DE60042276D1 - Stromloses plattierungsverfahren - Google Patents

Stromloses plattierungsverfahren

Info

Publication number
DE60042276D1
DE60042276D1 DE60042276T DE60042276T DE60042276D1 DE 60042276 D1 DE60042276 D1 DE 60042276D1 DE 60042276 T DE60042276 T DE 60042276T DE 60042276 T DE60042276 T DE 60042276T DE 60042276 D1 DE60042276 D1 DE 60042276D1
Authority
DE
Germany
Prior art keywords
plating process
low plating
low
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60042276T
Other languages
English (en)
Inventor
Tetsuhiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd filed Critical Citizen Holdings Co Ltd
Application granted granted Critical
Publication of DE60042276D1 publication Critical patent/DE60042276D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
DE60042276T 1999-09-27 2000-09-22 Stromloses plattierungsverfahren Expired - Lifetime DE60042276D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27261099 1999-09-27
JP2000052762 2000-02-29
PCT/JP2000/006504 WO2001023637A1 (fr) 1999-09-27 2000-09-22 Procede de depot autocatalytique

Publications (1)

Publication Number Publication Date
DE60042276D1 true DE60042276D1 (de) 2009-07-09

Family

ID=26550288

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60042276T Expired - Lifetime DE60042276D1 (de) 1999-09-27 2000-09-22 Stromloses plattierungsverfahren

Country Status (9)

Country Link
US (1) US6841476B1 (de)
EP (1) EP1227173B9 (de)
JP (1) JP4498652B2 (de)
KR (1) KR100468661B1 (de)
CN (1) CN100335679C (de)
AU (1) AU7319900A (de)
DE (1) DE60042276D1 (de)
RU (1) RU2225460C2 (de)
WO (1) WO2001023637A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6977515B2 (en) * 2001-09-20 2005-12-20 Wentworth Laboratories, Inc. Method for forming photo-defined micro electrical contacts
EP1331674A1 (de) * 2002-01-24 2003-07-30 PX Tech S.A. Thermoelektrischer Minikonverter mit hoher Integration
US7052922B2 (en) * 2003-07-21 2006-05-30 Micron Technology, Inc. Stable electroless fine pitch interconnect plating
CN100407466C (zh) * 2005-07-12 2008-07-30 北京科技大学 一种纳-微米多孔硅系列热电材料的制备方法
DE102006017547B4 (de) * 2006-04-13 2012-10-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermoelektrisches Bauelement sowie Herstellverfahren hierfür
KR100971463B1 (ko) * 2008-06-02 2010-07-22 주식회사 푸름 철도 차량용 제동저항기
JP5360072B2 (ja) * 2008-12-26 2013-12-04 富士通株式会社 熱電変換素子の製造方法
RU2443037C1 (ru) * 2010-07-29 2012-02-20 Негосударственное образовательное учреждение высшего профессионального образования "Российский новый университет" (НОУ ВПО "РосНОУ") Технология получения металлических нанослоев химическим способом на серебряных электрических контактах кремниевых солнечных элементов
KR101005565B1 (ko) * 2010-10-21 2011-01-05 양미경 경량화 제동저항 어셈블리
KR20130033865A (ko) * 2011-09-27 2013-04-04 삼성전기주식회사 열전모듈 및 열전모듈 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521486A1 (de) 1965-12-24 1969-08-21 Siemens Ag Verfahren zur reduktiven Metallabscheidung
JPS50147437A (de) * 1974-05-20 1975-11-26
JPS5953667A (ja) * 1982-09-20 1984-03-28 Pentel Kk 無電解めつき法
JPS6293391A (ja) 1985-10-18 1987-04-28 Nec Corp めつき方法
US5462897A (en) 1993-02-01 1995-10-31 International Business Machines Corporation Method for forming a thin film layer
JPH07145485A (ja) 1993-11-25 1995-06-06 Fuji Elelctrochem Co Ltd フェライトの表面に電極膜を部分的に形成する方法
JP2878118B2 (ja) 1994-06-13 1999-04-05 三菱電機株式会社 チタン表面への銅被覆方法
DE59503637D1 (de) * 1994-10-18 1998-10-22 Atotech Deutschland Gmbh Verfahren zur abscheidung von metallschichten
WO1998022984A1 (fr) 1996-11-15 1998-05-28 Citizen Watch Co., Ltd. Procede de fabrication d'un element thermoionique
JP4207234B2 (ja) 1997-12-19 2009-01-14 アイシン精機株式会社 熱電半導体の無電解メッキ方法
JP3486864B2 (ja) * 1999-09-13 2004-01-13 株式会社トッパン エヌイーシー・サーキット ソリューションズ 富山 基板上の銅配線形成方法及び銅配線の形成された基板

Also Published As

Publication number Publication date
KR20020040819A (ko) 2002-05-30
CN1375017A (zh) 2002-10-16
EP1227173A1 (de) 2002-07-31
EP1227173B1 (de) 2009-05-27
JP4498652B2 (ja) 2010-07-07
EP1227173A4 (de) 2003-03-12
AU7319900A (en) 2001-04-30
CN100335679C (zh) 2007-09-05
WO2001023637A1 (fr) 2001-04-05
RU2225460C2 (ru) 2004-03-10
KR100468661B1 (ko) 2005-01-29
US6841476B1 (en) 2005-01-11
EP1227173B9 (de) 2009-11-11

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Legal Events

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8364 No opposition during term of opposition