DE60114851D1 - Hoch zuverlässige nicht leitfähige klebstoffe für lötlose flip-chip-bondings und flip-chip-bondverfahren damit - Google Patents
Hoch zuverlässige nicht leitfähige klebstoffe für lötlose flip-chip-bondings und flip-chip-bondverfahren damitInfo
- Publication number
- DE60114851D1 DE60114851D1 DE60114851T DE60114851T DE60114851D1 DE 60114851 D1 DE60114851 D1 DE 60114851D1 DE 60114851 T DE60114851 T DE 60114851T DE 60114851 T DE60114851 T DE 60114851T DE 60114851 D1 DE60114851 D1 DE 60114851D1
- Authority
- DE
- Germany
- Prior art keywords
- flip chip
- phase
- nca
- chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000007791 liquid phase Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 239000007790 solid phase Substances 0.000 abstract 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 239000013034 phenoxy resin Substances 0.000 abstract 1
- 229920006287 phenoxy resin Polymers 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2000044829 | 2000-08-02 | ||
KR1020000044829A KR100315158B1 (ko) | 2000-08-02 | 2000-08-02 | 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법 |
PCT/KR2001/001313 WO2002015259A1 (en) | 2000-08-02 | 2001-08-02 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60114851D1 true DE60114851D1 (de) | 2005-12-15 |
DE60114851T2 DE60114851T2 (de) | 2006-08-03 |
Family
ID=36686694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60114851T Expired - Lifetime DE60114851T2 (de) | 2000-08-02 | 2001-08-02 | Hoch zuverlässige nicht leitfähige klebstoffe für lötlose flip-chip-bondings und flip-chip-bondverfahren damit |
Country Status (7)
Country | Link |
---|---|
US (1) | US6930399B2 (de) |
EP (1) | EP1314197B1 (de) |
JP (1) | JP2004507089A (de) |
KR (1) | KR100315158B1 (de) |
AT (1) | ATE309615T1 (de) |
DE (1) | DE60114851T2 (de) |
WO (1) | WO2002015259A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100398315B1 (ko) * | 2001-02-12 | 2003-09-19 | 한국과학기술원 | 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법 |
KR100398314B1 (ko) * | 2001-07-19 | 2003-09-19 | 한국과학기술원 | 고접착력 3층 구조 aca 필름 |
US6605491B1 (en) * | 2002-05-21 | 2003-08-12 | Industrial Technology Research Institute | Method for bonding IC chips to substrates with non-conductive adhesive |
KR100559937B1 (ko) * | 2003-01-08 | 2006-03-13 | 엘에스전선 주식회사 | 미세회로의 접속방법 및 그에 의한 접속 구조체 |
US20040158008A1 (en) * | 2003-02-06 | 2004-08-12 | Xiping He | Room temperature printable adhesive paste |
DE10311964A1 (de) * | 2003-03-18 | 2004-10-07 | Infineon Technologies Ag | Chipmodul und Herstellungsverfahren |
CN100422235C (zh) * | 2003-10-17 | 2008-10-01 | 深圳丹邦科技有限公司 | 用于芯片搭载及封装的电绝缘树脂浆 |
US7160797B2 (en) | 2004-05-12 | 2007-01-09 | Kulicke And Soffa Industries, Inc. | Method of bumping die pads for wafer testing |
WO2006137884A2 (en) * | 2004-09-28 | 2006-12-28 | Brewer, Science Inc. | Curable high refractive index resins for optoelectronic applications |
KR100734264B1 (ko) | 2005-06-16 | 2007-07-02 | 삼성전자주식회사 | 집적회로 패키지와 집적회로 모듈 |
EP1760437A1 (de) | 2005-09-06 | 2007-03-07 | Sensirion AG | Verfahren zur Herstellung von Detektionsvorrichtungen |
US7408243B2 (en) * | 2005-12-14 | 2008-08-05 | Honeywell International Inc. | High temperature package flip-chip bonding to ceramic |
JP4920330B2 (ja) * | 2006-07-18 | 2012-04-18 | ソニー株式会社 | 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法 |
US20080079175A1 (en) * | 2006-10-02 | 2008-04-03 | Michael Bauer | Layer for chip contact element |
KR100821097B1 (ko) | 2007-04-06 | 2008-04-08 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지용 입출력단자 및 이를 이용한 반도체 패키지제조 방법 |
US8030098B1 (en) | 2007-08-29 | 2011-10-04 | Marvell International Ltd. | Pre-formed conductive bumps on bonding pads |
JP2009096851A (ja) * | 2007-10-15 | 2009-05-07 | Three M Innovative Properties Co | 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法 |
JP5493327B2 (ja) * | 2007-12-18 | 2014-05-14 | 日立化成株式会社 | 封止充てん用樹脂組成物、並びに半導体装置及びその製造方法 |
EP2224218B1 (de) * | 2009-02-25 | 2018-11-28 | Sensirion Automotive Solutions AG | Sensor in einer geformten Verpackung und Herstellungsverfahren dafür |
US20100301467A1 (en) * | 2009-05-26 | 2010-12-02 | Albert Wu | Wirebond structures |
US8371497B2 (en) * | 2009-06-11 | 2013-02-12 | Qualcomm Incorporated | Method for manufacturing tight pitch, flip chip integrated circuit packages |
TWM397591U (en) * | 2010-04-22 | 2011-02-01 | Mao Bang Electronic Co Ltd | Bumping structure |
CN103059328A (zh) * | 2011-10-21 | 2013-04-24 | 玮锋科技股份有限公司 | 非导电性薄膜的制备方法 |
CN102796479B (zh) * | 2012-08-31 | 2014-04-30 | 中国船舶重工集团公司第七一二研究所 | 一种用于生产层压母线绝缘衬垫的胶粘剂及其制备方法和绝缘衬垫的生产方法 |
JP6578033B2 (ja) * | 2018-01-29 | 2019-09-18 | ウォン ユン、セ | 電子部品の容器の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2570002B2 (ja) * | 1991-05-29 | 1997-01-08 | 信越化学工業株式会社 | フリップチップ用封止材及び半導体装置 |
US5976699A (en) * | 1995-11-09 | 1999-11-02 | Sumitomo Bakelite Company Limited | Insulating adhesive for multilayer printed circuit board |
US5863970A (en) * | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
KR100274333B1 (ko) * | 1996-01-19 | 2001-01-15 | 모기 쥰이찌 | 도체층부착 이방성 도전시트 및 이를 사용한 배선기판 |
US6144101A (en) * | 1996-12-03 | 2000-11-07 | Micron Technology, Inc. | Flip chip down-bond: method and apparatus |
KR100306116B1 (ko) * | 1998-12-31 | 2001-11-30 | 구자홍 | 반도체베어칩의다이렉트어테치본딩방법 |
US6447915B1 (en) * | 1999-03-11 | 2002-09-10 | Sumitomo Bakelite Company Limited | Interlaminar insulating adhesive for multilayer printed circuit board |
JP3325000B2 (ja) * | 1999-05-28 | 2002-09-17 | ソニーケミカル株式会社 | 半導体素子の実装方法 |
-
2000
- 2000-08-02 KR KR1020000044829A patent/KR100315158B1/ko not_active IP Right Cessation
-
2001
- 2001-08-02 AT AT01954524T patent/ATE309615T1/de not_active IP Right Cessation
- 2001-08-02 DE DE60114851T patent/DE60114851T2/de not_active Expired - Lifetime
- 2001-08-02 EP EP01954524A patent/EP1314197B1/de not_active Expired - Lifetime
- 2001-08-02 WO PCT/KR2001/001313 patent/WO2002015259A1/en active IP Right Grant
- 2001-08-02 US US10/343,519 patent/US6930399B2/en not_active Expired - Lifetime
- 2001-08-02 JP JP2002520292A patent/JP2004507089A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2002015259A1 (en) | 2002-02-21 |
ATE309615T1 (de) | 2005-11-15 |
KR20000063759A (ko) | 2000-11-06 |
EP1314197A1 (de) | 2003-05-28 |
EP1314197A4 (de) | 2004-11-10 |
KR100315158B1 (ko) | 2001-11-26 |
US6930399B2 (en) | 2005-08-16 |
JP2004507089A (ja) | 2004-03-04 |
EP1314197B1 (de) | 2005-11-09 |
DE60114851T2 (de) | 2006-08-03 |
US20030143797A1 (en) | 2003-07-31 |
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