CN105234586A - 一种无镉低银钎料 - Google Patents

一种无镉低银钎料 Download PDF

Info

Publication number
CN105234586A
CN105234586A CN201510769289.8A CN201510769289A CN105234586A CN 105234586 A CN105234586 A CN 105234586A CN 201510769289 A CN201510769289 A CN 201510769289A CN 105234586 A CN105234586 A CN 105234586A
Authority
CN
China
Prior art keywords
brazing material
silver
cadmium
rare earth
free low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510769289.8A
Other languages
English (en)
Inventor
陶纪明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG SIDA ALLOY MATERIALS Co Ltd
Original Assignee
ZHENJIANG SIDA ALLOY MATERIALS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG SIDA ALLOY MATERIALS Co Ltd filed Critical ZHENJIANG SIDA ALLOY MATERIALS Co Ltd
Priority to CN201510769289.8A priority Critical patent/CN105234586A/zh
Publication of CN105234586A publication Critical patent/CN105234586A/zh
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053Fe as the principal constituent
    • B23K35/3093Fe as the principal constituent with other elements as next major constituents

Abstract

本发明公开了一种无镉低银钎料,钎焊材料按质量百分比计包括以下组分:Zn:7-8.5%,Al:4.2-5.9%,Zr:2.5-4.5%,Ag:10.2-14.3%,Ni:2-4%,Ba:0.50-0.65%,Sn:5.5-6.5%,稀土元素:3.2-4.2%,其余为Cu。本发明对紫铜、黄铜、碳钢、不锈钢以及镍基合金等材料的润湿性能力好,固相线温度为682-707℃,液相线温度为780-800℃,钎料中含氧量为0.005%-0.012%,钎料伸长率达18.9%-20.2%并且伸长率提高率达12.5%-20.2%,钎料抗拉强度达569-603MPa并且抗拉强度提高率达18.0%-25.1%,银含量平均降低了约5%,从而不仅表现出了优良的塑性与强度,而且节约了银资源及降低了银钎料的成本。

Description

一种无镉低银钎料
技术领域
本发明涉及一种无镉低银钎料,属于新材料技术领域。
背景技术
随着我国制造业的快速发展,制造水平的不断进步,生产量稳步增长,特别是近年来白银价格的不断攀升,对银钎料的“性价比”提出了更高的要求。如银钎料中银的质量百分含量降低1%,即可节省60元人民币的材料成本。与此同时,随着电机、电器、制冷等行业制造技术的进步,对钎料的塑性、强度提出了更高的要求。因此,必须研究解决降低BAg25CuZn银钎料中银含量的问题,同时还要提高BAg25CuZn系银钎料的塑性与强度指标。
发明内容
本发明的目的在于,提供一种无镉低银钎料,具有润湿能力强、固-液相线温度适当、银含量较BAg25CuZn低、具有优良塑性与强度。
本发明提供的一种无镉低银钎料,钎焊材料按质量百分比计包括以下组分:Zn:7-8.5%,Al:4.2-5.9%,Zr:2.5-4.5%,Ag:10.2-14.3%,Ni:2-4%,Ba:0.50-0.65%,Sn:5.5-6.5%,稀土元素:3.2-4.2%,其余为Cu。
本发明的进一步限定技术方案:前述的无镉低银钎料,所述稀土元素的化学成分质量百分含量为:Nd:11-17%,Ce:11-18%,Pr:16-19%,Dy:5-12%,余量为La。
前述的无镉低银钎料,所述钎焊材料按质量百分比计包括以下组分:Zn:7.5%,Al:4.2%,Zr:2.5%,Ag:10.2%,Ni:2%,Ba:0.50%,Sn:5.5%,稀土元素:3.2%,其余为Cu;其中稀土元素的化学成分质量百分含量为:Nd:11%,Ce:11%,Pr:16%,Dy:5%,余量为La。
进一步的,前述的无镉低银钎料,所述钎焊材料按质量百分比计包括以下组分:Zn:8.5%,Al:5.9%,Zr:4.5%,Ag:14.3%,Ni:4%,Ba:0.65%,Sn:6.5%,稀土元素:4.2%,其余为Cu;其中稀土元素的化学成分质量百分含量为:Nd:17%,Ce:18%,Pr:19%,Dy:12%,余量为La。
本发明的有益效果:本发明对紫铜、黄铜、碳钢、不锈钢以及镍基合金等材料的润湿性能力好,固相线温度为682-707℃,液相线温度为780-800℃,钎料中含氧量为0.005%-0.012%,钎料伸长率达18.9%-20.2%并且伸长率提高率达12.5%-20.2%(与BAg25CuZn相对比),钎料抗拉强度达569-603MPa并且抗拉强度提高率达18.0%-25.1%(与BAg25CuZn相对比),银含量平均降低了约5%(与BAg25CuZn相对比),从而不仅表现出了优良的塑性与强度,而且节约了银资源及降低了银钎料的成本。
具体实施方式
实施例1
本实施例提供一种钎焊材料按质量百分比计包括以下组分:Zn:7.5%,Al:4.2%,Zr:2.5%,Ag:10.2%,Ni:2%,Ba:0.50%,Sn:5.5%,稀土元素:3.2%,其余为Cu;其中稀土元素的化学成分质量百分含量为:Nd:11%,Ce:11%,Pr:16%,Dy:5%,余量为La。
实施例2
本实施例提供一种无镉低银钎料,所述钎焊材料按质量百分比计包括以下组分:Zn:8.5%,Al:5.9%,Zr:4.5%,Ag:14.3%,Ni:4%,Ba:0.65%,Sn:6.5%,稀土元素:4.2%,其余为Cu;其中稀土元素的化学成分质量百分含量为:Nd:17%,Ce:18%,Pr:19%,Dy:12%,余量为La。
除上述实施例外,本发明还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案,均落在本发明要求的保护范围。

Claims (4)

1.一种无镉低银钎料,其特征在于:钎焊材料按质量百分比计包括以下组分:Zn:7-8.5%,Al:4.2-5.9%,Zr:2.5-4.5%,Ag:10.2-14.3%,Ni:2-4%,Ba:0.50-0.65%,Sn:5.5-6.5%,稀土元素:3.2-4.2%,其余为Cu。
2.根据权利要求1所述的无镉低银钎料,其特征在于:所述稀土元素的化学成分质量百分含量为:Nd:11-17%,Ce:11-18%,Pr:16-19%,Dy:5-12%,余量为La。
3.根据权利要求2所述的无镉低银钎料,其特征在于:所述钎焊材料按质量百分比计包括以下组分:Zn:7.5%,Al:4.2%,Zr:2.5%,Ag:10.2%,Ni:2%,Ba:0.50%,Sn:5.5%,稀土元素:3.2%,其余为Cu;其中稀土元素的化学成分质量百分含量为:Nd:11%,Ce:11%,Pr:16%,Dy:5%,余量为La。
4.根据权利要求2所述的无镉低银钎料,其特征在于:所述钎焊材料按质量百分比计包括以下组分:Zn:8.5%,Al:5.9%,Zr:4.5%,Ag:14.3%,Ni:4%,Ba:0.65%,Sn:6.5%,稀土元素:4.2%,其余为Cu;其中稀土元素的化学成分质量百分含量为:Nd:17%,Ce:18%,Pr:19%,Dy:12%,余量为La。
CN201510769289.8A 2015-11-12 2015-11-12 一种无镉低银钎料 Pending CN105234586A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510769289.8A CN105234586A (zh) 2015-11-12 2015-11-12 一种无镉低银钎料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510769289.8A CN105234586A (zh) 2015-11-12 2015-11-12 一种无镉低银钎料

Publications (1)

Publication Number Publication Date
CN105234586A true CN105234586A (zh) 2016-01-13

Family

ID=55032537

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510769289.8A Pending CN105234586A (zh) 2015-11-12 2015-11-12 一种无镉低银钎料

Country Status (1)

Country Link
CN (1) CN105234586A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109894771A (zh) * 2019-04-03 2019-06-18 南京理工大学 一种低银无镉银钎料
CN110280924A (zh) * 2019-04-03 2019-09-27 金华市双环钎焊材料有限公司 一种低熔点低银无镉银钎料
CN112108790A (zh) * 2020-08-11 2020-12-22 杭州华光焊接新材料股份有限公司 一种无镉低银钎料及其制备方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109894771A (zh) * 2019-04-03 2019-06-18 南京理工大学 一种低银无镉银钎料
CN110280924A (zh) * 2019-04-03 2019-09-27 金华市双环钎焊材料有限公司 一种低熔点低银无镉银钎料
CN109894771B (zh) * 2019-04-03 2020-10-30 南京理工大学 一种低银无镉银钎料
CN110280924B (zh) * 2019-04-03 2020-12-22 金华市双环钎焊材料有限公司 一种低熔点低银无镉银钎料
CN112108790A (zh) * 2020-08-11 2020-12-22 杭州华光焊接新材料股份有限公司 一种无镉低银钎料及其制备方法

Similar Documents

Publication Publication Date Title
CN101716702B (zh) 多元合金无镉低银钎料
US7985374B2 (en) Cadmium-free silver brazing filler metal
CN102851536A (zh) 一种用于导线的铜合金
CN102286676A (zh) 高强度锌合金
CN103028863B (zh) 一种高抗氧化无铅焊料
CN103382535A (zh) 一种高强、高导电、高延伸性铜合金及其制备方法
CN103418933A (zh) 一种连接黄铜和不锈钢的银钎料
CN105234586A (zh) 一种无镉低银钎料
CN100467192C (zh) 基本上包括锡(Sn)、银(Ag)、铜(Cu)和磷(P)的无Pb焊料合金组合物
CN102864332A (zh) 一种铜稀土合金
CN102864333A (zh) 一种铜稀土合金材料
CN101988167A (zh) 一种高温钛合金
CN105112720A (zh) 一种用于导线的铜合金
CN100408255C (zh) 含铟和铈的无镉银钎料
CN105195922A (zh) 一种高粘着耐磨铜基合金钎焊料
CN102816949B (zh) 一种铜镍19金属丝及其制备方法
CN105112721A (zh) 一种铜稀土合金材料
CN103909361A (zh) 一种低银含量的无镉钎料
CN100496861C (zh) 一种锡锌硒合金焊料
CN105328362A (zh) 一种高强度铜基钎焊材料
CN101985193B (zh) 无镉银钎料及其制备方法
CN105234585A (zh) 一种无铅铝铜合金钎焊料
CN102220513B (zh) 弹性铜合金及其制备方法以及该铜合金在电气电工设备中的应用
CN102041407B (zh) 一种高强度高导电性微硼铜合金材料及制备方法
CN114250383A (zh) 一种超导铜合金及其制备方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160113

WD01 Invention patent application deemed withdrawn after publication