TW280897B - - Google Patents

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Publication number
TW280897B
TW280897B TW084104596A TW84104596A TW280897B TW 280897 B TW280897 B TW 280897B TW 084104596 A TW084104596 A TW 084104596A TW 84104596 A TW84104596 A TW 84104596A TW 280897 B TW280897 B TW 280897B
Authority
TW
Taiwan
Application number
TW084104596A
Other languages
Chinese (zh)
Inventor
Murphy Philip
Frederick Walker George
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW280897B publication Critical patent/TW280897B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
    • G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
    • G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
    • G06K7/086—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive sensing passive circuit, e.g. resonant circuit transponders
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  • Engineering & Computer Science (AREA)
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TW084104596A 1994-10-27 1995-05-09 TW280897B (de)

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US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP2000216188A (ja) * 1999-01-22 2000-08-04 Seiko Epson Corp ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置
US6472747B2 (en) * 2001-03-02 2002-10-29 Qualcomm Incorporated Mixed analog and digital integrated circuits
US6732923B2 (en) * 2001-04-04 2004-05-11 Ncr Corporation Radio frequency identification system and method
US7692545B2 (en) * 2004-05-18 2010-04-06 Hitachi, Ltd. Wireless IC tag and process for manufacturing the same
US7295161B2 (en) 2004-08-06 2007-11-13 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR101038493B1 (ko) * 2004-11-12 2011-06-01 삼성테크윈 주식회사 극초단파용 라디오 주파수 인식태그 제조방법
US8026851B2 (en) 2005-03-25 2011-09-27 Toray Industries, Inc. Planar antenna and manufacturing method thereof
US7586193B2 (en) 2005-10-07 2009-09-08 Nhew R&D Pty Ltd Mm-wave antenna using conventional IC packaging
JP4316607B2 (ja) 2006-12-27 2009-08-19 株式会社東芝 アンテナ装置及び無線通信装置
WO2011083502A1 (ja) 2010-01-05 2011-07-14 株式会社 東芝 アンテナ及び無線装置
JP5172925B2 (ja) 2010-09-24 2013-03-27 株式会社東芝 無線装置
JP5417389B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
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JP6121705B2 (ja) 2012-12-12 2017-04-26 株式会社東芝 無線装置
WO2016100662A1 (en) * 2014-12-19 2016-06-23 Glo Ab Light emitting diode array on a backplane and method of making thereof

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NL9200396A (nl) * 1992-03-03 1993-10-01 Nedap Nv Radiofrequente identificatielabel met relatief grote detectie-afstand en een minimum aantal electronische componenten.
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)

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