DE60022480D1 - Kupferplattierungsverfahren - Google Patents
KupferplattierungsverfahrenInfo
- Publication number
- DE60022480D1 DE60022480D1 DE60022480T DE60022480T DE60022480D1 DE 60022480 D1 DE60022480 D1 DE 60022480D1 DE 60022480 T DE60022480 T DE 60022480T DE 60022480 T DE60022480 T DE 60022480T DE 60022480 D1 DE60022480 D1 DE 60022480D1
- Authority
- DE
- Germany
- Prior art keywords
- copper plating
- plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11019795A JP3124523B2 (ja) | 1999-01-28 | 1999-01-28 | 銅メッキ方法 |
EP00303672A EP1152071B1 (de) | 1999-01-28 | 2000-05-02 | Kupferplattierungsverfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60022480D1 true DE60022480D1 (de) | 2005-10-13 |
DE60022480T2 DE60022480T2 (de) | 2006-03-16 |
Family
ID=37685107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60022480T Expired - Lifetime DE60022480T2 (de) | 1999-01-28 | 2000-05-02 | Kupferplattierungsverfahren |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1152071B1 (de) |
JP (1) | JP3124523B2 (de) |
DE (1) | DE60022480T2 (de) |
TW (1) | TW527446B (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3498306B2 (ja) * | 1999-09-16 | 2004-02-16 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
JP3594894B2 (ja) | 2000-02-01 | 2004-12-02 | 新光電気工業株式会社 | ビアフィリングめっき方法 |
JP2001316866A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | 半導体装置の製造方法および製造装置 |
JP4762423B2 (ja) * | 2001-03-05 | 2011-08-31 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
US6863795B2 (en) * | 2001-03-23 | 2005-03-08 | Interuniversitair Microelektronica Centrum (Imec) | Multi-step method for metal deposition |
US6784104B2 (en) * | 2001-07-27 | 2004-08-31 | Texas Instruments Incorporated | Method for improved cu electroplating in integrated circuit fabrication |
JP2003041393A (ja) * | 2001-07-30 | 2003-02-13 | Atotech Japan Kk | 銅メッキ方法 |
JP2005036285A (ja) | 2003-07-15 | 2005-02-10 | Tokyo Electron Ltd | 無電解メッキ用前処理液及び無電解メッキ方法 |
US7282602B2 (en) * | 2004-09-21 | 2007-10-16 | Bionumerik Pharmaceuticals, Inc. | Medicinal disulfide salts |
JP4862508B2 (ja) * | 2006-06-12 | 2012-01-25 | 日立電線株式会社 | 導体パターン形成方法 |
JP5864161B2 (ja) * | 2011-08-23 | 2016-02-17 | 石原ケミカル株式会社 | 銅フィリング方法及び当該方法を適用した電子部品の製造方法 |
US20140262801A1 (en) * | 2013-03-14 | 2014-09-18 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
US9598787B2 (en) | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
US10508357B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
US10512174B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
JP7215211B2 (ja) * | 2019-02-21 | 2023-01-31 | 住友金属鉱山株式会社 | 銅張積層板の製造方法 |
KR20210062369A (ko) * | 2019-11-21 | 2021-05-31 | 에스케이넥실리스 주식회사 | 찢김 또는 주름 불량을 방지할 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
CN114411214B (zh) * | 2022-01-27 | 2023-05-05 | 四会富仕电子科技股份有限公司 | 一种铜基板电镀铜的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE962489C (de) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln |
KR100665745B1 (ko) * | 1999-01-26 | 2007-01-09 | 가부시키가이샤 에바라 세이사꾸쇼 | 구리도금방법 및 그 장치 |
-
1999
- 1999-01-28 JP JP11019795A patent/JP3124523B2/ja not_active Expired - Lifetime
-
2000
- 2000-04-26 TW TW089107822A patent/TW527446B/zh not_active IP Right Cessation
- 2000-05-02 EP EP00303672A patent/EP1152071B1/de not_active Expired - Lifetime
- 2000-05-02 DE DE60022480T patent/DE60022480T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60022480T2 (de) | 2006-03-16 |
EP1152071B1 (de) | 2005-09-07 |
JP3124523B2 (ja) | 2001-01-15 |
EP1152071A1 (de) | 2001-11-07 |
JP2000219994A (ja) | 2000-08-08 |
TW527446B (en) | 2003-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |