DE60045302D1 - Verfahren zur Dotierung eines Halbleiterkörpers - Google Patents

Verfahren zur Dotierung eines Halbleiterkörpers

Info

Publication number
DE60045302D1
DE60045302D1 DE60045302T DE60045302T DE60045302D1 DE 60045302 D1 DE60045302 D1 DE 60045302D1 DE 60045302 T DE60045302 T DE 60045302T DE 60045302 T DE60045302 T DE 60045302T DE 60045302 D1 DE60045302 D1 DE 60045302D1
Authority
DE
Germany
Prior art keywords
doping
semiconductor body
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60045302T
Other languages
English (en)
Inventor
Jeng Ping Lu
Ping Mei
James B Boyce
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE60045302D1 publication Critical patent/DE60045302D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251—Diffusion into or out of group IV semiconductors
    • H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651—Silicon transistors
    • H01L29/7866—Non-monocrystalline silicon transistors
    • H01L29/78663—Amorphous silicon transistors
    • H01L29/78669—Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate
DE60045302T 1999-12-28 2000-12-13 Verfahren zur Dotierung eines Halbleiterkörpers Expired - Lifetime DE60045302D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/473,576 US6586318B1 (en) 1999-12-28 1999-12-28 Thin phosphorus nitride film as an N-type doping source used in laser doping technology

Publications (1)

Publication Number Publication Date
DE60045302D1 true DE60045302D1 (de) 2011-01-13

Family

ID=23880132

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60045302T Expired - Lifetime DE60045302D1 (de) 1999-12-28 2000-12-13 Verfahren zur Dotierung eines Halbleiterkörpers

Country Status (4)

Country Link
US (2) US6586318B1 (de)
EP (1) EP1113486B1 (de)
JP (1) JP2001223174A (de)
DE (1) DE60045302D1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6586318B1 (en) * 1999-12-28 2003-07-01 Xerox Corporation Thin phosphorus nitride film as an N-type doping source used in laser doping technology
US7442629B2 (en) * 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
JP4387091B2 (ja) * 2002-11-05 2009-12-16 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
TWI280667B (en) * 2006-04-11 2007-05-01 Au Optronics Corp A manufacturing method for a liquid crystal display
US7501648B2 (en) * 2006-08-16 2009-03-10 International Business Machines Corporation Phase change materials and associated memory devices
JP4625793B2 (ja) * 2006-09-08 2011-02-02 株式会社東芝 半導体デバイス
TWI508142B (zh) * 2006-12-18 2015-11-11 Applied Materials Inc 低能量、高劑量砷、磷與硼植入晶圓的安全處理
KR101329352B1 (ko) * 2007-10-17 2013-11-13 삼성전자주식회사 반도체 장치의 제조방법
US7989329B2 (en) * 2007-12-21 2011-08-02 Applied Materials, Inc. Removal of surface dopants from a substrate
US8207051B2 (en) * 2009-04-28 2012-06-26 Sionyx, Inc. Semiconductor surface modification
US7799666B1 (en) 2009-07-27 2010-09-21 Potomac Photonics, Inc. Method of spatially selective laser-assisted doping of a semiconductor
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
EP2583312A2 (de) 2010-06-18 2013-04-24 Sionyx, Inc. Lichtempfindliche hochgeschwindigkeitsvorrichtungen und verfahren dafür
US8569158B2 (en) * 2011-03-31 2013-10-29 Tokyo Electron Limited Method for forming ultra-shallow doping regions by solid phase diffusion
US8580664B2 (en) 2011-03-31 2013-11-12 Tokyo Electron Limited Method for forming ultra-shallow boron doping regions by solid phase diffusion
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
JP2014525091A (ja) 2011-07-13 2014-09-25 サイオニクス、インク． 生体撮像装置および関連方法
JP6239227B2 (ja) * 2011-11-30 2017-11-29 株式会社半導体エネルギー研究所 半導体装置および半導体装置の作製方法
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
TWI476933B (zh) * 2012-03-27 2015-03-11 Hon Hai Prec Ind Co Ltd 薄膜電晶體
JP6466346B2 (ja) 2013-02-15 2019-02-06 サイオニクス、エルエルシー アンチブルーミング特性を有するハイダイナミックレンジｃｍｏｓ画像センサおよび関連づけられた方法
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
WO2014209421A1 (en) 2013-06-29 2014-12-31 Sionyx, Inc. Shallow trench textured regions and associated methods
US9899224B2 (en) 2015-03-03 2018-02-20 Tokyo Electron Limited Method of controlling solid phase diffusion of boron dopants to form ultra-shallow doping regions

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4415526A (en) * 1977-05-31 1983-11-15 Metco Properties Metal phthalocyanine on a substrate
US4276557A (en) * 1978-12-29 1981-06-30 Bell Telephone Laboratories, Incorporated Integrated semiconductor circuit structure and method for making it
US4737429A (en) * 1986-06-26 1988-04-12 Xerox Corporation Layered amorphous silicon imaging members
JP2819694B2 (ja) * 1989-11-17 1998-10-30 富士ゼロックス株式会社 Ｍｏｓ型半導体装置の製造方法
JPH04269832A (ja) * 1991-02-26 1992-09-25 Shin Etsu Chem Co Ltd Ｘ線リソグラフィ−用マスクの製造方法
JPH07135308A (ja) * 1993-11-10 1995-05-23 Fujitsu Ltd 半導体装置の製造方法
US5871826A (en) * 1996-05-30 1999-02-16 Xerox Corporation Proximity laser doping technique for electronic materials
JPH10144633A (ja) * 1996-11-08 1998-05-29 Mitsubishi Electric Corp 半導体装置の製造方法
US5908307A (en) * 1997-01-31 1999-06-01 Ultratech Stepper, Inc. Fabrication method for reduced-dimension FET devices
US5885904A (en) * 1997-02-14 1999-03-23 Advanced Micro Devices, Inc. Method to incorporate, and a device having, oxide enhancement dopants using gas immersion laser doping (GILD) for selectively growing an oxide layer
US5904575A (en) * 1997-02-14 1999-05-18 Advanced Micro Devices, Inc. Method and apparatus incorporating nitrogen selectively for differential oxide growth
US5918140A (en) 1997-06-16 1999-06-29 The Regents Of The University Of California Deposition of dopant impurities and pulsed energy drive-in
CA2211949A1 (en) * 1997-07-21 1999-01-29 David Farley Johnson Nonaqueous compositions for parenteral administration
US6107641A (en) * 1997-09-10 2000-08-22 Xerox Corporation Thin film transistor with reduced parasitic capacitance and reduced feed-through voltage
JPH11298090A (ja) * 1998-04-09 1999-10-29 Nichia Chem Ind Ltd 窒化物半導体素子
US5956603A (en) * 1998-08-27 1999-09-21 Ultratech Stepper, Inc. Gas immersion laser annealing method suitable for use in the fabrication of reduced-dimension integrated circuits
KR100281692B1 (ko) * 1998-10-17 2001-03-02 윤종용 반도체 장치의 자기정렬 콘택 패드 및 그 형성 방법
US6586318B1 (en) * 1999-12-28 2003-07-01 Xerox Corporation Thin phosphorus nitride film as an N-type doping source used in laser doping technology

Also Published As

Publication number Publication date
JP2001223174A (ja) 2001-08-17
US6818535B2 (en) 2004-11-16
EP1113486B1 (de) 2010-12-01
US20030067037A1 (en) 2003-04-10
US6586318B1 (en) 2003-07-01
EP1113486A2 (de) 2001-07-04
EP1113486A3 (de) 2001-09-26

Similar Documents

Publication Publication Date Title
DE60045302D1 (de) Verfahren zur Dotierung eines Halbleiterkörpers
DE60036449D1 (de) Verfahren zur hestellung eines dünnschichtfeldeffekttransistors
DE60038423D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE60045636D1 (de) Verfahren zur behandlung eines halbleitersubstrats
DE60044639D1 (de) Verfahren zur herstellung einer halbleitervorrichtung
DE50001388D1 (de) Verfahren zur rasterisierung eines graphikgrundelements
DE60022857D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE60042254D1 (de) Verfahren zur Herstellung einer Halbleiter-Anordnung
DE69912376D1 (de) Verfahren zur herstellung eines halbleiterbauelements
DE50114579D1 (de) Verfahren zur Bedienung eines Aufzuges
DE69941230D1 (de) Verfahren zur Herstellung eines Halbleitergehäuses
DE60007688D1 (de) Verfahren und Vorrichtung zur Herstellung eines Werkzeugs
DE50208649D1 (de) Verfahren zur bereitschaftshaltung eines kombikraftwerkes
DE60122131D1 (de) Verfahren zum verkleben eines fügeteils
DE50004536D1 (de) Verfahren zum Vermessen eines Körperbereichs
ATA67898A (de) Verfahren zur gewinnung eines desinfektionsmittels
DE50113179D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE60044470D1 (de) Verfahren zur herstellung eines halbleiterelement
DE60041503D1 (de) Verfahren zur konturkorrektur
DE60000836T2 (de) Verfahren zur herstellung eines dns chip
DE50001656D1 (de) Verfahren zur herstellung eines planetenträgers
DE69922617D1 (de) Verfahren zur Herstellung eines Halbleiterbauelementes
DE50115216D1 (de) Halbleiterbauelement und verfahren zur identifizierung eines halbleiterbauelementes
DE50208521D1 (de) Verfahren zur Ausbildung eines Silizium-Halbleiterkörpers
DE60034387D1 (de) Verfahren zur Bedienung eines Kranes