DE60027970T2 - Verfahren zur Herstellung elektrischer Verbinder zur Verbesserung deren Koplanarität - Google Patents
Verfahren zur Herstellung elektrischer Verbinder zur Verbesserung deren Koplanarität Download PDFInfo
- Publication number
- DE60027970T2 DE60027970T2 DE60027970T DE60027970T DE60027970T2 DE 60027970 T2 DE60027970 T2 DE 60027970T2 DE 60027970 T DE60027970 T DE 60027970T DE 60027970 T DE60027970 T DE 60027970T DE 60027970 T2 DE60027970 T2 DE 60027970T2
- Authority
- DE
- Germany
- Prior art keywords
- arm
- contact
- punch
- ram
- extends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000005266 casting Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000012778 molding material Substances 0.000 description 2
- 241001295925 Gegenes Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
- Y10T29/53209—Terminal or connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG9904116A SG80641A1 (en) | 1999-08-30 | 1999-08-30 | Method for manufacturing electrical connectors for enhancing coplanarity |
| SG9904116 | 1999-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60027970D1 DE60027970D1 (de) | 2006-06-22 |
| DE60027970T2 true DE60027970T2 (de) | 2007-04-26 |
Family
ID=20430417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60027970T Expired - Fee Related DE60027970T2 (de) | 1999-08-30 | 2000-08-29 | Verfahren zur Herstellung elektrischer Verbinder zur Verbesserung deren Koplanarität |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7000317B1 (enExample) |
| EP (1) | EP1081811B1 (enExample) |
| JP (1) | JP4540196B2 (enExample) |
| AT (1) | ATE326782T1 (enExample) |
| DE (1) | DE60027970T2 (enExample) |
| SG (1) | SG80641A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013219861A1 (de) * | 2013-10-01 | 2015-04-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kontaktierungsverfahren |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4276526B2 (ja) * | 2003-11-26 | 2009-06-10 | 矢崎総業株式会社 | 電気接続箱や自動車の補機を制御する電子ユニットの構成部品とされるブスバー成形体及びその製造方法並びに電子ユニット |
| US7970699B1 (en) * | 2006-03-27 | 2011-06-28 | Loan Insights, Inc. | Customized consumer loan search and optimized loan pricing |
| DE102010046050A1 (de) | 2010-09-22 | 2012-03-22 | Tyco Electronics Amp Gmbh | Verfahren und Justagevorrichtung zum Ausrichten von Kontaktstiften eines elektrischen Bauteils sowie elektrisches Bauteil |
| TWM456013U (zh) * | 2012-07-27 | 2013-06-21 | Riidea Inc | 電源連接器端子之結構 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4231628A (en) | 1978-12-14 | 1980-11-04 | Amp Incorporated | Electrical connector receptacles |
| JPS5882786U (ja) | 1981-11-30 | 1983-06-04 | ソニー株式会社 | マルチコネクタ |
| US4710134A (en) | 1986-09-29 | 1987-12-01 | Amp Incorporated | Low insertion force chip carrier connector with movable housing |
| US4817283A (en) * | 1987-08-21 | 1989-04-04 | Amp Incorporated | Method of forming a modular plug coupler |
| JPH06701Y2 (ja) * | 1989-07-19 | 1994-01-05 | 建設省関東地方建設局長 | 堤防を越える排水管 |
| US5167528A (en) * | 1990-04-20 | 1992-12-01 | Matsushita Electric Works, Ltd. | Method of manufacturing an electrical connector |
| JPH0416881U (enExample) * | 1990-05-31 | 1992-02-12 | ||
| JPH04181676A (ja) * | 1990-11-15 | 1992-06-29 | Hirose Electric Co Ltd | 電気コネクタとその製作方法 |
| JPH0562743A (ja) | 1991-08-30 | 1993-03-12 | Fujitsu Ltd | 電子装置におけるモジユール用コネクタ構造 |
| US5483843A (en) * | 1992-06-01 | 1996-01-16 | Thermo Separation Products Inc. | Transport apparatus |
| TW370305U (en) * | 1996-04-09 | 1999-09-11 | Hon Hai Prec Ind Co Ltd | Mold for cartridge connectors |
| JP3339300B2 (ja) | 1996-04-23 | 2002-10-28 | 矢崎総業株式会社 | コネクタの製造方法 |
| US5902136A (en) * | 1996-06-28 | 1999-05-11 | Berg Technology, Inc. | Electrical connector for use in miniaturized, high density, and high pin count applications and method of manufacture |
| JPH10217253A (ja) * | 1997-02-07 | 1998-08-18 | Sankyo Kasei Co Ltd | インサート成形法並びにインサート成形装置 |
| JP3239308B2 (ja) * | 1997-03-13 | 2001-12-17 | 矢崎総業株式会社 | インサート成形品の製造方法 |
| JPH11185926A (ja) * | 1997-12-25 | 1999-07-09 | Yazaki Corp | コネクタ、コネクタの製造方法及びこの製造方法に用いられる型構造 |
| JP3405201B2 (ja) * | 1998-06-17 | 2003-05-12 | 住友電装株式会社 | 機器用コネクタの製造方法 |
-
1999
- 1999-08-30 SG SG9904116A patent/SG80641A1/en unknown
-
2000
- 2000-08-29 DE DE60027970T patent/DE60027970T2/de not_active Expired - Fee Related
- 2000-08-29 US US09/650,053 patent/US7000317B1/en not_active Expired - Fee Related
- 2000-08-29 EP EP00118149A patent/EP1081811B1/en not_active Expired - Lifetime
- 2000-08-29 AT AT00118149T patent/ATE326782T1/de not_active IP Right Cessation
- 2000-08-30 JP JP2000260916A patent/JP4540196B2/ja not_active Expired - Fee Related
-
2005
- 2005-11-17 US US11/281,789 patent/US8056225B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013219861A1 (de) * | 2013-10-01 | 2015-04-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kontaktierungsverfahren |
| DE102013219861B4 (de) * | 2013-10-01 | 2016-05-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kontaktierungsverfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE326782T1 (de) | 2006-06-15 |
| SG80641A1 (en) | 2001-05-22 |
| JP2001102147A (ja) | 2001-04-13 |
| US7000317B1 (en) | 2006-02-21 |
| EP1081811A2 (en) | 2001-03-07 |
| EP1081811A3 (en) | 2003-04-02 |
| US8056225B2 (en) | 2011-11-15 |
| EP1081811B1 (en) | 2006-05-17 |
| JP4540196B2 (ja) | 2010-09-08 |
| US20060075634A1 (en) | 2006-04-13 |
| DE60027970D1 (de) | 2006-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |