DE60125105D1 - Lithographischer Projektionsapparat und lithographisches Verfahren zur Herstellung einer Vorrichtung - Google Patents

Lithographischer Projektionsapparat und lithographisches Verfahren zur Herstellung einer Vorrichtung

Info

Publication number
DE60125105D1
DE60125105D1 DE60125105T DE60125105T DE60125105D1 DE 60125105 D1 DE60125105 D1 DE 60125105D1 DE 60125105 T DE60125105 T DE 60125105T DE 60125105 T DE60125105 T DE 60125105T DE 60125105 D1 DE60125105 D1 DE 60125105D1
Authority
DE
Germany
Prior art keywords
lithographic
making
projection apparatus
lithographic process
lithographic projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60125105T
Other languages
English (en)
Other versions
DE60125105T2 (de
Inventor
Jozef Petrus Henricus Benschop
Oscar Fransiscus Joze Noordman
Michael Jozefa Mathijs Renkens
Erik Roelof Loopstra
Vadim Yevgenyevich Banine
Johannes Hubertus Joseph Moors
Dijsseldonk Antonius Johan Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60125105D1 publication Critical patent/DE60125105D1/de
Publication of DE60125105T2 publication Critical patent/DE60125105T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
DE60125105T 2000-07-10 2001-07-06 Lithographischer Projektionsapparat und lithographisches Verfahren zur Herstellung einer Vorrichtung Expired - Fee Related DE60125105T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00202457 2000-07-10
EP00202457 2000-07-10

Publications (2)

Publication Number Publication Date
DE60125105D1 true DE60125105D1 (de) 2007-01-25
DE60125105T2 DE60125105T2 (de) 2007-06-06

Family

ID=8171784

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60125105T Expired - Fee Related DE60125105T2 (de) 2000-07-10 2001-07-06 Lithographischer Projektionsapparat und lithographisches Verfahren zur Herstellung einer Vorrichtung

Country Status (5)

Country Link
US (1) US6597431B2 (de)
JP (1) JP3983506B2 (de)
KR (1) KR100554259B1 (de)
DE (1) DE60125105T2 (de)
TW (1) TW554257B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7015491B2 (en) * 2001-06-01 2006-03-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby, control system
US6737662B2 (en) * 2001-06-01 2004-05-18 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, device manufactured thereby, control system, computer program, and computer program product
NL2009020A (en) * 2011-07-22 2013-01-24 Asml Netherlands Bv Radiation source, method of controlling a radiation source, lithographic apparatus, and method for manufacturing a device.
WO2016041733A1 (en) * 2014-09-15 2016-03-24 Asml Netherlands B.V. Lithographic apparatus and method
WO2017008951A1 (en) * 2015-07-16 2017-01-19 Asml Netherlands B.V. Lithographic apparatus and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604562A (en) * 1982-09-29 1986-08-05 Eaton-Optimetrix Inc. Feedback-controlled workpiece positioning system
JP3235078B2 (ja) * 1993-02-24 2001-12-04 株式会社ニコン 走査露光方法、露光制御装置、走査型露光装置、及びデバイス製造方法
JP3451604B2 (ja) * 1994-06-17 2003-09-29 株式会社ニコン 走査型露光装置
KR970002483A (ko) * 1995-06-01 1997-01-24 오노 시게오 노광 장치
DE69728948T2 (de) * 1996-11-14 2005-09-15 Nikon Corp. Projektionsbelichtungsvorrichtung und Verfahren
JPH10214779A (ja) * 1997-01-31 1998-08-11 Canon Inc 電子ビーム露光方法及び該方法を用いたデバイス製造方法
TW468090B (en) * 1998-12-17 2001-12-11 Asm Lithography Bv Servo control method, and its application in a lithographic projection apparatus

Also Published As

Publication number Publication date
KR20020005967A (ko) 2002-01-18
JP3983506B2 (ja) 2007-09-26
US20020018194A1 (en) 2002-02-14
DE60125105T2 (de) 2007-06-06
JP2002100564A (ja) 2002-04-05
US6597431B2 (en) 2003-07-22
TW554257B (en) 2003-09-21
KR100554259B1 (ko) 2006-02-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee