DE60044836D1 - Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem - Google Patents

Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem

Info

Publication number
DE60044836D1
DE60044836D1 DE60044836T DE60044836T DE60044836D1 DE 60044836 D1 DE60044836 D1 DE 60044836D1 DE 60044836 T DE60044836 T DE 60044836T DE 60044836 T DE60044836 T DE 60044836T DE 60044836 D1 DE60044836 D1 DE 60044836D1
Authority
DE
Germany
Prior art keywords
image pickup
solid state
pickup device
state image
pickup system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60044836T
Other languages
English (en)
Inventor
Toru Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60044836D1 publication Critical patent/DE60044836D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE60044836T 1999-10-05 2000-10-04 Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem Expired - Lifetime DE60044836D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28446399 1999-10-05

Publications (1)

Publication Number Publication Date
DE60044836D1 true DE60044836D1 (de) 2010-09-30

Family

ID=17678869

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60044836T Expired - Lifetime DE60044836D1 (de) 1999-10-05 2000-10-04 Festkörperbildaufnahmevorrichtung und Bildaufnahmesystem

Country Status (3)

Country Link
US (1) US7081607B1 (de)
EP (2) EP1091409B1 (de)
DE (1) DE60044836D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7081607B1 (en) 1999-10-05 2006-07-25 Canon Kabushiki Kaisha Solid state image pickup device and image pickup system
US6965408B2 (en) 2000-02-28 2005-11-15 Canon Kabushiki Kaisha Solid-state image pickup device having a photoelectric conversion unit and a punch-through current suppression circuit
JP3667214B2 (ja) * 2000-08-25 2005-07-06 キヤノン株式会社 固体撮像装置およびその駆動方法
JP3792628B2 (ja) * 2002-09-02 2006-07-05 富士通株式会社 固体撮像装置及び画像読み出し方法
US7369168B2 (en) * 2003-07-29 2008-05-06 Micron Technology, Inc. Circuit for an active pixel sensor
JP4194544B2 (ja) * 2003-12-05 2008-12-10 キヤノン株式会社 固体撮像装置及び固体撮像装置の駆動方法
US7446357B2 (en) 2005-05-11 2008-11-04 Micron Technology, Inc. Split trunk pixel layout
JP4144892B2 (ja) * 2006-08-28 2008-09-03 キヤノン株式会社 光電変換装置及び撮像装置
JP5173503B2 (ja) * 2008-03-14 2013-04-03 キヤノン株式会社 撮像装置及び撮像システム
US9492129B2 (en) * 2008-10-27 2016-11-15 Dental Imaging Technologies Corporation Triggering of intraoral X-ray sensor using pixel array sub-sampling
US8366318B2 (en) 2009-07-17 2013-02-05 Dental Imaging Technologies Corporation Intraoral X-ray sensor with embedded standard computer interface
JP5458582B2 (ja) * 2009-01-28 2014-04-02 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および電子機器
US8829407B2 (en) * 2010-10-19 2014-09-09 Aptina Imaging Corporation Imaging systems and methods including pixel arrays with reduced numbers of metal lines and control signals
JP6537838B2 (ja) * 2015-01-30 2019-07-03 ルネサスエレクトロニクス株式会社 撮像素子
WO2017047774A1 (ja) 2015-09-18 2017-03-23 国立大学法人静岡大学 半導体素子及び固体撮像装置
US10225499B2 (en) 2016-04-11 2019-03-05 Semiconductor Components Industries, Llc Backside illuminated global shutter pixel with active reset
JP6909747B2 (ja) * 2018-03-23 2021-07-28 株式会社東芝 固体撮像装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678364U (de) * 1979-11-14 1981-06-25
DE3856165T2 (de) 1987-01-29 1998-08-27 Canon Kk Photovoltaischer Wandler
US4959723A (en) 1987-11-06 1990-09-25 Canon Kabushiki Kaisha Solid state image pickup apparatus having multi-phase scanning pulse to read out accumulated signal
JPH04199968A (ja) 1990-11-29 1992-07-21 Toshiba Corp 固体撮像装置
US5406332A (en) 1992-03-06 1995-04-11 Canon Kabushiki Kaisha Photoelectric converting device
US5386108A (en) 1992-06-25 1995-01-31 Canon Kabushiki Kaisha Photoelectric conversion device for amplifying and outputting photoelectrically converted signal, and a method thereof
JPH06334920A (ja) * 1993-03-23 1994-12-02 Nippon Hoso Kyokai <Nhk> 固体撮像素子とその駆動方法
JPH0730084A (ja) 1993-07-14 1995-01-31 Fuji Xerox Co Ltd ２次元密着型イメージセンサ
JP3758205B2 (ja) * 1995-06-07 2006-03-22 ソニー株式会社 固体撮像装置及びこれを用いたビデオカメラ、並びにｘ‐ｙアドレス型固体撮像装置の駆動方法
EP0757475B1 (de) 1995-08-02 2004-01-21 Canon Kabushiki Kaisha Halbleiter-Bildaufnehmer mit gemeinsamer Ausgangsleistung
JP3031606B2 (ja) * 1995-08-02 2000-04-10 キヤノン株式会社 固体撮像装置と画像撮像装置
WO1997007630A1 (fr) * 1995-08-11 1997-02-27 Kabushiki Kaisha Toshiba Dispositif mos de prise d'image
US5831258A (en) * 1996-08-20 1998-11-03 Xerox Corporation Pixel circuit with integrated amplifer
US6002287A (en) 1997-05-08 1999-12-14 Canon Kabushiki Kaisha Signal outputting apparatus
US5898168A (en) * 1997-06-12 1999-04-27 International Business Machines Corporation Image sensor pixel circuit
JP3466886B2 (ja) * 1997-10-06 2003-11-17 キヤノン株式会社 固体撮像装置
JP4255527B2 (ja) 1997-10-20 2009-04-15 株式会社半導体エネルギー研究所 半導体装置
JP3571909B2 (ja) * 1998-03-19 2004-09-29 キヤノン株式会社 固体撮像装置及びその製造方法
US6054704A (en) * 1998-06-30 2000-04-25 Foveon, Inc. Driven capacitor storage pixel sensor and array
JP2000152086A (ja) 1998-11-11 2000-05-30 Canon Inc 撮像装置および撮像システム
US7081607B1 (en) 1999-10-05 2006-07-25 Canon Kabushiki Kaisha Solid state image pickup device and image pickup system

Also Published As

Publication number Publication date
EP1091409B1 (de) 2010-08-18
US7081607B1 (en) 2006-07-25
EP1091409A3 (de) 2006-10-18
EP1091409A2 (de) 2001-04-11
EP2244295A1 (de) 2010-10-27
EP2244295B1 (de) 2011-12-21

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