DE60127768D1 - Goldverbindungsdraht für ein Halbleiterbauelement - Google Patents

Goldverbindungsdraht für ein Halbleiterbauelement

Info

Publication number
DE60127768D1
DE60127768D1 DE60127768T DE60127768T DE60127768D1 DE 60127768 D1 DE60127768 D1 DE 60127768D1 DE 60127768 T DE60127768 T DE 60127768T DE 60127768 T DE60127768 T DE 60127768T DE 60127768 D1 DE60127768 D1 DE 60127768D1
Authority
DE
Germany
Prior art keywords
semiconductor device
interconnect wire
gold interconnect
gold
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127768T
Other languages
English (en)
Other versions
DE60127768T2 (de
Inventor
Itabashi Ichimitsu
Takaura Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Publication of DE60127768D1 publication Critical patent/DE60127768D1/de
Application granted granted Critical
Publication of DE60127768T2 publication Critical patent/DE60127768T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%
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    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01205—5N purity grades, i.e. 99.999%
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20754—Diameter ranges larger or equal to 40 microns less than 50 microns
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20756—Diameter ranges larger or equal to 60 microns less than 70 microns
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20758—Diameter ranges larger or equal to 80 microns less than 90 microns
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/2076—Diameter ranges equal to or larger than 100 microns

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
DE60127768T 2000-06-19 2001-02-27 Goldverbindungsdraht für ein Halbleiterbauelement Expired - Lifetime DE60127768T2 (de)

Applications Claiming Priority (2)

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JP2000183521A JP3323185B2 (ja) 2000-06-19 2000-06-19 半導体素子接続用金線
JP2000183521 2000-06-19

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DE60127768D1 true DE60127768D1 (de) 2007-05-24
DE60127768T2 DE60127768T2 (de) 2007-12-27

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JP (1) JP3323185B2 (de)
KR (1) KR100695925B1 (de)
CN (1) CN1267991C (de)
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Publication number Priority date Publication date Assignee Title
US20080050267A1 (en) * 2004-09-30 2008-02-28 Hiroshi Murai Au Alloy Bonding Wire
CN100501956C (zh) * 2004-11-26 2009-06-17 田中电子工业株式会社 半导体组件用金焊接线
JP4595018B2 (ja) * 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
CN107644716B (zh) * 2017-09-15 2019-09-13 绍兴市高砚智生物科技有限公司 添加蜜胺甲醛树脂的复合铜丝生产方法
CN107958850A (zh) * 2017-11-28 2018-04-24 宁波尚进自动化科技有限公司 一种焊点焊接质量监控系统及其监控方法
CN109811176A (zh) * 2019-03-25 2019-05-28 杭州辰卓科技有限公司 一种电子器件封装高阻尼键合线用金合金及其工艺

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JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS61110735A (ja) * 1984-10-31 1986-05-29 Tatsuta Electric Wire & Cable Co Ltd 耐熱性に優れた金合金
JPS62228440A (ja) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk 半導体素子ボンデイング用金線
JP3337049B2 (ja) * 1995-05-17 2002-10-21 田中電子工業株式会社 ボンディング用金線
JP3657087B2 (ja) * 1996-07-31 2005-06-08 田中電子工業株式会社 ウエッジボンディング用金合金線
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
US5745418A (en) * 1996-11-25 1998-04-28 Macronix International Co., Ltd. Flash memory mass storage system
JP3573321B2 (ja) * 1996-12-11 2004-10-06 住友金属鉱山株式会社 Ａｕボンディングワイヤー
JP3669809B2 (ja) * 1997-04-25 2005-07-13 田中電子工業株式会社 半導体素子ボンディング用金合金線
JP2000040710A (ja) * 1998-07-24 2000-02-08 Sumitomo Metal Mining Co Ltd ボンディング用金合金細線

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KR100695925B1 (ko) 2007-03-20
EP1168439A3 (de) 2002-04-10
TW480635B (en) 2002-03-21
CN1330404A (zh) 2002-01-09
EP1168439B1 (de) 2007-04-11
EP1168439A2 (de) 2002-01-02
CN1267991C (zh) 2006-08-02
JP3323185B2 (ja) 2002-09-09
JP2002009101A (ja) 2002-01-11
MY136914A (en) 2008-11-28
SG87207A1 (en) 2002-03-19
KR20010113459A (ko) 2001-12-28
DE60127768T2 (de) 2007-12-27

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