DE60027509D1 - Modul mit einer Hochfrequenzschaltung - Google Patents

Modul mit einer Hochfrequenzschaltung

Info

Publication number
DE60027509D1
DE60027509D1 DE60027509T DE60027509T DE60027509D1 DE 60027509 D1 DE60027509 D1 DE 60027509D1 DE 60027509 T DE60027509 T DE 60027509T DE 60027509 T DE60027509 T DE 60027509T DE 60027509 D1 DE60027509 D1 DE 60027509D1
Authority
DE
Germany
Prior art keywords
module
frequency circuit
frequency
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60027509T
Other languages
English (en)
Other versions
DE60027509T2 (de
Inventor
Hazime Kawano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18325099A external-priority patent/JP4154806B2/ja
Priority claimed from JP2000072943A external-priority patent/JP4211187B2/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE60027509D1 publication Critical patent/DE60027509D1/de
Application granted granted Critical
Publication of DE60027509T2 publication Critical patent/DE60027509T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
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    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
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    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
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    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Connection Structure (AREA)
  • Details Of Aerials (AREA)
DE60027509T 1999-06-29 2000-06-27 Modul mit einer Hochfrequenzschaltung Expired - Lifetime DE60027509T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP18325099A JP4154806B2 (ja) 1999-06-29 1999-06-29 高周波モジュール
JP18325099 1999-06-29
JP2000072943 2000-03-15
JP2000072943A JP4211187B2 (ja) 2000-03-15 2000-03-15 マイクロ波モジュール

Publications (2)

Publication Number Publication Date
DE60027509D1 true DE60027509D1 (de) 2006-06-01
DE60027509T2 DE60027509T2 (de) 2007-05-10

Family

ID=26501767

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027509T Expired - Lifetime DE60027509T2 (de) 1999-06-29 2000-06-27 Modul mit einer Hochfrequenzschaltung

Country Status (3)

Country Link
US (1) US6597902B1 (de)
EP (2) EP1069639B1 (de)
DE (1) DE60027509T2 (de)

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JP3662219B2 (ja) * 2001-12-27 2005-06-22 三菱電機株式会社 積層高周波モジュール
US7131867B1 (en) 2005-05-06 2006-11-07 Pacific Aerospace & Electronics, Inc. RF connectors having ground springs
WO2008042478A2 (en) * 2006-06-09 2008-04-10 Massachusetts Institute Of Technology Wide band and radio frequency waveguide and hybrid integration in a silicon package
US7889147B2 (en) * 2007-02-23 2011-02-15 Northrop Grumman Systems Corporation Modular active phased array
US8706049B2 (en) * 2008-12-31 2014-04-22 Intel Corporation Platform integrated phased array transmit/receive module
CN106535497B (zh) * 2016-11-04 2019-04-30 安徽华东光电产业研究院有限公司 一种t/r接收前端模块加工方法
US10037951B2 (en) * 2016-11-29 2018-07-31 Cyntec Co., Ltd. Semiconductor package with antenna
KR102423296B1 (ko) * 2017-09-14 2022-07-21 삼성전자주식회사 Pcb를 포함하는 전자 장치
CN110991137A (zh) * 2019-12-19 2020-04-10 西安电子工程研究所 一种三维射频电路设计方法

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EP1484815A1 (de) 2004-12-08
DE60027509T2 (de) 2007-05-10
US6597902B1 (en) 2003-07-22
EP1069639A2 (de) 2001-01-17
EP1069639A3 (de) 2002-05-22

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