CN107644716B - 添加蜜胺甲醛树脂的复合铜丝生产方法 - Google Patents
添加蜜胺甲醛树脂的复合铜丝生产方法 Download PDFInfo
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- CN107644716B CN107644716B CN201710830955.3A CN201710830955A CN107644716B CN 107644716 B CN107644716 B CN 107644716B CN 201710830955 A CN201710830955 A CN 201710830955A CN 107644716 B CN107644716 B CN 107644716B
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- copper wire
- composite copper
- melamino
- formaldehyde resin
- temperature
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Abstract
Description
高温软化温度(℃) | 盐酸、多硫化物测试 | |
实施例1 | 517 | 无漏铜、无黑斑 |
对比例1 | 453 | 无漏铜、无黑斑 |
对比例2 | 461 | 无漏铜、无黑斑 |
对比例3 | 439 | 无漏铜、无黑斑 |
对比例4 | 457 | 无漏铜、无黑斑 |
对比例5 | 516 | 漏铜、黑斑 |
对比例6 | 517 | 漏铜、黑斑 |
对比例7 | 515 | 漏铜、黑斑 |
对比例8 | 513 | 漏铜、黑斑 |
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CN201710830955.3A CN107644716B (zh) | 2017-09-15 | 2017-09-15 | 添加蜜胺甲醛树脂的复合铜丝生产方法 |
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CN201710830955.3A CN107644716B (zh) | 2017-09-15 | 2017-09-15 | 添加蜜胺甲醛树脂的复合铜丝生产方法 |
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CN107644716A CN107644716A (zh) | 2018-01-30 |
CN107644716B true CN107644716B (zh) | 2019-09-13 |
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JP3323185B2 (ja) * | 2000-06-19 | 2002-09-09 | 田中電子工業株式会社 | 半導体素子接続用金線 |
US6894398B2 (en) * | 2001-03-30 | 2005-05-17 | Intel Corporation | Insulated bond wire assembly for integrated circuits |
CN101979689B (zh) * | 2010-11-16 | 2011-11-23 | 蔡元华 | 键合铜线及其制备方法 |
EP2736047B1 (en) * | 2012-11-22 | 2017-11-08 | Heraeus Deutschland GmbH & Co. KG | Aluminium alloy wire for bonding applications |
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Effective date of registration: 20201029 Address after: 118 Renmin East Road, Linjiang Town, Haimen District, Nantong City, Jiangsu Province, 226100 Patentee after: Nantong Jiangyong Investment Development Co., Ltd Address before: Room 324, 46 Guangji Road, Lizhu Town, Keqiao District, Shaoxing City, Zhejiang Province Patentee before: Shaoxing Gaoyanzhi Biotechnology Co.,Ltd. |
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