DE60033888D1 - Methode zum drahtbonden, halbleitervorrichtung und vorrichtung zum drahtbonden - Google Patents

Methode zum drahtbonden, halbleitervorrichtung und vorrichtung zum drahtbonden

Info

Publication number
DE60033888D1
DE60033888D1 DE60033888T DE60033888T DE60033888D1 DE 60033888 D1 DE60033888 D1 DE 60033888D1 DE 60033888 T DE60033888 T DE 60033888T DE 60033888 T DE60033888 T DE 60033888T DE 60033888 D1 DE60033888 D1 DE 60033888D1
Authority
DE
Germany
Prior art keywords
wire bonding
semiconductor device
semiconductor
wire
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60033888T
Other languages
English (en)
Inventor
Yugo Koyama
Kazunori Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE60033888D1 publication Critical patent/DE60033888D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE60033888T 1999-01-22 2000-01-19 Methode zum drahtbonden, halbleitervorrichtung und vorrichtung zum drahtbonden Expired - Lifetime DE60033888D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11013825A JP2000216188A (ja) 1999-01-22 1999-01-22 ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置
PCT/JP2000/000214 WO2000044040A1 (en) 1999-01-22 2000-01-19 Method of wire bonding, semiconductor device, circuit board, electronic device and wire bonder

Publications (1)

Publication Number Publication Date
DE60033888D1 true DE60033888D1 (de) 2007-04-26

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Application Number Title Priority Date Filing Date
DE60033888T Expired - Lifetime DE60033888D1 (de) 1999-01-22 2000-01-19 Methode zum drahtbonden, halbleitervorrichtung und vorrichtung zum drahtbonden

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US (1) US6437453B1 (de)
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JP2007073937A (ja) * 2005-08-12 2007-03-22 Kaijo Corp ボンディングワイヤのループ形状及びそのループ形状を備えた半導体装置並びにボンディング方法
JP5164490B2 (ja) 2007-09-13 2013-03-21 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
TW201125091A (en) * 2010-01-15 2011-07-16 de-bao Peng Method for detecting wiring location of wire rack.

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US6437453B1 (en) 2002-08-20
JP2000216188A (ja) 2000-08-04
EP1069608A4 (de) 2004-08-11
TW480633B (en) 2002-03-21
EP1069608B1 (de) 2007-03-14
WO2000044040A1 (en) 2000-07-27
KR100388728B1 (ko) 2003-06-25
KR20010092255A (ko) 2001-10-24
EP1069608A1 (de) 2001-01-17

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