DE60024375D1 - Bauteilen-bestückungsverfahren und Einrichtung - Google Patents

Bauteilen-bestückungsverfahren und Einrichtung

Info

Publication number
DE60024375D1
DE60024375D1 DE60024375T DE60024375T DE60024375D1 DE 60024375 D1 DE60024375 D1 DE 60024375D1 DE 60024375 T DE60024375 T DE 60024375T DE 60024375 T DE60024375 T DE 60024375T DE 60024375 D1 DE60024375 D1 DE 60024375D1
Authority
DE
Germany
Prior art keywords
equipment
component mounting
mounting procedures
procedures
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60024375T
Other languages
English (en)
Other versions
DE60024375T2 (de
Inventor
Ken Takano
Muneyoshi Fujiwara
Seiichi Mogi
Kurayasu Hamasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60024375D1 publication Critical patent/DE60024375D1/de
Application granted granted Critical
Publication of DE60024375T2 publication Critical patent/DE60024375T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y10T29/53209—Terminal or connector
    • Y10T29/53213—Assembled to wire-type conductor
    • Y10T29/53222—Means comprising hand-manipulatable implement
    • Y10T29/5323—Fastening by elastic joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60024375T 1999-09-03 2000-09-01 Bauteilen-bestückungsverfahren und Einrichtung Expired - Lifetime DE60024375T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24941199 1999-09-03

Publications (2)

Publication Number Publication Date
DE60024375D1 true DE60024375D1 (de) 2006-01-05
DE60024375T2 DE60024375T2 (de) 2006-06-14

Family

ID=17192585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60024375T Expired - Lifetime DE60024375T2 (de) 1999-09-03 2000-09-01 Bauteilen-bestückungsverfahren und Einrichtung

Country Status (3)

Country Link
US (2) US6729018B1 (de)
EP (1) EP1081998B1 (de)
DE (1) DE60024375T2 (de)

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EP1081998B1 (de) 1999-09-03 2005-11-30 Matsushita Electric Industrial Co., Ltd. Bauteilen-bestückungsverfahren und Einrichtung
US6996440B2 (en) * 2000-08-04 2006-02-07 Matsushita Electric Industrial Co., Ltd. Method for optimization of an order of component mounting, apparatus using the same, and mounter
JP3589658B2 (ja) * 2001-09-28 2004-11-17 松下電器産業株式会社 最適化装置、装着装置及び電子部品装着システム
JP4384439B2 (ja) * 2002-11-21 2009-12-16 富士機械製造株式会社 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
EP1661076A2 (de) * 2003-09-01 2006-05-31 Matsushita Electric Industrial Co., Ltd. Verfahren und vorrichtung zur optimierung der reihenfolge der komponentenanbringung und vorrichtung zur optimierung einer reihenfolge zur komponentenanbringung
CN100471381C (zh) * 2004-05-17 2009-03-18 株式会社村田制作所 组件安装装置和组件定位单元
JP2006013448A (ja) * 2004-05-21 2006-01-12 Matsushita Electric Ind Co Ltd ラインバランス制御方法、ラインバランス制御装置、および部品実装機
WO2006059731A1 (ja) * 2004-12-03 2006-06-08 Hallys Corporation 電子部品の製造方法、及び電子部品の製造装置
JP4091096B2 (ja) * 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
EP1827073A1 (de) * 2004-12-15 2007-08-29 Matsushita Electric Industrial Co., Ltd. Aktionszeit-verkürzungsverfahren, aktionszeit-verkürzungseinrichtung, programm und teileanbringmaschine
WO2006109678A1 (ja) 2005-04-06 2006-10-19 Hallys Corporation 電子部品の製造装置
CN101160597A (zh) * 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
JP4695954B2 (ja) * 2005-09-30 2011-06-08 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
KR101228315B1 (ko) * 2005-11-10 2013-01-31 삼성테크윈 주식회사 부품 실장기용 헤드 어셈블리
CN101379896B (zh) * 2006-02-09 2011-11-23 松下电器产业株式会社 确定元件拾取次序的方法
DE102006030292A1 (de) * 2006-06-30 2008-01-03 Siemens Ag Klassifizierung von aufgenommenen Bauelementen bei der Bestückung von Bauelementeträgern
JP5070832B2 (ja) * 2006-12-22 2012-11-14 株式会社ナカヨ通信機 センサー起動型電話システム
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
JP5721071B2 (ja) * 2011-03-31 2015-05-20 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置及び基板製造方法
US9844170B2 (en) * 2012-02-28 2017-12-12 Fuji Machine Mfg. Co., Ltd. Component mounting machine
US10143119B2 (en) * 2013-06-03 2018-11-27 Fuji Corporation Nozzle management system
EP3125665B1 (de) * 2014-03-28 2020-03-11 FUJI Corporation Komponentenmontagevorrichtung
JP6348748B2 (ja) 2014-03-31 2018-06-27 ヤマハ発動機株式会社 電子部品装着装置
US9435685B2 (en) * 2014-10-03 2016-09-06 Hanwha Techwin Co., Ltd. Part holding head assembly for chip mounting device
JP6522644B2 (ja) * 2014-11-11 2019-05-29 株式会社Ｆｕｊｉ 電子部品装着機の制御装置及びその制御装置へのデータ入力装置
US11219149B2 (en) * 2015-02-12 2022-01-04 Fuji Corporation Component supply device
US10712729B2 (en) 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
WO2016194030A1 (ja) * 2015-05-29 2016-12-08 富士機械製造株式会社 最適化プログラム、および装着作業機
US10709049B2 (en) * 2015-07-08 2020-07-07 Fuji Corporation Component mounting machine and component mounting line
WO2018058748A1 (zh) * 2016-09-30 2018-04-05 厦门市三安光电科技有限公司 用于微元件的转移的转置头及微元件的转移方法

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EP1081998B1 (de) * 1999-09-03 2005-11-30 Matsushita Electric Industrial Co., Ltd. Bauteilen-bestückungsverfahren und Einrichtung
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JP2001237596A (ja) * 2000-02-24 2001-08-31 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Also Published As

Publication number Publication date
US6729018B1 (en) 2004-05-04
US20040168310A1 (en) 2004-09-02
EP1081998B1 (de) 2005-11-30
US7296344B2 (en) 2007-11-20
EP1081998A2 (de) 2001-03-07
EP1081998A3 (de) 2002-04-03
DE60024375T2 (de) 2006-06-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)