DE60044836D1 - Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem - Google Patents
Festkörperbildaufnahmevorrichtung und BildaufnahmesystemInfo
- Publication number
- DE60044836D1 DE60044836D1 DE60044836T DE60044836T DE60044836D1 DE 60044836 D1 DE60044836 D1 DE 60044836D1 DE 60044836 T DE60044836 T DE 60044836T DE 60044836 T DE60044836 T DE 60044836T DE 60044836 D1 DE60044836 D1 DE 60044836D1
- Authority
- DE
- Germany
- Prior art keywords
- image pickup
- solid state
- pickup device
- state image
- pickup system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007787 solid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28446399 | 1999-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60044836D1 true DE60044836D1 (de) | 2010-09-30 |
Family
ID=17678869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60044836T Expired - Lifetime DE60044836D1 (de) | 1999-10-05 | 2000-10-04 | Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem |
Country Status (3)
Country | Link |
---|---|
US (1) | US7081607B1 (de) |
EP (2) | EP2244295B1 (de) |
DE (1) | DE60044836D1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60044836D1 (de) | 1999-10-05 | 2010-09-30 | Canon Kk | Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem |
US6965408B2 (en) * | 2000-02-28 | 2005-11-15 | Canon Kabushiki Kaisha | Solid-state image pickup device having a photoelectric conversion unit and a punch-through current suppression circuit |
JP3667214B2 (ja) * | 2000-08-25 | 2005-07-06 | キヤノン株式会社 | 固体撮像装置およびその駆動方法 |
JP3792628B2 (ja) * | 2002-09-02 | 2006-07-05 | 富士通株式会社 | 固体撮像装置及び画像読み出し方法 |
US7369168B2 (en) * | 2003-07-29 | 2008-05-06 | Micron Technology, Inc. | Circuit for an active pixel sensor |
JP4194544B2 (ja) * | 2003-12-05 | 2008-12-10 | キヤノン株式会社 | 固体撮像装置及び固体撮像装置の駆動方法 |
US7446357B2 (en) * | 2005-05-11 | 2008-11-04 | Micron Technology, Inc. | Split trunk pixel layout |
JP4144892B2 (ja) * | 2006-08-28 | 2008-09-03 | キヤノン株式会社 | 光電変換装置及び撮像装置 |
JP5173503B2 (ja) * | 2008-03-14 | 2013-04-03 | キヤノン株式会社 | 撮像装置及び撮像システム |
US8366318B2 (en) | 2009-07-17 | 2013-02-05 | Dental Imaging Technologies Corporation | Intraoral X-ray sensor with embedded standard computer interface |
US9492129B2 (en) * | 2008-10-27 | 2016-11-15 | Dental Imaging Technologies Corporation | Triggering of intraoral X-ray sensor using pixel array sub-sampling |
JP5458582B2 (ja) * | 2009-01-28 | 2014-04-02 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法および電子機器 |
US8829407B2 (en) * | 2010-10-19 | 2014-09-09 | Aptina Imaging Corporation | Imaging systems and methods including pixel arrays with reduced numbers of metal lines and control signals |
JP6537838B2 (ja) * | 2015-01-30 | 2019-07-03 | ルネサスエレクトロニクス株式会社 | 撮像素子 |
US10453880B2 (en) | 2015-09-18 | 2019-10-22 | National University Corporation Shizuoka University | Semiconductor element and solid-state imaging device |
US10225499B2 (en) * | 2016-04-11 | 2019-03-05 | Semiconductor Components Industries, Llc | Backside illuminated global shutter pixel with active reset |
JP6909747B2 (ja) * | 2018-03-23 | 2021-07-28 | 株式会社東芝 | 固体撮像装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5678364U (de) * | 1979-11-14 | 1981-06-25 | ||
EP0277016B1 (de) | 1987-01-29 | 1998-04-15 | Canon Kabushiki Kaisha | Photovoltaischer Wandler |
US4959723A (en) | 1987-11-06 | 1990-09-25 | Canon Kabushiki Kaisha | Solid state image pickup apparatus having multi-phase scanning pulse to read out accumulated signal |
JPH04199968A (ja) * | 1990-11-29 | 1992-07-21 | Toshiba Corp | 固体撮像装置 |
US5406332A (en) | 1992-03-06 | 1995-04-11 | Canon Kabushiki Kaisha | Photoelectric converting device |
US5386108A (en) | 1992-06-25 | 1995-01-31 | Canon Kabushiki Kaisha | Photoelectric conversion device for amplifying and outputting photoelectrically converted signal, and a method thereof |
JPH06334920A (ja) * | 1993-03-23 | 1994-12-02 | Nippon Hoso Kyokai <Nhk> | 固体撮像素子とその駆動方法 |
JPH0730084A (ja) | 1993-07-14 | 1995-01-31 | Fuji Xerox Co Ltd | 2次元密着型イメージセンサ |
JP3758205B2 (ja) * | 1995-06-07 | 2006-03-22 | ソニー株式会社 | 固体撮像装置及びこれを用いたビデオカメラ、並びにx‐yアドレス型固体撮像装置の駆動方法 |
EP0757475B1 (de) | 1995-08-02 | 2004-01-21 | Canon Kabushiki Kaisha | Halbleiter-Bildaufnehmer mit gemeinsamer Ausgangsleistung |
JP3031606B2 (ja) * | 1995-08-02 | 2000-04-10 | キヤノン株式会社 | 固体撮像装置と画像撮像装置 |
JP3838665B2 (ja) * | 1995-08-11 | 2006-10-25 | 株式会社 東芝 | Mos型固体撮像装置 |
US5831258A (en) * | 1996-08-20 | 1998-11-03 | Xerox Corporation | Pixel circuit with integrated amplifer |
US6002287A (en) | 1997-05-08 | 1999-12-14 | Canon Kabushiki Kaisha | Signal outputting apparatus |
US5898168A (en) * | 1997-06-12 | 1999-04-27 | International Business Machines Corporation | Image sensor pixel circuit |
JP3466886B2 (ja) * | 1997-10-06 | 2003-11-17 | キヤノン株式会社 | 固体撮像装置 |
JP4255527B2 (ja) | 1997-10-20 | 2009-04-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP3571909B2 (ja) * | 1998-03-19 | 2004-09-29 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
US6054704A (en) * | 1998-06-30 | 2000-04-25 | Foveon, Inc. | Driven capacitor storage pixel sensor and array |
JP2000152086A (ja) | 1998-11-11 | 2000-05-30 | Canon Inc | 撮像装置および撮像システム |
DE60044836D1 (de) | 1999-10-05 | 2010-09-30 | Canon Kk | Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem |
-
2000
- 2000-10-04 DE DE60044836T patent/DE60044836D1/de not_active Expired - Lifetime
- 2000-10-04 US US09/678,025 patent/US7081607B1/en not_active Expired - Fee Related
- 2000-10-04 EP EP10167170A patent/EP2244295B1/de not_active Expired - Lifetime
- 2000-10-04 EP EP00308803A patent/EP1091409B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1091409A2 (de) | 2001-04-11 |
EP1091409B1 (de) | 2010-08-18 |
US7081607B1 (en) | 2006-07-25 |
EP1091409A3 (de) | 2006-10-18 |
EP2244295A1 (de) | 2010-10-27 |
EP2244295B1 (de) | 2011-12-21 |
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