCT/JP2001/001555 WO2001065901A2 (en) 2000-03-03 2001-03-01 Electronic device and shield

Publications (1)

Publication Number Publication Date
BR0105555A true BR0105555A (pt) 2002-03-19

Family

ID=18579278

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0105555-0A BR0105555A (pt) 2000-03-03 2001-03-01 Dispositivo eletrônico blindado

Country Status (14)

Country Link
US (1) US6498733B2 (pt)
EP (1) EP1181853B1 (pt)
KR (1) KR100790204B1 (pt)
CN (1) CN1197446C (pt)
AT (1) ATE361656T1 (pt)
AU (1) AU3601701A (pt)
BR (1) BR0105555A (pt)
CA (1) CA2370716A1 (pt)
DE (1) DE60128191T2 (pt)
HK (1) HK1040474A1 (pt)
MX (1) MXPA01011118A (pt)
NZ (1) NZ515116A (pt)
RU (1) RU2001132865A (pt)
WO (1) WO2001065901A2 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4048435B2 (ja) * 2003-10-23 2008-02-20 ソニー株式会社 電子機器
KR100652621B1 (ko) 2003-11-21 2006-12-06 엘지전자 주식회사 휴대용 단말기의 방열장치
JP2005249909A (ja) * 2004-03-02 2005-09-15 Pioneer Electronic Corp 画像表示装置のシールドケース及び画像表示装置
TWI264993B (en) * 2005-03-08 2006-10-21 Asustek Comp Inc Shielding structure
US7733659B2 (en) 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US9237685B2 (en) 2006-08-18 2016-01-12 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
JP4914678B2 (ja) * 2006-08-31 2012-04-11 任天堂株式会社 電子機器
WO2010099415A1 (en) 2009-02-27 2010-09-02 Delphi Technologies, Inc. Lightweight audio system for automotive appalications and method
US9072169B1 (en) * 2010-07-13 2015-06-30 Cascodium Inc. Pulse generator and systems and methods for using same
JP5634644B2 (ja) * 2012-08-03 2014-12-03 三菱電機株式会社 シャーシ組付構造
JP5619966B2 (ja) * 2012-10-11 2014-11-05 アサステック・コンピューター・インコーポレイテッドＡｓｕｓｔｅｋ Ｃｏｍｐｕｔｅｒ Ｉｎｃ． 放熱構造
US9781819B2 (en) * 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
CN108886242B (zh) * 2016-03-28 2020-07-31 松下知识产权经营株式会社 电连接构造体
CN111757660B (zh) * 2020-07-15 2022-06-21 太原理工大学 一种非封闭式电磁屏蔽室

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2454251B1 (fr) 1979-04-13 1987-06-12 Klein Siegfried Circuit blinde depourvu de fuites d'ondes electromagnetiques perturbatrices
EP0360971A3 (en) * 1988-08-31 1991-07-17 Mitsui Mining & Smelting Co., Ltd. Mounting substrate and its production method, and printed wiring board having connector function and its connection method
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5366664A (en) 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
JPH08116195A (ja) * 1994-10-14 1996-05-07 Matsushita Electric Ind Co Ltd 回路ユニットのシールド装置
JPH08279689A (ja) * 1995-04-10 1996-10-22 Matsushita Electric Ind Co Ltd 半導体素子のシールド装置
US5981043A (en) * 1996-04-25 1999-11-09 Tatsuta Electric Wire And Cable Co., Ltd Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
WO1998010632A1 (en) 1996-09-09 1998-03-12 Tokin Corporation Highly heat-conductive composite magnetic material
JPH10224061A (ja) * 1997-02-10 1998-08-21 Matsushita Electric Ind Co Ltd ヒートシンクユニット及び電子機器
JPH10322085A (ja) 1997-03-14 1998-12-04 Daido Steel Co Ltd 遮蔽用シートとその製造方法
US5880930A (en) 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
GB2327537B (en) * 1997-07-18 2002-05-22 Nokia Mobile Phones Ltd Electronic device
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US6350951B1 (en) * 1997-12-29 2002-02-26 Intel Corporation Electric shielding of on-board devices
JP3969618B2 (ja) 1998-03-23 2007-09-05 富士高分子工業株式会社 電磁波吸収性熱伝導性シリコーンゲル成形シートおよびその製造方法
JP3032505B1 (ja) * 1998-10-19 2000-04-17 北川工業株式会社 ヒートシンク
US6208516B1 (en) * 1999-05-11 2001-03-27 Apple Computer, Inc. Electromagnetic interference shield and gap filler for a circuit board
US6219239B1 (en) * 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly
US6195267B1 (en) * 1999-06-23 2001-02-27 Ericsson Inc. Gel structure for combined EMI shielding and thermal control of microelectronic assemblies

Also Published As

Publication number Publication date
DE60128191T2 (de) 2007-12-27
HK1040474A1 (zh) 2002-06-07
CN1197446C (zh) 2005-04-13
MXPA01011118A (es) 2002-06-04
US6498733B2 (en) 2002-12-24
CN1366800A (zh) 2002-08-28
WO2001065901A3 (en) 2002-03-14
NZ515116A (en) 2002-12-20
EP1181853A1 (en) 2002-02-27
RU2001132865A (ru) 2003-09-10
KR100790204B1 (ko) 2007-12-31
KR20020007394A (ko) 2002-01-26
DE60128191D1 (de) 2007-06-14
US20010019477A1 (en) 2001-09-06
AU3601701A (en) 2001-09-12
EP1181853B1 (en) 2007-05-02
WO2001065901A2 (en) 2001-09-07
CA2370716A1 (en) 2001-09-07
ATE361656T1 (de) 2007-05-15

Similar Documents

Publication Publication Date Title
BR0105555A (pt) Dispositivo eletrônico blindado
EP1130954A3 (en) Shield case
TW200505327A (en) Electronic device, information processor, and electromagnetic radiation suppressing member
TW200631491A (en) Sandwiched thermal solution
EP2509403A3 (en) Assemblies and methods for dissipating heat from handheld electronic devices
EP2259164B8 (en) Thermal solution for electronic devices
WO2007008342A3 (en) Thermal solution for portable electronic devices
WO2005024865A3 (en) Inductive power transfer units having flux shields
WO2008043012A3 (en) Package-level electromagnetic interference shielding
AU2002348053A1 (en) Induction heating devices and methods for controllably heating an article
WO2005048298A3 (en) Sandwiched thermal solution
US20140347811A1 (en) Portable electronic device with exposed heat dissipating mechanism
EP1348554A3 (en) Electromagnetic wave shielding member and recording apparatus incorporating the same
JP2008125283A (ja) 電力変換装置
JP2007088332A (ja) Ｅｍｃシールドケース
SG93293A1 (en) Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external environment
WO2016051720A1 (ja) シールドカバーおよび電子機器
JPH11233978A (ja) 電子機器の放熱構造とこの放熱構造を用いた電源装置
MXPA04002844A (es) Detector de circuito inductivo.
JP2006327153A (ja) 画像形成装置の接地機構
CN220511324U (zh) 一种穿戴设备的主板及穿戴设备
TW200709777A (en) Electronic devices and heat sink for preventing electromagnetic interference thereof
AU2002220163A1 (en) Electromagnetic shielding and cooling device for printed circuit board
TWI268756B (en) Electromagnetic interference shielding slice of digital light processing projection devices
JPH06232580A (ja) Ｉｃカード用コネクタ装置

Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]